77results about How to "Ensure welding reliability" patented technology

The invention discloses a method for metalizing the surface of aluminum nitride ceramic, and belongs to the technical field of ceramic materials. The method comprises the following steps of: cleaning the surface of ceramic; baking at the temperature of between 100 and 150 DEG C in a drying furnace for 4 to 4.5 hours; continuously baking, namely baking at the temperature of 150 DEG C for 15 minutes; and forming a first metal film layer by a film forming process by using Ti, Zr or Ta, forming a second metal film by using Cu, Au, W, Mo, Ni, Ta, Zr, W-Cu alloy, or Mo-Cu alloy, and forming a third metal film layer by using Ni, Au or Cu, wherein the thickness of the third metal film layer is 1 to 5 mu m. According to the method for metalizing the surface of the aluminum nitride ceramic, the first film layer and the second film layer are formed by optimally adopting a magneto-controlled sputter coating method, and the third film layer is formed by optimally adopting an electroplating or chemical plating method. Strong adhesion with ceramic matrix can be obtained, and the welding intensity and reliability on a ceramic seal component can be ensured by the method for metalizing multiple layers of metal films.

The invention discloses an automatic transferring welding carrying platform for a solar cell piece series welding machine. The automatic transferring and welding carrying platform solves the problems that an existing welding carrying platform is inaccurate for welding alignment of a plurality of grid lines of cell pieces and is poor in welding quality. A welding zone (4) is arranged at the left end of a welding transferring platform (3), a transferring zone (5) is arranged at the right end of the welding transferring platform (3), welding zone welding strip negative-pressure suction holes (6) are formed in the welding zone, transferring zone welding strip negative-pressure suction holes (7) are formed in the transferring zone, a solar cell piece negative-pressure suction groove (8) is formed in the welding transferring platform (3), a negative-pressure cylinder bracket (9) is arranged on a welding carrying platform substrate (2), and a welding strip negative-pressure cylinder (10) and a cell piece negative-pressure cylinder (11) are respectively arranged on the negative-pressure cylinder bracket. The automatic transferring welding carrying platform is a mechanism integrated with machinery, air and electricity, and meets the requirements that welding strips are accurately positioned and constantly heated during the series welding process and the cell pieces are quickly adsorbed in a crossed manner.

The invention discloses a laser welding fixture for power batteries. The fixture comprises a bottom plate (1), wherein two limiting plates (15) used for welding are arranged at the rear end of the bottom plate (1) at an interval; a sliding table cylinder (9) is respectively arranged right ahead each limiting plate (15) used for welding; a battery fixture positioning plate (7) and a mobile limiting plate (14) are respectively arranged on the upper surface of each sliding table cylinder (9) in tandem; at least one battery fixture guide shaft (12) is respectively fixed to the left end and the right end of each battery fixture positioning plate (7); each mobile limiting plate (14) is connected with each battery fixture positioning plate (7) through the battery fixture guide shaft (12); and a groove is reserved in the middle of each battery fixture positioning plate (7). The laser welding fixture for the power batteries disclosed by the invention can maintain the stability of battery clamping, ensures the welding reliability of the power batteries in various welding fields, and improves the quality passing rate of the power batteries.

The invention discloses a gas-liquid separator, which comprises a cylinder, an upper end cover, a lower end cover, an outlet adapter and an iron pipe. The iron pipe is positioned in the gas-liquid separator body; the outlet adapter is connected with the iron pipe through the lower end cover; the lower end cover is provided with an outward turnover edge part; the iron pipe is fixed with the inner wall of the outward turnover edge part of the lower end cover; and the outlet adopter is matched and fixed with the outer wall of the outward turnover edge part of the lower end cover by welding. Structural and technical improvements are made, so a welding fitting distance between the iron pipe and the lower end cover is stable, a galling phenomenon between welded contact surfaces is avoided and a welding fitting distance between the outlet adapter and the lower end cover is stable. Therefore, the quality, reliability and consistency among the lower end cover, the iron pipe and the outlet adapter are ensured.

The invention relates to a thermoelectric separation power type light-emitting diode bulb with high integration and high lighting effect, comprising a case, a circuit board and light-emitting diodes, wherein the circuit board is arranged in the case, the light-emitting diode is arranged on the circuit board, the case is a non-metal hollow case, air holes are arranged on a lower side, the lower side of the circuit board is provided with radiation pillars which are fixed the light-emitting diodes in one-to-one correspondence, heat is radiated by virtue of the radiation pillars which are independently corresponding to the light-emitting diodes, independent heat radiation technical effect realized by a heat radiation pillar body with large heat radiation area to a corresponding light-emitting diode is effectively enhanced, heat produced when an LED (light-emitting diode) lamp gives out light is better transferred to the air and radiated, so as to solve problems of heat transfer and heat radiation in a using process, and service life of the LED lamp is guaranteed.

The invention relates to a welding structure of seamless steel rails with smooth operation up and down and large carrying capacity of welding seams. The reinforced welding structure of the seamless steel rails with smooth operation up and down belongs to the technical field of welding of steel rails of trains. The welding structure of the invention comprises steel rails and welding seams, wherein the connecting parts of the steel rails are in inclined surfaces which are connected in a welding way; the inclined surfaces at the connecting parts of two parallel steel rails are asymmetrically arranged in a staggered way; the staggered length is larger than the length of a section of carriage; and each inclined surface is determined by being parallel with the y axis and forming 45 degree or 60 degree angle with the x axis. The inclined welding surfaces of the invention can prevent wheels from bumping up and down when the wheels pass through the welding seams; compared with straight welding surfaces, the inclined welding surfaces can increase the welding area, reduce pure positive tension stress and pure shearing stress, and can increase the carrying capacity of the steel rails to the wheels; and even the aluminothermic welding is adopted, the welding strength and welding reliability can also be ensured, and the aluminothermic welding can improve the welding efficiency, simplify the welding technology and save the welding cost and can be operated in an on-line way. The invention is especially suitable for welding seamless long rails of heavy load trains and high-speed CRH, and can also be used for welding seamless steel rails of urban rail trains.

The invention discloses a USB Type-C socket connector convenient for firm welding. The USB Type-C socket connector convenient for the firm welding comprises a metallic shield shell and an inserting component; the metallic shield shell is provided with more than two pairs of welding leg sets; and the rear row of the welding leg set is higher than the front row of the welding leg set. The USB Type-C socket connector convenient for the firm welding is used for, only if the actual deviation value of the welding leg set is not greater than the preset height difference value between the rear row of the welding leg set and the front row of the welding leg set, ensuring the welding reliability of the front row of the welding leg set and the substrate. The producer only detects the rear row of the welding leg set convenient for the detection under the usual situation, and the welding firmness of the USB Type-C socket connector can be determined directly. The product reliability is improved, and the production difficulty and production cost are reduced.

The invention discloses a normal-temperature cured conductive adhesive and a process method thereof for connecting rechargeable battery packs. The conductive adhesive is used for communicating rechargeable battery pack electrodes and reinforcing battery packs, and then the rechargeable battery pack electrodes and the battery packs can endure vibration and impact under use conditions. The normal-temperature cured conductive adhesive comprises an epoxy resin, an epoxy diluent, an epoxy curing agent, silicone aids and 30-90% by mass of silver powder of which D50 is greater than 7mu m. When being applied to connection and reinforcement of battery cathodes, the normal-temperature cured conductive adhesive disclosed by the invention can be called as a 'cathode cold welding' process, both the welding reliability of hot welding is maintained, and no external heat is needed in the welding process, direct damage or hidden damage of battery structures is avoided, and thus the properties of conductors are not affected by external heat.

The invention discloses a preliminary treatment method for electroplating of a chip ferrite product, comprising the following steps: I. the chip ferrite semi-finished product after silver ink firing is carried out is arranged in ferrum complex saturated aqueous solution, and then is soaked at normal temperature, and the chip ferrite semi-finished product is taken out after complexing is carried out to ferric ions on the surface of a magnet completely; II. The chip ferrite semi-finished product is cleaned for 3-5 times by pure water with 55-100 DEG C, so as to clean the ferrum complex left on the silver end, and then the chip ferrite semi-finished product can be directly electroplated after being arranged in a basket; the design principle is that: the ferrum complex aqueous solution is utilized to remove the ferric ions left on the surface of the magnet of the chip ferrite semi-finished product after the silver ink firing is carried out to the chip ferrite, no ferric ions are deoxidized when in electroplating, so as not to form an overplating substrate. The preliminary treatment method for electroplating of the chip ferrite product has convenient operation, good effect and short time; the method not only can prevent the chip ferrite semi-finished product from generating the overplating phenomenon in the electroplating procedure, but also can not cause poor plating layer; in addition, the welding reliability of the chip ferrite after being electroplated is ensured.

The invention relates to a PCB fixing device used for fixing the PCB. The fixing device comprises a shell body, a support body and a machine leg. The shell body is provided with an installation location and a first connecting piece is arranged in the installation location; the support body is used for installing the PCB and is fixedly connected to the shell body through the first connecting piece; the machine leg is used for supporting the shell body and is arranged in the installation location of the shell body, corresponding to the first connecting piece. A vertical projection of the machine leg on the shell body completely covers a vertical projection of the first connecting piece on the shell body. The PCB is directly installed on the support body and deformation of the support body is small, therefore, the PCB can not be driven to deform and the welding reliability of electronic components on the PCB can be ensured. At the same time, the vertical projection of the machine leg on the shell body completely covers the vertical projection of the first connecting piece on the shell body, the first connecting piece is concealed by the machine leg which is also arranged at the installation location, so that the surface of the shell body is more smooth and the appearance quality of the fixing device is improved.

The invention provides a closing structure for a flat tube of a condenser of an automobile air-conditioner, in order to solve the problems of a present flat tube structure that the inserting and positioning are difficult, the correcting for the center distance of collecting mains is required before brazing, the invariableness cannot be ensured during a brazing process after the correcting, the appearance effect is inferior, and the like, during a core manufacturing process. A joint of an end of the flat tube and the collecting main is arranged in a wedge form, namely, the size of an outer edge on one side of the port of the end of the flat tube is smaller than the size of an inner edge of an assembling hole of the collecting main, and then, is linearly increased to be consistent with the size of the outer edge of a tube body, so that a wedge-shaped transitional zone is formed between the tube body of the flat tube and the port. The closing structure provided by the invention has the beneficial effects that the flat tube can be conveniently inserted into the assembling hole on the collecting main and can be accurately positioned, the center distance between the collecting mains at two ends meets a design demand, and meanwhile, the welding reliability (zero leakage) is ensured. Besides, after the welding is finished, no closing trace of the flat tube can be seen and the appearance quality is increased.

The invention relates to a double-layer PCB welding device, clamp and method and a welding clamp for a PCB and a connecting pin. The double-layer PCB welding device comprises the welding clamp for thePCB and connecting pin and the double-layer PCB welding clamp, wherein the connecting pin is welded and fixed to an auxiliary plate through the welding clamp for the PCB and connecting pin, two sliding blocks of the double-layer PCB welding clamp are pushed aside, then the auxiliary plate is placed on the lower layer of the clamp, a main plate is placed in the upper layer of the clamp through limiting and clamping of the sliding blocks, the clamp is provided with a limiting protrusion, the limiting protrusion is matched with pressing of a first cover plate for fixation, then welding is conducted, and therefore two welded plates are parallel, and high-precision welding and positioning of the connecting pin are achieved. According to the double-layer PCB welding device, clamp and method andthe welding clamp for the PCB and the connecting pin, the structural design is reasonable, use and operation are easy and convenient, the positioning and fixing precision is high, the cost is low, the implementation time is short, and the double-layer PCB welding device, clamp and method and the welding clamp for the PCB and the connecting pin are capable of being applied to the connecting, welding and assembling process of double-layer PCBs of the same size, in the same space and of different types.

The invention relates to a manufacturing method of aluminum-substrate printed circuit board in-hole metallization, which comprises the following steps: 1, drilling holes on an aluminum-substrate printed circuit board; 2, placing the aluminum-substrate printed circuit board in a neutral medicinal liquid system of pyrophosphoric acid to plate copper, namely, to form a layer of copper protective layer on an aluminum substrate; 3, performing electroless copper deposition to form a copper layer at non-metal positions; 4, performing acidic copper plating; and 5, performing post aluminum-substrate printed circuit board manufacturing process. In the invention, the aluminum substrate is effectively prevented from contacting medium-strong acidic and alkaline medicinal liquid in the processes of electroless copper deposition and acidic copper plating, which ensures the smooth operation of the subsequent processing steps of the aluminum-substrate printed circuit board. The process guarantees the welding reliability and high heat conductivity of the product after subsequent surface mounting, sets a high-concentration and high-power consumption trend for the development of the design of circuit boards, greatly reduces crosstalk between signals, reduces electric noises and further optimizes signal transmission. The method has a simple process and low cost and makes large-scale industrial production convenient.

The invention discloses a semiconductor packaging method comprising the steps of: providing a metal substrate, wherein the metal substrate has opposite front and back sides, the metal substrate comprises a plurality of operating units, each operating unit comprises pins, and the pins of two adjacent operating units are connected through a scribe line connecting strip; pasting and electrically connecting a semiconductor chip; fixing the semiconductor chip to the front side of the metal substrate, and electrically connecting the pins to the semiconductor chip; performing plastic package; forminga plastic package layer on the front side of the metal substrate, wherein the plastic package layer completely covers the semiconductor chip and the front side of the metal substrate; performing halfcutting; cutting the scribe line connecting strip on the back side of the metal substrate to form a groove, wherein the adjacent operating units are still in a conductive interconnection state afterthe half cutting, and the scribe line connecting strip generates metal burrs in the half cutting process; removing the metal burrs; forming a first protective layer; and performing full cutting. The semiconductor packaging method provided by the application can remove metal debris or wire residues formed in the cutting step.

The invention relates to the technical field of welding equipment, in particular to a rapid welding device which can effectively ensure welding safe reliability. The rapid welding device comprises a suspension bracket, and a transverse linear actuator mechanism is installed on the suspension bracket through a transverse supporting base; the transverse linear actuator mechanism comprises a transverse driving servo motor, a transverse lead screw and a transverse sliding block connected with the transverse lead screw, and a longitudinal linear actuator mechanism is installed on the transverse sliding block; the longitudinal linear actuator mechanism comprises a longitudinal servo motor, a longitudinal lead screw and a longitudinal sliding block connected with the longitudinal lead screw, a clamping jaw cylinder and a limiting cylinder are installed at the bottom of the longitudinal sliding block, an L-shaped limiting block is installed on a piston rod of the limiting cylinder, and the L-shaped limiting block is arranged between two clamping jaws of the clamping jaw cylinder; and an L-shaped supporting base is installed at the end of the transverse supporting base, and a welding gun corresponding to the L-shaped limiting block is installed on the L-shaped supporting base.

The invention relates to a three-dimensional LED (light emitting diode) luminous body and a processing method of the three-dimensional LED luminous body. The three-dimensional LED luminous body comprises a strip-shaped transparent base plate and a plurality of LED wafers in tandem connection, wherein the LED wafers are positioned on the transparent base plate through transparent silica gel, and two ends of the LED wafers are provided with leads, wherein two ends of the transparent base plate are respectively provided with metal connecting elements, the metal connecting elements are provided with U-shaped clamp openings and are clamped and buckled at two ends of the transparent base plate, adhesives are adopted between the metal connecting elements and the transparent base plate for fixation, and the leads are electrically connected with the metal connecting elements. The invention aims at providing the three-dimensional LED luminous body with simple structure and stable connection, and the processing method of the three-dimensional LED luminous body.

The invention provides a deep and narrow gap submerged arc welding device with melon petal welding track self-recognition and a welding method which are more suitable for circular curve and ellipsoidal curve space butt welding seams. The deep and narrow gap submerged arc welding device comprises a flexible rail, a laser vision sensor located above a gap, two vehicle frames movably connected to theflexible rail and connected into a whole through a base plate, a guide mechanism located above a to-be-welded deep and narrow gap, an automatic welding flux conveying mechanism and an automatic wirefeeding mechanism, wherein the automatic welding flux conveying mechanism and the automatic wire feeding mechanism are connected with a z-axis guide rail sliding block of the guide mechanism, a deep narrow gap welding gun is fixedly connected to the lower part of the automatic wire feeding mechanism, the automatic welding flux conveying mechanism is fixedly connected with the deep narrow gap welding gun, a y-axis guide rail of the guide mechanism is fixedly connected to the base plate, and a z-axis guide rail of the guide mechanism is fixedly connected to a sliding block of the y-axis guide rail. The deep and narrow gap submerged arc welding device is suitable for welding occasions of flat welding, vertical upward welding and transition from vertical upward welding to flat welding, good weld joint forming quality can be guaranteed, and welding efficiency is improved.

The invention discloses a chip ferrite product electro-plating pre-treatment method, including the following processes: semi-finished product of chip ferrite after silver ink firing is placed into 0.1-3% solution composed of ferric dispersant and propyl acetate solvent for soaking for 10-24 hours and then is taken out when the surface of magnet is covered with a protective film; pure water at 55-100 DEG C is used for washing for 3-5 times, residual ferric dispersant on silver tip is cleaned, and then electro-plating can be carried out after product is placed into basket. The principle includes that the characteristic that ferric dispersant has strong affinity effect on ferric ion and weak affinity effect on silver is utilized to form a protective film on the surface of the magnet of semi-finished product of chip ferrite after silver ink firing. The invention has the beneficial technical effects that the chip ferrite product electro-plating pre-treatment process is convenient in operation, effect is good, and time is short. The invention not only can prevent climbing plating from being produced by semi-finished products of the chip ferrite after silver ink firing in electro-plating process, but also defect plating can not be caused, and welding reliability of electroplated chip ferrite product is ensured.