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Halogen-free flame-retardant solvent-free double-curing ink composition and preparation method thereof

An ink composition, dual-curing technology, applied in inks, household appliances, applications, etc., can solve problems such as non-compliance with the requirements for flame retardant use of electronic materials, increased thermal expansion coefficient of ink cured products, and reduced thermal deformation temperature of ink cured products. , to achieve the effect of ensuring thermal stability, reducing viscosity, and reducing fire hazards

Active Publication Date: 2012-10-17
ELEK & ELTEK ELECTRONICS KUNSHAN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there are still many problems with the existing commercial solvent-free plugging inks: 1. They are all non-flame retardant systems, which do not meet the requirements for flame retardant use of electronic materials; most of the printed circuit boards currently use flame retardant FR- 4 plates, and most of the plugging inks currently available in the market are non-flame retardant in order to meet the halogen-free requirements
The introduction of non-flame retardant plugging ink increases the fire safety hazard of circuit boards
2. The viscosity of the ink is high, which is not conducive to screen printing plugging; 3. In order to reduce the viscosity, a certain amount of reactive diluent is added, and due to the introduction of the reactive diluent, the thermal deformation temperature of the cured ink is greatly reduced, so that the ink is cured The thermal expansion coefficient of the ink increases, and it is easy to cause the explosion phenomenon in the subsequent pressing and lead-free soldering process; 4. The existing system is a single curing system, and the way to control the performance of the cured ink is single

Method used

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  • Halogen-free flame-retardant solvent-free double-curing ink composition and preparation method thereof
  • Halogen-free flame-retardant solvent-free double-curing ink composition and preparation method thereof
  • Halogen-free flame-retardant solvent-free double-curing ink composition and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] Example 1: Accurately weigh 24g of low-viscosity bisphenol A glycidyl ether, 26g of low-viscosity bisphenol F-type glycidyl ether, 10g of allyl glycidyl ether, 10g of low-viscosity hydantoin epoxy resin, and phosphatized bisphenol A Epoxy resin 10g, glycidyl methacrylate 10g, partially methacrylated (esterification rate 20%) phenol novolac epoxy resin 10g, 2-11 alkyl imidazole (C11Z) 4.7g, diphenyl peroxide Acyl (BPO) 0.34g, aluminum hydroxide 40g, magnesium hydroxide 20g, calcium carbonate 40g, defoamer 1g, after the above materials are uniformly dispersed in the pre-disperser, transferred to the three-roll mill for grinding, after 17 grinding Finally, test the viscosity of the ink to meet the index requirements, stop the grinding, then stir evenly in the disperser, filter to remove the coarser powder particles, and fill it to obtain a uniform and fine ink product. The product performance is shown in Table 1.

Embodiment 2

[0032] Accurately weigh 20g of low-viscosity bisphenol A glycidyl ether, 15g of low-viscosity bisphenol F glycidyl ether, 10g of low-viscosity allyl glycidyl ether, 10g of hydantoin epoxy resin, phosphating novolak epoxy resin (P%= 2.5%) 10g, glycidyl methacrylate 15g, partially methacrylated (esterification rate 38%) o-cresol novolac epoxy resin 20g, 1-nitrile ethyl-2-ethyl-4-methyl Imidazole (2E4MZ-CN) 6.2g, dibenzoyl peroxide (BPO) 0.32g, aluminum hydroxide 30g, calcium carbonate 50g, phenoxypolyphosphazene (SPB) 20g, defoamer 1g, put the above materials in After uniform dispersion in the pre-disperser, transfer to a three-roll mill for grinding. After 19 grindings, test the viscosity of the ink and meet the index requirements. Stop grinding, then stir evenly in the disperser, filter to remove coarse powder particles, pour Packed to get uniform and delicate ink products. The product performance is shown in Table 1.

Embodiment 3

[0034] Accurately weigh 20g of low-viscosity bisphenol A glycidyl ether, 15g of low-viscosity bisphenol F glycidyl ether, 5g of allyl glycidyl ether, 20g of low-viscosity hydantoin epoxy resin, phosphating phenol novolac epoxy resin (P% =2.8%) 20g, glycidyl methacrylate 10g, partially methacrylated (esterification rate 27%) bisphenol A novolak epoxy resin 10g, 2,4-diamino-6-[2'- Methylimidazolyl-(1')]-ethyl-s-triazine (2MZ-A) 5.8g, azobisisobutylcyanide (AIBN) 0.45g, aluminum hydroxide 30g, calcium carbonate 60g, melamine polyphosphate Salt (MPP) 10g, defoamer 1.2g, after the above materials are uniformly dispersed in the pre-disperser, transfer to the three-roll mill for grinding, after 16 grinding, test the viscosity of the ink, and stop the grinding, and then Stir evenly in a disperser, filter to remove coarse powder particles, and fill to obtain a uniform and fine ink product. The product performance is shown in Table 1.

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Abstract

The invention relates to electronic materials and preparation, and aims to provide a halogen-free flame-retardant solvent-free double-curing ink composition and a preparation method thereof. The composition comprises the following components: low-viscosity epoxy resin, epoxy resin containing phosphorus or nitrogen, glycidyl acrylate reactive diluent, partially-esterified phenolic epoxy acrylate, imidazole curing agent, free radical polymerizing initiator, halogen-free flame retardant, inorganic filler and additives. The preparation method comprises the following steps of: mixing, dispersing and grinding the raw materials until the viscosity reaches 40 to 50 Pa.s per 25 DEG C, dispersing and uniformly agitating the raw materials after the grinding is stopped, and finally filtering, filling and packaging the raw materials. The halogen-free flame-retardant solvent-free double-curing ink composition has the advantages that the possibility of fire hazards caused by ink introduction when a hole is blocked can be reduced by virtue of halogen-free and flame-retardant performance; with adoption of a double-curing technology with free radical polymerizing and epoxide ring-opening addition polymerization, the halogen-free flame-retardant solvent-free double-curing ink composition has a high curing degree, a high temperature in thermal deformation, a low expansion coefficient, low water absorption and high heat resistance; the viscosity of the ink is easy to adjust, and thus the requirements on the use of the ink in different seasons can be ensured; and the curing material is moderate in rigidity and has the characteristic of grindability.

Description

technical field [0001] The invention belongs to the field of electronic materials, and relates to a halogen-free, flame-retardant, solvent-free, dual-curing ink composition used in the HDI printed circuit board buried hole process and a preparation method thereof. Background technique [0002] With the development of electronic products in the direction of "light, thin, short, small" and multi-functionality, especially the high integration of semiconductor chips and the rapid increase in the number of I / O (input / output), the rapid development of high-density mounting technology With the progress, it is urgent to install the substrate - printed circuit board (PCB) to become an electronic component with high density, high precision, high reliability and low cost requirements, which can greatly increase the assembly density. Therefore, new PCB products that apply the build-up method and can have high-density interconnection (high density interconnection, HDI) have become the ma...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D11/10C09D11/102
Inventor 张兴宏闵玉勤杨帆
Owner ELEK & ELTEK ELECTRONICS KUNSHAN
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