111results about How to "Reduce electrical noise" patented technology

This patent discloses electric motor assemblies for increasing vibratory power with less noise and massage assemblies using the same.

A heart assist system having an implantable pump conveying blood between two vascular locations and an extracorporeal system providing power and control signals to the pump. The system also includes a communication link having an implantable portion coupled to the implantable pump, an extracorporeal portion coupled to the extracorporeal system and an isolation portion between the implantable portion and the extracorporeal portion that minimizes the transmission of movement and forces from the extracorporeal portion to the implantable portion.

A BGA semiconductor device for high-speed operation and high pin counts has a base which is constituted by a core layer formed of wiring boards and surface layers provided on both sides of the core layer, and a semiconductor element mounted on the base. Through holes in a signal region of the core layer are disposed in an optimum through hole pattern in which power through holes and ground through holes are disposed adjacent to signal through holes.

To provide a magnetic reading head that features high resolution and low noise, and that can support a hard disk with terabit-level surface recording density. A current is caused to flow from a pinned layer with its magnetization direction fixed by an antiferro magnetic material, to a non-magnetic thin wire having a portion affected by an external magnetic field and a portion not affected by the external magnetic field, so that spin polarized electrons are accumulated in the non-magnetic thin wire. A distance between voltage terminals of a voltmeter is set to less than the spin diffusion length of the non-magnetic thin wire. A change in the external magnetic field modulates some of the accumulated spin polarized electron, but does not others. Accordingly, an electrical potential difference depending on the external magnetic field is generated between the both end surfaces of the non-magnetic thin wire, and measured with the voltmeter.

A circuit board is divided into two portions: a flexible printed circuit board; and a printed circuit board. On the flexible circuit board, movements whose layouts on the flexible circuit board are changed based on a design change in a dial plate due to a model change in a vehicle, light emitting diodes, a connector, a buzzer, and a changing-over switch are mounted. On the printed circuit board, a controller that radiates electrical noise during its operation is mounted. This enables a countermeasure for radiating of the electrical noise from the controller to be completed within the printed circuit board. This also enables a circuit design of the flexible printed circuit board to be easily performed. Man power for designing a combination meter can be thereby decreased; further, the combination meter capable of restricting generation of the electrical noise is achieved.

The invention discloses a micro-electromechanical system piezoelectric transducer and a manufacturing method thereof, in particular an array piezoelectric transducer and a manufacturing method, and belongs to the micro-electromechanical system field. The transducer adopts array design and is composed of at least two array elements. The wafer-level electrical series connection or parallel connection between the array elements is realized by a micro-electromechanical system (MEMS) process compatible with the semiconductor process, but at least one electrical series connection is provided; Semiconductor MEMS process can effectively control the parasitic capacitance generated by electrical series and parallel connection, thus effectively improve the sensitivity. The invention improves the sensitivity of the transducer through the wafer-level electric series and parallel connection between the array elements. Compared with the traditional piezoelectric ceramic transducer, the parasitic capacitance caused by the following circuit string and parallel connection is avoided. A wafer-level array MEMS transducer is proposed. The array transducer can be connected in series with different arrayelements according to the needs, so that the sensitivity of the transducer can be defined independently. The transducer also has the advantages of high signal-to-noise ratio, low cost, low electricalnoise and high signal-to-noise ratio.

The invention discloses a satellite ground micro-vibration test system. The satellite ground micro-vibration test system comprises a high-sensitivity sensor used for extracting vibration signals near a disturbance source or a load, an anti-aliasing filter used for performing anti-aliasing filtering on the vibration signals extracted by the high-sensitivity sensor to form piezoelectric signals, a high-modulus conversion rate acquirer used for generating the piezoelectric signals into digital signals and a high-precision controller used for controlling display, storage and analysis of the digital signals. According to the invention, the high-sensitivity sensor realizes small-magnitude acquisition of the vibration signals, digital signals are generated through a high-precision data acquisition card after the vibration signals are subjected to the anti-aliasing filtering, and subsequent process is performed to provide efficient input for the subsequent satellite vibration reduction or vibration isolation and environmental test and also realize verification of vibration reduction or vibration isolation performance. Therefore, the satellite ground micro-vibration test system, disclosed by the invention, has the advantages of satisfying demands on acquisition and analysis of micro-vibration signals and being of great importance in improving control precision and stability of a satellite platform.

A connector assembly includes a housing and contacts. The housing extends between mating and mounting interfaces. The mating and mounting interfaces have contact openings in a noise-reducing contact pattern. The contact openings in the pattern are arranged in pairs along respective contact lines. The contact lines of adjacent pairs are transverse to one another. The contacts extend through the contact openings and are arranged in the noise-reducing contact pattern through the housing between the mating and mounting interfaces to reduce at least one of electric noise and cross-talk in signals communicated by the contacts.

A low profile semiconductor package is disclosed including at least first and second stacked semiconductor die mounted to a substrate. The first semiconductor die may be electrically coupled to the substrate with a plurality of stitches in a forward ball bonding process. The second semiconductor die may in turn be electrically coupled to the first semiconductor die using a second set of stitches bonded between the die bond pads of the first and second semiconductor die. The second set of stitches may each include a lead end having a stitch ball that is bonded to the bond pads of the second semiconductor die. The tail end of each stitch in the second set of stitches may be wedge bonded directly to lead end of a stitch in the first set of stitches.

The invention discloses methods and systems for conductively coupling the body and more specifically the bare feet of an animal or human body to the earth in situations where conductive contact with the earth is otherwise impossible, such as inside a home or other building or in a bed. Various embodiments of the invention allow earth's mobile surface charge of free electrons to flow from the earth to the body, (similar to that which occurs naturally when an animal or human is standing barefoot on the earth), for the purpose of neutralizing excess or residual immune system-produced reactive oxygen species free radicals that cause physiological deficiencies and disturbances in the body such as acute or chronic inflammation.

A low profile semiconductor package is disclosed including at least first and second stacked semiconductor die mounted to a substrate. The first semiconductor die may be electrically coupled to the substrate with a plurality of stitches in a forward ball bonding process. The second semiconductor die may in turn be electrically coupled to the first semiconductor die using a second set of stitches bonded between the die bond pads of the first and second semiconductor die. The second set of stitches may each include a lead end having a stitch ball that is bonded to the bond pads of the second semiconductor die. The tail end of each stitch in the second set of stitches may be wedge bonded directly to lead end of a stitch in the first set of stitches.

The invention provides a microgyroscope driving and detecting device and method based on a digitization embedded system. The device comprises an embedded data unit, a simulation circuit unit and a wireless module. The embedded data unit is connected with the simulation circuit unit, the simulation circuit unit is connected with a bulk-acoustic-wave solid fluctuation microgyroscope, and the wireless module is integrated on the embedded data unit; a driving signal is sent to the simulation circuit unit through the embedded data unit and then sent to the bulk-acoustic-wave solid fluctuation microgyroscope, a signal of the bulk-acoustic-wave solid fluctuation microgyroscope is output to the simulation circuit unit, and then is preprocessed through the simulation circuit unit and output to the embedded data unit, and signal processing is carried out; the wireless module is responsible for outputting a control instruction between the device and the outside and a final signal. By means of the microgyroscope driving and detecting device and method based on the digitization embedded system, a gyroscope signal can be effectively detected and output, the accuracy is high, and the stability is good.