Manufacturing method of aluminum-substrate printed circuit board in-hole metallization

Abstract

The invention relates to a manufacturing method of aluminum-substrate printed circuit board in-hole metallization, which comprises the following steps: 1, drilling holes on an aluminum-substrate printed circuit board; 2, placing the aluminum-substrate printed circuit board in a neutral medicinal liquid system of pyrophosphoric acid to plate copper, namely, to form a layer of copper protective layer on an aluminum substrate; 3, performing electroless copper deposition to form a copper layer at non-metal positions; 4, performing acidic copper plating; and 5, performing post aluminum-substrate printed circuit board manufacturing process. In the invention, the aluminum substrate is effectively prevented from contacting medium-strong acidic and alkaline medicinal liquid in the processes of electroless copper deposition and acidic copper plating, which ensures the smooth operation of the subsequent processing steps of the aluminum-substrate printed circuit board. The process guarantees the welding reliability and high heat conductivity of the product after subsequent surface mounting, sets a high-concentration and high-power consumption trend for the development of the design of circuit boards, greatly reduces crosstalk between signals, reduces electric noises and further optimizes signal transmission. The method has a simple process and low cost and makes large-scale industrial production convenient.

Description

technical field [0001] The invention relates to a method for manufacturing a printed circuit board (PCB), in particular to a method for manufacturing metallization in holes of an aluminum-based printed circuit board. Background technique [0002] With the continuous development of electronic technology, the requirements for power dissipation and inductance of printed circuit boards are getting higher and higher. For example, high-speed and high-power microprocessors, ASICs, and signal processors generally require a power dissipation of 2 to 10kw, and the common printed circuit board structure has gradually been unable to meet the demand. Under this market demand, metallized substrates emerged as the times require. Through the high thermal conductivity of metal substrates, the design of printed boards has broken through the previous limitations, and has a higher assembly density, higher integration, and greater power consumption. direction development. At present, aluminum-...

AI Technical Summary

Problems solved by technology

[0003] In the aluminum-based copper-clad laminate and printed circuit board industry, the most commonly used methods of processing aluminum are potassium dichromate treatment and micro-arc oxidation treatment. Potassium dichromate treatment process is complicated and pollutes a lot; The oxidation treatment method isolates the aluminum base by generating alumina, which cannot guarantee the thermal conductivity in the hole, so the above two methods cannot be well applied to the metallization production of aluminum base printed circuit board holes

Images