Normal-temperature cured conductive adhesive and process method thereof for connecting rechargeable battery pack
A technology of room temperature curing and process method, which is applied to battery pack parts, conductive adhesives, circuits, etc. It can solve the problems of reduced reliability, looseness, and increased weight of battery packs, so as to avoid circuit breakage, increase heat dissipation, and maintain Effect of Soldering Reliability
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Embodiment 1
[0039] According to Table 1, the specific composition of the room temperature curing conductive adhesive in Example 1 of the present invention can be obtained as follows: the conductive adhesive includes mixture I and mixture II with a mass ratio of 20:1;
[0040] Mixture I includes the following components in mass percentage: 14.3% epoxy resin A, 4.1% epoxy diluent B, 0.4% epoxy crosslinking agent C, 6.1% silicone D, 75.1% silver powder with a particle size satisfying D50>7μm F; wherein: epoxy resin A is bisphenol A epoxy resin, epoxy diluent B is polyisopropylene glycol diglycidyl ether epoxy resin, and epoxy crosslinking agent C is pentaerythritol tetraglycidyl ether epoxy resin. Mix the above components uniformly to obtain mixture I.
[0041] Mixture II includes the following components in mass percentage: 51.2% 2-ethyl-4-methylimidazole (2E4MI), 4.8% 1-methylimidazole (AIM-1), 4% silicone, 40% N-aminoethyl Alkylpiperazine (AEP). Mix the above components uniformly to obt...
Embodiment 2
[0044] According to Table 1, the specific composition of the room temperature curing conductive adhesive of Example 2 of the present invention can be obtained as follows: the conductive adhesive includes mixture I and mixture II with a mass ratio of 20:1;
[0045] Mixture I includes the following components in mass percentage: 14.3% epoxy resin A, 4.1% epoxy diluent B, 0.4% epoxy crosslinking agent C, 6.1% silicone D, 75.1% silver powder with a particle size satisfying D50>7μm F; wherein: epoxy resin A is bisphenol A epoxy resin, epoxy diluent B is polyisopropylene glycol diglycidyl ether epoxy resin, and epoxy crosslinking agent C is pentaerythritol tetraglycidyl ether epoxy resin. Mix the above components evenly to obtain mixture I
[0046] Mixture II includes the following components in mass percentage: 85.3% 2-ethyl-4-methylimidazole (2E4MI), 8% 1-methylimidazole (AIM-1), 6.7% silicone. Mix the above components uniformly to obtain mixture II.
[0047] Table 1 Composition...
Embodiment 3
[0050] According to Table 1, the specific composition of the room temperature curing conductive adhesive of Example 3 of the present invention can be obtained as follows: the conductive adhesive includes mixture I and mixture II with a mass ratio of 15:1;
[0051] Mixture I includes the following components in mass percentage: 14.3% epoxy resin A, 4.1% epoxy diluent B, 0.4% epoxy crosslinking agent C, 6.1% silicone D, 75.1% silver powder with a particle size satisfying D50>7μm F; wherein: epoxy resin A is bisphenol A epoxy resin, epoxy diluent B is polyisopropylene glycol diglycidyl ether epoxy resin, and epoxy crosslinking agent C is pentaerythritol tetraglycidyl ether epoxy resin. Mix the above components uniformly to obtain mixture I.
[0052]Mixture II includes the following components in mass percentage: 28.24% 2-ethyl-4-methylimidazole (2E4MI), 2.82% 1-methylimidazole (AIM-1), 2.27% silicone, 66.67% particle size meeting D50 >7μm silver powder. Mix the above components...
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