Halogen-free flame-retardant solvent-free double-curing ink composition and preparation method thereof

An ink composition, dual-curing technology, applied in inks, household appliances, applications, etc., can solve problems such as non-compliance with the requirements for flame retardant use of electronic materials, increased thermal expansion coefficient of ink cured products, and reduced thermal deformation temperature of ink cured products. , to achieve the effect of ensuring thermal stability, reducing viscosity, and reducing fire hazards
CN102732096AActive Publication Date: 2012-10-17ELEK & ELTEK ELECTRONICS KUNSHAN
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
ELEK & ELTEK ELECTRONICS KUNSHAN
Publication Date
2012-10-17

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Abstract

The invention relates to electronic materials and preparation, and aims to provide a halogen-free flame-retardant solvent-free double-curing ink composition and a preparation method thereof. The composition comprises the following components: low-viscosity epoxy resin, epoxy resin containing phosphorus or nitrogen, glycidyl acrylate reactive diluent, partially-esterified phenolic epoxy acrylate, imidazole curing agent, free radical polymerizing initiator, halogen-free flame retardant, inorganic filler and additives. The preparation method comprises the following steps of: mixing, dispersing and grinding the raw materials until the viscosity reaches 40 to 50 Pa.s per 25 DEG C, dispersing and uniformly agitating the raw materials after the grinding is stopped, and finally filtering, filling and packaging the raw materials. The halogen-free flame-retardant solvent-free double-curing ink composition has the advantages that the possibility of fire hazards caused by ink introduction when a hole is blocked can be reduced by virtue of halogen-free and flame-retardant performance; with adoption of a double-curing technology with free radical polymerizing and epoxide ring-opening addition polymerization, the halogen-free flame-retardant solvent-free double-curing ink composition has a high curing degree, a high temperature in thermal deformation, a low expansion coefficient, low water absorption and high heat resistance; the viscosity of the ink is easy to adjust, and thus the requirements on the use of the ink in different seasons can be ensured; and the curing material is moderate in rigidity and has the characteristic of grindability.
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Description

technical field

[0001] The invention belongs to the field of electronic materials, and relates to a halogen-free, flame-retardant, solvent-free, dual-curing ink composition used in the HDI printed circuit board buried hole process and a preparation method thereof. Background technique

[0002] With the development of electronic products in the direction of "light, thin, short, small" and multi-functionality, especially the high integration of semiconductor chips and the rapid increase in the number of I / O (input / output), the rapid development of high-density mounting technology With the progress, it is urgent to install the substrate - printed circuit board (PCB) to become an electronic component with high density, high precision, high reliability and low cost requirements, which can greatly increase the assembly density. Therefore, new PCB products that apply the build-up method and can have high-density interconnection (high density interconnection, HDI) have become the ma...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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