Conductive member and manufacturing method thereof

Abstract

The conductive member has a stable contact resistance, resists peeling, displays a low insertion / removal force and is stable when used as a connector, and has an excellent fusing characteristic when used as a fuse. A Cu-Sn intermetallic compound layer (4) is formed between a Ni-based underlayer (3) formed on a Cu-based base material (1), and a Sn-based surface layer (5) that forms the surface. In addition, the Cu-Sn intermetallic compound layer (4) comprises a Cu3Sn layer (6) disposed on the Ni-based underlayer (3) and a Cu6Sn5 layer (7) that is disposed on the Cu3Sn layer (6). The surface roughness of the contact face between the Sn-based surface layer (5) and the Cu-Sn intermetallic compound layer (4) combining the Cu3Sn layer (6) and Cu6Sn5 layer (7) has an arithmetic mean roughness Ra of 0.05-0.25 [mu]m, and the maximum valley depth Rv of the roughness curve is 0.05-1.00 [mu]m. Furthermore, the Cu3Sn layer covers the Ni-based underlayer with a surface coverage of 60-100%.

Description

technical field [0001] The present invention relates to a conductive member for electrical connection connectors, fuses, etc., in which a plurality of plated layers are formed on the surface of a substrate made of Cu or Cu alloy, and a manufacturing method thereof. [0002] This application is based on Japanese Patent Application No. 2009-98043 filed in Japan on April 14, 2009, Japanese Patent Application No. 2009-115289 filed in Japan on May 12, 2009, and Japanese Patent Application No. 2009 filed in Japan on May 26, 2009. -127085 claims priority, the content of which is incorporated herein. Background technique [0003] Conductive parts such as connectors for electrical connection of automobiles and connection terminals of printed circuit boards are often used to plate Sn-based metals on the surface of Cu-based substrates composed of Cu or Cu alloys in order to improve electrical connection characteristics. conductive parts. [0004] Such conductive members include those...

AI Technical Summary

Problems solved by technology

[0021] (1) Mainly due to the relative velocity in the plating bath, a large amount of hydrogen gas is generated from the surface of the cathode when the plating is in progress, which hinders the plating performance of the plating, greatly reduces the current efficiency, and causes poor appearance (plating burn);

[0022] (2) As for multi-layer plating, the correlation with not only tin but also other metal plating such as Ni, Cu, Fe, etc., which are the underlying layers, is not considered

[0024] The average grain size is closely related to the pluggability of conductive parts when used as a connector, but only controlling the average grain size cannot obtain proper pluggability

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