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A technology for electroplating pretreatment and ferrite, which is applied in the field of electroplating pretreatment of chip ferrite products, and can solve the problems of uneven products, decreased welding performance of products with coating thickness, etc.
Active Publication Date: 2010-06-16
SHENZHEN SUNLORD ELECTRONICS
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Second, the unevenness of the product in the electroplating process enables climbing plating to occur
The disadvantage of this
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[0024] Embodiment 1: The electroplating pretreatment method of ferrite products includes the following steps:
[0025] 1. Dissolve iron dispersant OA-01 (produced by Shanghai Mai Ke Import and Export Co., Ltd.) in propyl acetate, and formulate four kinds of iron dispersant OA-01 with content of 1‰, 2‰, 3‰, 5‰ of OA-01 solution.
[0026] 2. Put the semi-finished ferrite into a glass containing four OA-01 solutions. The volume ratio of the semi-finished ferrite to the OA-01 solution is 1:2.
[0027] 3. Put the four OA-01 solution glasses in the water of the ultrasonic cleaning equipment with a temperature of 55℃, the height of the water level is 2 / 3 of the height of the glass, and the shaking time is 10 minutes.
[0028] 4. Take out the processed ferrite semi-finished product and wash it with 80℃ pure water 5 times to complete the electroplating pretreatment process of the ferrite product.
[0029] Electroplating the above four semi-finished ferrite products after electroplating pretreat...
Example Embodiment
[0033] Embodiment 2: The electroplating pretreatment method of ferrite products includes the following steps:
[0034] 1. Dissolve iron dispersant OA-01 (produced by Shanghai Mai Ke Import and Export Co., Ltd.) in propyl acetate to prepare an OA-01 solution with a content of 3‰.
[0035] 2. Soak the semi-finished ferrite in a glass containing OA-01 solution for 10 hours, and the volume ratio of the semi-finished ferrite to the OA-01 solution is 1:2.
[0036] 3. Take out the processed ferrite semi-finished product and wash it with pure water at 80°C for 5 times to complete the electroplating pretreatment process of the ferrite product.
[0037] Electroplating the above semi-finished ferrite after electroplating pre-treatment: electroplating a nickel layer and a tin layer outside the silver end by barrel plating to obtain image 3 As shown in the finished ferrite inductor 6, the magnet surface of the ferrite inductor finished substrate 4 is covered with a protective film layer, and the ...
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Abstract
The invention discloses a chip ferrite product electro-plating pre-treatment method, including the following processes: semi-finished product of chip ferrite after silver ink firing is placed into 0.1-3% solution composed of ferric dispersant and propyl acetate solvent for soaking for 10-24 hours and then is taken out when the surface of magnet is covered with a protective film; pure water at 55-100 DEG C is used for washing for 3-5 times, residual ferric dispersant on silver tip is cleaned, and then electro-plating can be carried out after product is placed into basket. The principle includes that the characteristic that ferric dispersant has strong affinity effect on ferric ion and weak affinity effect on silver is utilized to form a protective film on the surface of the magnet of semi-finished product of chip ferrite after silver ink firing. The invention has the beneficial technical effects that the chip ferrite product electro-plating pre-treatment process is convenient in operation, effect is good, and time is short. The invention not only can prevent climbing plating from being produced by semi-finished products of the chip ferrite after silver ink firing in electro-plating process, but also defect plating can not be caused, and welding reliability of electroplated chip ferrite product is ensured.
Description
technical field [0001] The invention relates to a method for manufacturing chip ferrite products, in particular to a method for pre-plating electroplating of chip ferrite products. Background technique [0002] For chip ferrite products, there is a phenomenon that the electrodes at both ends extend toward the center in appearance, and the appearance defect of this kind of product is called climbing plating. The phenomenon of creep plating occurs in the electroplating process during the manufacturing process of the product. This electroplating process is the semi-product 1 after chip ferrite silver firing (see figure 1 ) on the terminal silver electrode 2 to deposit a layer of Ni metal layer and a layer of Sn metal layer respectively by electric current, that is, electroplating layer 3, so as to realize the weldability of the product. However, in actual operation, in addition to the terminal silver electrode 2, metal Ni and Sn will also be deposited inward along the termina...
Claims
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