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Filler compound and copper clad laminate made of same

A technology of copper-clad laminates and compositions, which is applied in the field of copper-clad laminates, can solve the problems of narrow use range and no fluidity of resin composites, and solve the problem of dispersion, wide use range, and reduce expansion The effect of the coefficient

Inactive Publication Date: 2011-10-12
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the patent restricts the type and particle size of the filler (spherical silica below 5um), and its use range is narrow, and there is no proposed combination of filler particle size to improve the fluidity of the resin compound.

Method used

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  • Filler compound and copper clad laminate made of same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] (1) Use silane coupling agent (Shin-Etsu Chemical, product name KBM403) with epoxy group to 20 parts by weight spherical silica (Toyota Tsusho, SOC2, D50=0.5um) and 80 parts by weight spherical silica (Tongda Wei Peng Electric Co., Ltd., D50=3um) for surface treatment, the amount of treatment agent is 5% of the total weight of spherical silica, then add butanone solution, after high-speed grinding, prepare a filler composition with a solid content of 70% .

[0028] (2) 100 parts by weight of brominated bisphenol A type epoxy resin (Dow Chemical, epoxy equivalent 435, bromine content 19%, product name DER530), 24 parts by weight of novolak resin (Nippon Qunrong, hydroxyl equivalent 105, product name TD2090), 0.05 parts by weight 2-methylimidazole, the filler composition prepared by 100 parts by weight, be dissolved in ethylene glycol monobutyl ether solvent, be mixed with the glue of 70wt%, impregnate glass fiber cloth then, pass through After heating and drying, a prep...

Embodiment 2

[0030] (1) Use silane coupling agent (Shin-Etsu Chemical, product name KBM403) with epoxy group to 30 parts by weight spherical silica (Toyota Tsusho, SOC2, D50=0.5um) and 70 parts by weight spherical silica (Tongda Wei Peng Electric Co., Ltd., D50=3um) for surface treatment, the amount of treatment agent is 5% of the total weight of spherical silica, then add butanone solution, after high-speed grinding, prepare a filler composition with a solid content of 70% .

[0031] (2) 100 parts by weight of brominated bisphenol A type epoxy resin (Dow Chemical, epoxy equivalent 435, bromine content 19%, product name DER530), 24 parts by weight of novolak resin (Nippon Qunrong, hydroxyl equivalent 105, product name TD2090), 0.05 parts by weight 2-methylimidazole, the filler composition prepared by 100 parts by weight, be dissolved in ethylene glycol monobutyl ether solvent, be mixed with the glue of 70wt%, impregnate glass fiber cloth then, pass through After heating and drying, a prep...

Embodiment 3

[0033](1) Use silane coupling agent (Shin-Etsu Chemical, product name KBM403) with epoxy group to 40 parts by weight spherical silica (Toyota Tsusho, SOC2, D50=0.5um) and 60 parts by weight spherical silica (Tongda Wei Peng Electric Co., Ltd., D50=3um) for surface treatment, the amount of treatment agent is 5% of the total weight of spherical silica, then add butanone solution, after high-speed grinding, prepare a filler composition with a solid content of 70% .

[0034] (2) 100 parts by weight of brominated bisphenol A type epoxy resin (Dow Chemical, epoxy equivalent 435, bromine content 19%, product name DER530), 24 parts by weight of novolak resin (Nippon Qunrong, hydroxyl equivalent 105, product name TD2090), 0.05 parts by weight 2-methylimidazole, the filler composition prepared by 100 parts by weight, be dissolved in ethylene glycol monobutyl ether solvent, be mixed with the glue of 70wt%, impregnate glass fiber cloth then, pass through After heating and drying, a prepr...

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Abstract

The invention relates to a filler compound and a copper clad laminate made of the same. The filler compound comprises two or more than two fillers with different particle diameters, a surface treatment agent and a solvent. The content of the fillers is 50-95% of the total weight of the filler compound and the content of the surface treatment agent is 0.1-5% of the total weight of the filer compound. The copper clad laminate made of the filler compound includes a plurality of superimposed pre-dipping bodes and a copper foil covered at one side or two sides of the plurality of superimposed pre-dipping bodes. Each pre-dipping body comprises a base material and a filler compound which is attached on the base material by impregnating and drying. In the invention, two or more than two fillers with different particle diameters are compounded to improve the liquidity of the filler compound, therefore, not only are the problems of dispersion and high viscosity of high filler content solved, but also the operation is easy and the application range is wide, furthermore, the expansion coefficient and the water absorption of the copper clad laminate made of the filler compound are reduced, and the heat resistance of the copper clad laminate is improved.

Description

technical field [0001] The invention relates to a composition, in particular to a filler composition for printed circuit boards and a copper-clad laminate made using the same. Background technique [0002] Under the ever-changing trend of electronic technology, integrated circuits are rapidly developing in the direction of ultra-large-scale, ultra-high-speed, high-density, high-power, high-precision, and multi-functional. Therefore, the requirements for copper clad laminates are also getting higher and higher. The heat resistance and expansion rate requirements of the board are particularly prominent. In order to improve the heat resistance of the board and reduce its expansion coefficient, the most effective method is to add as much filler as possible to the glue formula, such as silicon dioxide. However, when a large amount of fillers are used, especially micro-nano fillers, the viscosity of the glue system will increase sharply, and it is difficult to disperse the filler...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/02C08L61/06C08L83/04C08L67/06C08K9/06C08K3/36B32B15/08B32B15/092B32B15/20B32B27/20
Inventor 杜翠鸣
Owner GUANGDONG SHENGYI SCI TECH
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