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Soldering circuit plate and soldering method thereof

A welding method and circuit board technology are applied in the directions of printed circuits connected with non-printed electrical components, printed circuit components, and printed circuits assembled with electrical components. 104 Fracture, virtual welding and other problems, to achieve the effect of increasing the conductive path

Inactive Publication Date: 2008-08-27
AU OPTRONICS (SUZHOU) CORP LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, in this existing pull welding method, because only the welding pad 102 or 107 on one side of the hollow opening 101 is electrically connected to the electronic component 105 via its dedicated conductive line 104
Once in the pull-soldering process, if the amount of tin placed at the hollow opening 101 is insufficient or the speed of the pull-soldering is not well controlled, it is possible that the solder cannot be in full contact with the soldering pad 102 connected to the conductive line 104 on one side, resulting in The problem of false soldering, even the solder does not touch the soldering pad 102 connected with the conductive line 104 at all, forming a soldering open circuit, which reduces the reliability of the product
[0004] In addition, since the conventional circuit board only utilizes the welding pad 102 on one side of the hollow opening 101 to be electrically connected to the electronic component 105, when the circuit board is a flexible circuit board and needs to be bent, it is easier to make the welding pad 102 break with the conductive line 104

Method used

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  • Soldering circuit plate and soldering method thereof
  • Soldering circuit plate and soldering method thereof
  • Soldering circuit plate and soldering method thereof

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Embodiment Construction

[0025] Referring to FIG. 2 and FIG. 4 , the solderable circuit board 1 according to a preferred embodiment of the present invention includes a first circuit board 10 and two pairs of first soldering pads 121 and 122 , 131 and 132 . The first circuit board 10 has a through opening 11; two pairs of the first welding pads 121 and 122, 131 and 132 are arranged side by side along the opening 11, and each pair of the first welding pads 121 and 122, 131 and 132 is formed by the opening 11. The axes are respectively arranged on two opposite sides of the opening 11 . The first welding pad 121 located on one side of the opening 11 is electrically connected to one polarity pin of an electronic component 16 (such as a light emitting diode shown in the figure) via a first conductive circuit 141 . In addition, a first external conductive circuit 151 is further provided on the first circuit board 10 , one end of the first external conductive circuit 151 is connected to the first welding pad ...

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Abstract

The invention relates to a weldable circuit board and the welding method thereof. The weldable circuit board is used for being electrically connected to an electronic element and comprises at least a circuit board and at least a pair of welding pads. The circuit board is provided with at least an opening, and the pair of welding pads is respectively arranged at two opposite sides of the opening. One of the welding pads is electrically connected to the electronic element through a conducting line, and the other welding pad is electrically connected to the conducting line through an external conducting line, thus, the reliability of the electric connection between the circuit board and the electronic element can be enhanced.

Description

technical field [0001] The invention relates to a weldable circuit board and a welding method thereof. Background technique [0002] In current electronic products, sometimes in order to meet the design requirements of the product structure, two upper and lower circuit boards are electrically connected together by welding. One of the existing welding methods is pull welding, as shown in Figure 1 As shown, this existing welding method is to open a hollow opening 101 on the upper circuit board 100, and form two pairs of welding pads 102 and 103, 107 and 108, wherein each pair of welding pads such as 102 and 103 respectively The welding pads 102 located on two opposite sides of the opening 101 are electrically connected to one of the pins of an electronic component (such as the light-emitting diode 105 shown in the figure) through a conductive circuit 104, and the solder pads 102 located on the other side of the same side A welding pad 107 is electrically connected to another ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H05K1/18H05K3/34
Inventor 周益红熊百灵
Owner AU OPTRONICS (SUZHOU) CORP LTD
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