Thermoelectric separation power type light-emitting diode bulb with high integration and high lighting effect

Abstract

The invention relates to a thermoelectric separation power type light-emitting diode bulb with high integration and high lighting effect, comprising a case, a circuit board and light-emitting diodes, wherein the circuit board is arranged in the case, the light-emitting diode is arranged on the circuit board, the case is a non-metal hollow case, air holes are arranged on a lower side, the lower side of the circuit board is provided with radiation pillars which are fixed the light-emitting diodes in one-to-one correspondence, heat is radiated by virtue of the radiation pillars which are independently corresponding to the light-emitting diodes, independent heat radiation technical effect realized by a heat radiation pillar body with large heat radiation area to a corresponding light-emitting diode is effectively enhanced, heat produced when an LED (light-emitting diode) lamp gives out light is better transferred to the air and radiated, so as to solve problems of heat transfer and heat radiation in a using process, and service life of the LED lamp is guaranteed.

Description

technical field [0001] The invention relates to an LED light bulb, in particular to a thermoelectric separation power type light-emitting diode light bulb with high integration and high light efficiency. Background technique [0002] With the advancement of electronic technology, the use of LED lighting fixtures is becoming more and more common. LEDs use the luminous properties of semiconductors to emit light. Because LEDs are a green and environmentally friendly light source with long life, low power, and no radiation, they are widely used. Used in backlight, display, traffic lights, urban lighting and other fields. In the future, it will replace incandescent lamps and energy-saving lamps for lighting applications and become a new generation of lighting sources, widely used in indoor and outdoor general lighting and special lighting. [0003] The heat dissipated by traditional light-emitting diodes relies on the circuit substrate to conduct to the aluminum metal lamp holde...

AI Technical Summary

Problems solved by technology

[0003] The heat dissipated by traditional light-emitting diodes relies on the circuit substrate to conduct to the aluminum metal lamp holder and contact with the outside air to conduct and dissipate heat. The circuit substrate integrated with LED chips is connected to the metal lamp holder to achieve the effect of conduction and heat dissipation , but there is a potential safety hazard of electric leakage when the two fit together. At the same time, if you want to improve the heat dissipation effect, you need to increase the heat dissipation area of ​​the aluminum metal lamp holder. The heat dissipation effect of the aluminum metal lamp holder is limited by the limited volume of the lamp body, so it cannot be fully Meet the heat dissipation effect required by LEDs, especially high-power LED lights generate a lot of heat when they work for a long time. If the heat dissipation problem cannot be solved well, the service life of the lamps will be seriously affected. During use, it will lead to the aging of the circuit board and shorten the service life of the lamp body

At the same time, in order to achieve high brightness, high-power chips are used. The current high-power diode packaging technology is mainly single crystal high-power packaging. Although it can obtain high luminous flux, it has low luminous efficiency and high heat generation. Concentration on one chip has a great impact on the reliability and life of the chip. At the same time, the thermal channel and the electrical channel of the current LED diode structure share the same channel, and some designs do not even have independent heat conduction channels. The electrical channel mainly connects the positive and negative electrodes of the chip with the solder feet of the bracket by bonding gold wires, so the heat emitted by the chip will have a greater thermal impact on the diode circuit structure, affecting the reliability of the gold wire and the bracket welding. And because there is no independent heat conduction channel, it will also have a great impact on the light decay of the chip

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