82results about How to "Good moisture and heat resistance" patented technology

The invention provides a UV curing packaging adhesive for a liquid crystal display. Based on 100 weight parts, the adhesive consists of following components: 40 to 70 parts of prepolymer, 20 to 50 parts of active diluent monomer, 1 to 8 parts of photoinitiator, and 0.1 to 5 parts of assistant. The prepolymer is one or a mixture of more of the urethane acrylate, epoxy acrylate and polyster acrylate. The UV curing packaging adhesive for the liquid crystal display has the characteristics of high curing speed, low shrinkage rate and excellent damp heat resistance.

To provide an adhesive composition which shows high adhesion with a glass substrate and has excellent heat resistance, moisture resistance and moist heat resistance, an adhesive optical film comprising an adhesive layer made of the adhesive composition, which shows high adhesion between the adhesive layer and an optical film and effectively suppresses the occurrence of adhesive residue and lack of adhesive and also has excellent heat resistance, moisture resistance and moist heat resistance, and an image display device comprising the adhesive optical film, the adhesive optical film comprises an optical film 1, an adhesive layer 3 made of a water dispersible adhesive composition comprising, as raw monomers, an alkyl(meth)acrylate ester whose alkyl group has 4 to 18 carbon atoms, a carboxyl group-containing vinyl monomer, a phosphoric acid group-containing vinyl monomer, and a copolymerizable vinyl monomer which is optionally copolymerizable with the above monomers, wherein a carboxyl group concentration is from 0.05 to 1.50 mmol / g and a phosphoric acid group concentration is from 0.01 to 0.45 mmol / g in the raw monomers, an under coat layer 2 containing an oxazoline group-containing polymer, and being interposed between the optical film 1 and the adhesive layer 3, and the adhesive optical film is applied onto an image display device.

The present invention relates to a polyphenylene ether resin composition, and a prepreg and a copper dad laminate made therefrom. The polyphenylene ether resin composition comprises: (A) functionalized polyphenylene ether resin, (B) crosslinking agent, and (C) initiator; the component (A) functionalized polyphenylene ether resin is polyphenylene ether resin that has a number average molecular weight of 500-5000 and unsaturated double bonds at the molecule terminal; the component (B) crosslinking agent is olefin resin with a number average molecular weight of 500-10000, of which styrene structure comprises 10-50 wt %, and of which the molecule comprises 1,2-addition butadiene structure. The polyphenylene ether resin composition of the present invention is a composition of functionalized polyphenylene ether resin with a low molecular weight. The prepreg and copper clad laminate made from the polyphenylene ether resin composition have good dielectric properties and heat resistance.

The aqueous dispersion adhesive composition contains an aqueous dispersion copolymer obtained by reacting of a reaction component containing alkyl (meth)acrylate whose linear or branched alkyl group has 4 to 18 carbon atoms, (meth)acrylic acid, a phosphoric acid group-containing vinyl monomer and an alkoxysilyl group-containing vinyl monomer to react; and a crosslinking agent having reactivity with a carboxyl group. In the aqueous dispersion adhesive composition, an amount of the crosslinking agent is from 0.07 to 4 parts by weight per 100 parts by weight of the aqueous dispersion copolymer, and in an adhesive layer made of the aqueous dispersion adhesive composition, an elongation at 90° C. is 200% or less.

Provided is an electro-optic apparatus including an organic sealant that seals a first substrate and a second substrate, an inorganic sealant that surrounds the organic sealant which seals the first substrate and the second substrate, and an electro-optic material that is enclosed within an area surrounded by the organic sealant.

A transparent conductive film comprising: an organic polymer film substrate; an Al2O3 thin film formed on the organic polymer film substrate; and a ZnO-based thin film that is formed on the Al2O3 thin film and comprises ZnO doped with at least one of Ga and Al. The transparent conductive film has a low resistance value, even when the thickness of the ZnO-based thin film is reduced (particularly to about 150 nm or less), and shows a low rate of resistance change even in a hot and humid environment.

Provided are a photosensitive resin composition which is excellent in a moisture and heat resistance and provides a cured product thereof with a high elastic modulus at high temperature and which is excellent as well in a hollow structure holding property and a photosensitive film prepared by using the same, a forming method for a rib pattern, a hollow structure and a forming method for the same and an electronic component. In an electronic component having a hollow structure, a photosensitive resin composition is used as a rib material or a cover material for forming the hollow structure described above, and it is characterized by using a photosensitive resin composition containing (A) a photopolymerizable compound having at least one ethylenically unsaturated group and (B) a photopolymerization initiator and a photosensitive film obtained from the above photosensitive resin composition. Used as the component (A) are acrylate compounds or methacrylate compounds, to be specific, an acrylate compound or a methacrylate compound having an amide group and an acrylate compound or a methacrylate compound containing a urethane bond.

The invention relates to the use of a) at least one polyalkyl(meth)acrylate and b) at least one compound according to formula (I), where the groups R1 and R2 independently represent an alkyl or cycloalkyl group with 1 to 20 carbon atoms, for the production of solar cell modules, particularly for the production of light concentrators for solar cell modules.

The purpose of the present invention is to provide a breakable capsule, which is characterized by having no adhesion between capsules each other, having no over time change of the capsule contents, having excellent heat resistance and moisture resistance, being easily ruptured under the pressure imposed by the fingers, having good cracking feeling, and releasing the content and the present invention relates to a breakable capsule, which comprises a capsule having a content and a capsule shell, wherein the capsule is characterized byhaving an oily ingredient as a content,having at least a shell-forming material as a capsule shell,and satisfying the following equations (1) and (2),150<(X)<630   (1)wherein (X) represents crush strength (g) / outer diameter of a capsule (mm),0.15≦(Y)≦0.53   (2)wherein (Y) represents distance / outer diameter ratio, where the distance represents the distance (mm) that is deformed to reach the maximum load, when the capsule is ruptured over the press under the condition of 22° C., 80% RH.

Provided are a polarizing plate with less defects of outer appearance, which is extremely excellent in an adhesiveness between a polarizer and a polarizer protective film in an environment of high temperature or high humidity and is also excellent in optical properties, and to which a conventional general-purpose adhesive layer can be applied, and an image display apparatus of high quality using the polarizing plate. The polarizing plate according to the present invention includes a polarizer formed of a polyvinyl alcohol-based resin, an adhesive layer, a metal salt layer, and a polarizer protective film in the stated order.

Moulding composition, encompassinga) at least one polyalkyl (meth)acrylate, andb) at least one compound according to formula (I)in which the moieties R1 and R2 are independently an alkyl or cycloalkyl moiety having from 1 to 20 carbon atoms,where the moulding composition further comprisesc) at least one infrared absorber,where the transmittance of the moulding compositionat 500 nm is smaller than 89%,at 1000 nm is smaller than 80%,at 1150 nm is smaller than 70% andat 1600 nm is smaller than 77%, in each case measured by means of infrared spectroscopy at 25° C. on 3 mm plaques.The moulding composition is in particular used for the production of solar-cell modules.

The invention discloses ultraviolet curing glue for adhering and sealing FPC and plasma screen glass. The ultraviolet curing glue is characterized by comprising the following components in percentage by weight: 45-65 percent of prepolymer, 25-45 percent of active monomer, 1-8 percent of photo-initiator and 0.5-3 percent of accessory ingredient.

The invention discloses a feed mould inhibitor belonging to the technical fields of feed science and feed additives. The feed mould inhibitor contains glycerol monolaurate, sodium dehydroacetate, calcium propionate and carriers. The feed mould inhibitor of the invention has the characteristics of small additive amount, reduction of cost, safety, reliability, stable quality and no influence on animal palatability. When the feed mould inhibitor is used for inhibiting mould in feed, the feed mould inhibitor has good moisture resistance, good heat resistance and smaller influence of the pH value and has the effect on efficiently inhibiting and sterilizing microorganisms such as bacteria, fungi and the like in the feed. The mould inhibiting effect of the feed mould inhibitor of the invention is superior to the mould inhibiting effect of other conventional single mould inhibitors.

A transparent electrically-conductive film of the present invention comprises a transparent film substrate, a hard coat layer formed on one side of the transparent film substrate, a SiOx layer with a thickness of 10 nm to 300 nm that is formed on the hard coat layer by a dry process, and a transparent electrically-conductive thin layer with a thickness of 20 nm to 35 nm that is formed on another side of the transparent film substrate. The transparent electrically-conductive film has good resistance to moisture and heat and high durability against pen-based input and can be prevented from cracking during a punching process and also prevented from waving or curling even in a high-temperature, high-humidity environment.

A transparent electrically-conductive film of the present invention comprises a transparent film substrate, a hard coat layer formed on one side of the transparent film substrate, a SiOx layer with a thickness of 10 nm to 300 nm that is formed on the hard coat layer by a dry process, and a transparent electrically-conductive thin layer with a thickness of 20 nm to 35 nm that is formed on another side of the transparent film substrate. The transparent electrically-conductive film has good resistance to moisture and heat and high durability against pen-based input and can be prevented from cracking during a punching process and also prevented from waving or curling even in a high-temperature, high-humidity environment.

To provide an adhesive composition which shows high adhesion with a glass substrate and has excellent heat resistance, moisture resistance and moist heat resistance, an adhesive optical film comprising an adhesive layer made of the adhesive composition, which shows high adhesion between the adhesive layer and an optical film and effectively suppresses the occurrence of adhesive residue and lack of adhesive and also has excellent heat resistance, moisture resistance and moist heat resistance, and an image display device comprising the adhesive optical film, the adhesive optical film comprises an optical film 1, an adhesive layer 3 made of a water dispersible adhesive composition comprising, as raw monomers, an alkyl (meth)acrylate ester whose alkyl group has 4 to 18 carbon atoms, a carboxyl group-containing vinyl monomer, a phosphoric acid group-containing vinyl monomer, and a copolymerizable vinyl monomer which is optionally copolymerizable with the above monomers, wherein a carboxyl group concentration is from 0.05 to 1.50 mmol / g and a phosphoric acid group concentration is from 0.01 to 0.45 mmol / g in the raw monomers, an under coat layer 2 containing an oxazoline group-containing polymer, and being interposed between the optical film 1 and the adhesive layer 3, and the adhesive optical film is applied onto an image display device.

A glass composition including, in oxide-based mol %: (a) at least 30% and at most 50% P2O5, (b) at least 25% and at most 65% ZnO, (c) at least 0.1% and at most 10% Al2O3, (d) at least 0% and at most 50% Li2O, (e) at least 0% and at most 50% Na2O, (f) at least 0% and at most 50% K2O, (g) at least 0% and at most 20% MgO, (h) at least 0% and at most 20% CaO, (i) at least 0% and at most 20% SrO, (j) at least 0% and at most 20% BaO, (k) at least 0% and at most 20% SnO, and (l) at least 0% and at most 5% B2O3, at least one of (d) Li2O, (e) Na2O and (f) K2O being more than 0%, and (a) / (b), the ratio of (a) and (b), being at least 0.2 and at most 2.0.

A halogen-free resin composition and a method for preparation of copper clad laminate with the same, wherein based on total parts by weight of solid components, the halogen-free resin composition comprises a reactive allyl phenoxy cyclotriphosphazene or vinyl phenoxy cyclotriphosphazene of 5-50 parts, a thermosetting resin of 15-85 parts, a crosslinking curing agent of 1-35 parts, a crosslinking curing accelerant of 0-5 parts and a filler of 0-100 parts. In the present invention, the reactive allyl phenoxy cyclotriphosphazene or vinyl phenoxy cyclotriphosphazene having very low water absorption is introduced into the thermosetting resin, satisfying both the halogen-free and antiflaming requirements and improving the electrical properties of the system, and making it possible to prepare the halogen-free high-frequency high-speed substrate material. The resulted copper clad laminate satisfies the halogen-free requirement, and has advantages such as excellent resistance to heat and moisture, and low dielectric loss.

An anisotropic conductive film made of an adhesive resin composition in which conductive particles are dispersed. The adhesive resin composition is a thermosetting resin composition containing base resin composed of polyacetalized resin obtained by acetalizing polyvinyl alcohol and / or modified polyacetalized resin obtained by introducing an aliphatic unsaturated group in a side chain of the polyacetalized resin, melamine-series resin, (meth)acrylate phosphate, and alkyd resin. The present invention provides an anisotropic conductive film exhibiting high adhesive strength to both ITO and SiOx.

A glass composition including, in oxide-based mol %: (a) at least 30% and at most 50% P2O5, (b) at least 10% and at most 50% ZnO, (c) at least 0.1% and at most 10% Al2O3, (d) at least 0% and at most 50% Li2O, (e) at least 0% and at most 50% Na2O, (f) at least 0% and at most 50% K2O, (g) at least 0% and at most 20% MgO, (h) at least 0% and at most 20% CaO, (i) at least 0% and at most 20% SrO, (j) at least 0% and at most 20% BaO, (k) at least 0% and at most 20% SnO, and (1) at least 0% and at most 5% B2O3, substantially not comprising ZrO2 and Ag2O, and (a) / (b), the ratio of (a) and (b), being at least 0.2 and at most 2.0.

Disclosed is a highly adhesive multilayer thermoplastic resin film which is excellent in adhesion to a metal layer, especially to a metal vapor deposition layer. This highly adhesive multilayer thermoplastic resin film is also excellent in wet-heat-resistant adhesion and chemical-resistant adhesion. Specifically disclosed is a highly adhesive multilayer thermoplastic resin film which is characterized in that a multilayer film mainly composed of two polyester resins having different glass transition temperatures and a melamine crosslinking agent (C) and having a surface energy of 48-55 mN / m is formed on at lest one side of a thermoplastic resin film. The highly adhesive multilayer thermoplastic resin film is also characterized in that a polyester resin (A) of higher glass transition temperature has a glass transition temperature not less than 110 DEG C, while a polyester resin (B) of lower glass transition temperature has a glass transition temperature not less than 60 DEG C but less than 110 DEG C, and the melamine crosslinking agent (C) is contained in an amount of 75-200 parts by weight per 100 parts by weight of the total of the two polyester resins.

To avoid a phenomenon of deterioration which is characteristic to an organic EL display device, such as a dark spot, without forming a pin hole in an organic material used for forming an organic EL layer. A reflective anode for an organic EL display device includes: an Ag-based alloy film (6) containing 0.01 to 1.5 atomic % of Nd and formed on a substrate (1); and an oxide conductive film (7) formed on the Ag-based alloy film (6) and in direct contact with the film (6).

A circuit coupling adhesive which is superior in heat resistance and moisture resistance is provided. The circuit coupling adhesive of the present invention can be used for purposes where high performing reliability is required, since it exhibits satisfactory electroconductive / insulative performance at connection of electrodes, etc. and the characteristics will not be varied so much even after a long period of use in a high temperature and high humidity environment. The circuit coupling adhesive comprises, as the essential ingredients, an epoxy resin, a latent curing agent, inorganic fillers having an average particle diameter of 500 nm or less, and electro-conductive particles. By mix a sufficient amount of inorganic fillers having an average particle diameter of 500 nm or less, the coefficient of thermal expansion can be decreased and the heat resistance and moisture resistance can be improved.

A method for producing a semiconductor apparatus with a mold including an upper mold half and a lower mold half, includes: an arranging step of arranging on one of the upper mold half and the lower mold half of the mold a substrate on which a semiconductor device is mounted, the mold being kept at a room temperature or heated to a temperature up to 200° C., and arranging on the other of the upper mold half and the lower mold half a substrate on which no semiconductor device is mounted; an integrating step of integrating the substrate on which the semiconductor device is mounted and the substrate on which no semiconductor device is mounted by molding a thermosetting resin with the mold on which the substrates are arranged; and a step of dicing the integrated substrates taken out of the mold to obtain an individualized semiconductor apparatus.

The purpose of the present invention is to provide: a photosensitive epoxy resin composition and / or a resist laminate of said resin composition that makes it possible to use photolithography to form an image having a vertical sidewall shape and fine resolution, low stress, and heat / humidity resistance; and a cured product of said resin composition and said resist laminate. The present invention is a photosensitive resin composition comprising: (A) an epoxy resin; (B) a polyphenol compound having a specific structure; (C) a photocationic polymerization initiator; and (D) an epoxy group-containing silane compound. The epoxy resin (A) comprises: an epoxy resin (a) obtained by reacting a phenol derivative that is represented by formula (1) with an epihalohydrin; and an epoxy resin (b) that is represented by formula (2).

A glass composition including, in oxide-based mol %: (a) at least 30% and at most 50% P2O5, (b) at least 10% and at most 50% ZnO, (c) at least 0.1% and at most 10% Al2O3, (d) at least 0% and at most 50% Li2O, (e) at least 0% and at most 50% Na2O, (f) at least 0% and at most 50% K2O, (g) at least 0% and at most 20% MgO, (h) at least 0% and at most 20% CaO, (i) at least 0% and at most 20% SrO, (j) at least 0% and at most 20% BaO, (k) at least 0% and at most 20% SnO, and (l) at least 0% and at most 5% B2O3, substantially not comprising ZrO2 and Ag2O, and (a) / (b), the ratio of (a) and (b), being at least 0.2 and at most 2.0.

A production method for a fiber-reinforced composite material comprises: a step of stacking a prepreg plurally to obtain a prepreg-stacked body; and a step of heating the prepreg-stacked body to cure a resin, wherein the prepreg comprises: a reinforcing fiber layer including reinforcing fibers and a resin composition with which the space between fibers of the reinforcing fibers is impregnated and which contains (A) a benzoxazine resin, (B) an epoxy resin, and (C) a curing agent having 2 or more phenolic hydroxy groups in a molecule; and a surface layer provided on at least one surface of the reinforcing fiber layer and containing (A) to (C) components, and (D) polyamide resin particles having an average particle size of 5 to 50 μm.

A resin composition capable of securely adhering multiple members in a short time without having to establish a long aging process. The resin composition including: (1) a urethane(meth)acrylate; (2) at least one selected from a group of (meth)acrylates having a phosphate group, (meth)acrylic silane coupling agents, and (meth)acrylates having an isocyanate group; and (3) a (meth)acrylate having an epoxy group.

The purpose of the present invention is to provide: a photosensitive epoxy resin composition and / or a resist laminate of said resin composition that makes it possible to use photolithography to form an image having a vertical sidewall shape and fine resolution, low stress, and heat / humidity resistance; and a cured product of said resin composition and said resist laminate. The present invention is a photosensitive resin composition comprising: (A) an epoxy resin; (B) a polyol compound having a specific structure; (C) a photocationic polymerization initiator; and (D) an epoxy group-containing silane compound. The epoxy resin (A) comprises: an epoxy resin (a) obtained by reacting a phenol derivative that is represented by formula (1) with an epihalohydrin; and an epoxy resin (b) that is represented by formula (2).