Filler composition and application thereof

A technology of composition and resin composition, which is applied in the field of laminates, can solve the problems of high production cost, high cost of spherical silica powder, narrow application range, etc., and achieve the effect of increasing fluidity

Active Publication Date: 2015-04-29
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this method is limited to spherical silica below 5 μm, its use range is narrow, and the cost of spherical silica powder is high
[0004] Aiming at the problem of the above-mentioned narrow use range of spherical silica, there are currently some relevant literatures that use the compounding of two or more fillers with different particle sizes to expand the use range. Chinese patent CN101696317A uses spherical silica with different particle sizes Silica powder with a median particle size of 5-20 μm is obtained by preparing silica powder. However, the production cost is still high due to the expensive spherical silica powder used.

Method used

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  • Filler composition and application thereof
  • Filler composition and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1-6

[0046] Angular silica with different particle size distributions was prepared, and the particle size distribution, specific surface area and peak number of particle size distribution are shown in Table 1. Use vinyl silane coupling agent (Shin-Etsu Chemical, product name KBM1003) to carry out surface treatment to angular silica (self-preparation) of different particle size distribution, the consumption of this surface treatment agent is 1% of siliceous micropowder filler weight , and then add butanone solution, and prepare a filler composition with a solid content of 70% after high-speed grinding.

[0047] The following test methods were used to test and evaluate the fluidity, viscosity and stability of the obtained filler composition, and the results are shown in Table 1.

Embodiment 7-12

[0058] With 100 parts by weight of brominated bisphenol A type epoxy resin (Dow Chemical, epoxy equivalent 435, bromine content 19%, product name DER530), 24 parts by weight of novolak resin (Japan Qunrong, hydroxyl equivalent 105, product name TD2090), 0.05 parts by weight of 2-methylimidazole, respectively added to the self-made filler composition in Examples 1-6, placed in a methyl ethyl ketone solvent, mechanically stirred, emulsified, and the filler content of Example 7-12 is 30wt % (based on resin), glue with a solid content of 65wt%, then impregnated with glass fiber cloth, heated and dried to form a prepreg, placed copper foil on both sides, pressurized and heated to form a copper clad laminate.

[0059] The following test methods were used to test and evaluate the coefficient of thermal expansion (CTE), interlayer adhesion and dispersion of the obtained copper-clad laminate, and the results are shown in Table 3.

Embodiment 13

[0061] With 100 parts by weight of brominated bisphenol A type epoxy resin (Dow Chemical, epoxy equivalent 435, bromine content 19%, product name DER530), 24 parts by weight of novolak resin (Japan Qunrong, hydroxyl equivalent 105, product name TD2090), 0.05 parts by weight of 2-methylimidazole, adding the self-made filler composition in Example 2, placing in a methyl ethyl ketone solvent, mechanical stirring, emulsification and being formulated so that the filler content is 50wt% (based on resin), and the solid content is 65wt% glue, impregnated with glass fiber cloth, heated and dried to form a prepreg, placed copper foil on both sides, pressurized and heated to form a copper clad laminate.

[0062] The following test methods were used to test and evaluate the coefficient of thermal expansion (CTE), interlayer adhesion and dispersion of the obtained copper-clad laminate, and the results are shown in Table 3.

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Abstract

The invention relates to a filler composition and application thereof. The filler composition comprises an angular siliceous micro powder filler, and can be used for preparing a copper clad laminate substrate and bonding sheet resin composition. The filler composition is formed by an angular silicon dioxide with the specific particle size distribution or the mixture of at least two angular silicon dioxides with different particle sizes and the specific particle size distribution, the flowability of the composition and the sedimentary stability in a solution or resin system can be improved, the coefficient of thermal expansion is reduced remarkably, the bonding interface between resin and an inorganic filler, the interlayer adhesiveness between laminates and the adhesive force between a resin layer and a copper foil are improved, and the production cost is reduced greatly.

Description

technical field [0001] The invention relates to the technical field of laminated boards, in particular to a filler composition, in particular to a filler composition for a printed circuit board and a prepreg made thereof, a laminated board and a printed circuit board. Background technique [0002] Under the ever-changing trend of electronic technology, integrated circuits are developing rapidly in the direction of ultra-large-scale, ultra-high-speed, high-density, high-power, high-precision, and multi-functional. Therefore, the requirements for copper clad laminates are also getting higher and higher; Among them, The requirements for the heat resistance and expansion rate of the sheet are particularly prominent. In order to improve the heat resistance of the board and reduce its expansion coefficient, the most effective method is to add as much filler as possible to the glue formula, such as silicon dioxide. However, when a large amount of fillers are used, especially micro...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08K9/06C08K9/04C08K7/26C08K7/00C08K3/36C08L63/00C08L23/00B32B15/085B32B15/092B32B15/20B32B27/04B32B27/20
Inventor 杜翠鸣柴颂刚邢燕侠郝良鹏陈文欣
Owner GUANGDONG SHENGYI SCI TECH
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