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Ultraviolet curing glue for adhering and sealing FPC and plasma screen glass

A technology of adhesive sealing and plasma screen, which is applied in the direction of adhesive, adhesive type, discharge tube/lamp manufacturing, etc., can solve the problems that cannot meet various requirements, and achieve the avoidance of electromigration, high bonding strength, and curing fast effect

Inactive Publication Date: 2010-05-12
BEIJING HYSTIC NEW MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

UV curing glue, generally composed of liquid acrylic resin or modified acrylic resin plus some solid acrylic resin fillers, cannot meet the above requirements for the bonding and sealing of FPC and plasma screen glass

Method used

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  • Ultraviolet curing glue for adhering and sealing FPC and plasma screen glass

Examples

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example 1

[0021] Under normal temperature and normal pressure, according to the content of each component specified in the following Table 1, the prepolymer is selected from polyurethane acrylate and epoxy acrylate, and the reactive diluent monomer is selected from isobornyl acrylate and hydroxyethyl methacrylate. The photoinitiator is selected from 1-hydroxy-cyclohexyl phenyl ketone and 2,4,6-trimethylbenzoyl-diphenylphosphine oxide, and the auxiliary agent is selected from γ-aminopropyl triethoxysilane and γ- [(2,3)-Glycidoxy]propyltrimethoxysilane. Add isobornyl acrylate and hydroxyethyl methacrylate into the reaction vessel, then add 1-hydroxy-cyclohexyl phenyl ketone, 2,4,6-trimethylbenzoyl-diphenylphosphine oxide, γ-Aminopropyltriethoxysilane and γ-[(2,3)-glycidoxy]propyltrimethoxysilane, stirring at a temperature of 30°C to 60°C, and keeping the temperature at Add urethane acrylate and epoxy acrylate at 30°C to 60°C, and continue stirring to mix evenly.

Embodiment 2

[0023] Under normal temperature and pressure, according to the content of each component specified in Table 1 below, epoxy acrylate and polyester acrylate are used as prepolymers, and isobornyl methacrylate and hydroxymethacrylate are selected as reactive diluent monomers. Ethyl ester, photoinitiator selects benzoin dimethyl ether and 2,4,6-trimethylbenzoyl-diphenyl phosphine oxide, auxiliary agent selects gamma-aminopropyl triethoxysilane and gamma-[(2 , 3)-glycidoxy] propyltrimethoxysilane. Add isobornyl acrylate and hydroxyethyl methacrylate into the reaction vessel, then add 1-hydroxy-cyclohexyl phenyl ketone, 2,4,6-trimethylbenzoyl-diphenylphosphine oxide, γ-[(2,3)-glycidoxy]propyltrimethoxysilane and γ-(methacryloyloxy)propyltrimethoxysilane, the temperature is controlled to 30 ℃ ~ 60 ℃ and stirred After all dissolve, keep the temperature at 30℃~60℃, add epoxy acrylate and polyester acrylate, continue to stir and mix evenly.

[0024] The UV curing light source is a 100...

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PUM

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Abstract

The invention discloses ultraviolet curing glue for adhering and sealing FPC and plasma screen glass. The ultraviolet curing glue is characterized by comprising the following components in percentage by weight: 45-65 percent of prepolymer, 25-45 percent of active monomer, 1-8 percent of photo-initiator and 0.5-3 percent of accessory ingredient.

Description

technical field [0001] The invention relates to an ultraviolet curing adhesive, in particular to an ultraviolet curing adhesive used for bonding and sealing a flexible circuit board FPC and a plasma screen glass. Background technique [0002] Plasma screen display technology is an emerging technology, which has the characteristics of high brightness, high contrast, high color saturation, high color uniformity, long life, short mean time between failures, etc. It is currently used in many occasions and has a very good Visual effects. It also has the advantages of clear display, large viewing area, adjustable display ratio, colorful and bright colors, thin body and long service life. [0003] The UV curing glue used for bonding and sealing FPC and plasma screen glass needs to meet the following conditions: [0004] 1. In terms of curing, the debonding energy of the adhesive surface should be less than 1000mJ / cm 2 , the energy of curing 3mm thickness should be less than 2500...

Claims

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Application Information

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IPC IPC(8): C09J175/14C09J163/10C09J167/06H01J9/00
Inventor 何利军
Owner BEIJING HYSTIC NEW MATERIALS
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