Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Preliminary treatment method for electroplating of chip ferrite product

A pre-plating treatment and ferrite technology, which is applied in the field of pre-plating treatment of chip ferrite products, can solve the problems of product unevenness, decreased welding performance of products with coating thickness, etc.

Active Publication Date: 2010-06-02
SUNLORD (SHANGHAI) ELECTRONICS CO
View PDF3 Cites 6 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Second, the unevenness of the product in the electroplating process enables climbing plating to occur
The disadvantage of this method is that the reduction of the thickness of the coating will cause a decrease in the welding performance of the product

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Preliminary treatment method for electroplating of chip ferrite product
  • Preliminary treatment method for electroplating of chip ferrite product
  • Preliminary treatment method for electroplating of chip ferrite product

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] Embodiment 1: The electroplating pretreatment method of ferrite products includes the following steps:

[0025] 1. Dissolve EDTA in water, adjust the pH to 7 with NaOH solution to increase the solubility, and prepare a saturated aqueous solution of EDTA.

[0026] 2. Put the semi-finished ferrite product in a glass containing a saturated aqueous solution of EDTA and soak, and the volume ratio of the semi-finished ferrite product to the saturated aqueous solution of EDTA is 1:2.

[0027] 3. Put the glass in the water of the ultrasonic cleaning equipment, the height of the water level is 2 / 3 of the height of the glass, and the vibration time is 10 minutes.

[0028] 4. Take out the processed ferrite semi-finished product and wash it with 80℃ pure water 5 times to complete the electroplating pretreatment process of the ferrite product.

[0029] Electroplating the above semi-finished ferrite after electroplating pre-treatment: electroplating a nickel layer and a tin layer outside the s...

Embodiment 2

[0033] Embodiment 2: The electroplating pretreatment method of ferrite products includes the following steps:

[0034] 1. Dissolve EDTA in water, adjust the pH to 7 with NaOH solution to increase the solubility, and prepare a saturated aqueous solution of EDTA.

[0035] 2. Put the semi-finished ferrite in a glass containing a saturated aqueous solution of EDTA and soak for 10 hours. The volume ratio of the semi-finished ferrite to the saturated aqueous solution of EDTA is 1:2.

[0036] 3. Take out the processed ferrite semi-finished product and wash it with pure water at 80°C for 5 times to complete the electroplating pretreatment process of the ferrite product.

[0037] Electroplating the above semi-finished ferrite after electroplating pre-treatment: electroplating a nickel layer and a tin layer outside the silver end by barrel plating to obtain image 3 As shown in the finished ferrite inductor 6, the iron ions on the surface of the magnet of the ferrite inductor finished substrate...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a preliminary treatment method for electroplating of a chip ferrite product, comprising the following steps: I. the chip ferrite semi-finished product after silver ink firing is carried out is arranged in ferrum complex saturated aqueous solution, and then is soaked at normal temperature, and the chip ferrite semi-finished product is taken out after complexing is carried out to ferric ions on the surface of a magnet completely; II. The chip ferrite semi-finished product is cleaned for 3-5 times by pure water with 55-100 DEG C, so as to clean the ferrum complex left on the silver end, and then the chip ferrite semi-finished product can be directly electroplated after being arranged in a basket; the design principle is that: the ferrum complex aqueous solution is utilized to remove the ferric ions left on the surface of the magnet of the chip ferrite semi-finished product after the silver ink firing is carried out to the chip ferrite, no ferric ions are deoxidized when in electroplating, so as not to form an overplating substrate. The preliminary treatment method for electroplating of the chip ferrite product has convenient operation, good effect and short time; the method not only can prevent the chip ferrite semi-finished product from generating the overplating phenomenon in the electroplating procedure, but also can not cause poor plating layer; in addition, the welding reliability of the chip ferrite after being electroplated is ensured.

Description

Technical field [0001] The invention relates to a method for manufacturing a chip ferrite product, in particular to a pretreatment method for electroplating a chip ferrite product. Background technique [0002] Chip ferrite products have the phenomenon that the electrodes at both ends extend to the center in appearance. The appearance defect of this type of product is called creep plating. The phenomenon of creeping plating occurs in the electroplating process during the manufacturing process of the product. The electroplating process is the second half of product 1 after silver firing in chip ferrite (see figure 1 A layer of Ni metal layer and a layer of Sn metal layer, namely, the electroplating layer 3, are respectively deposited on the silver electrode 2 of the terminal end of) by current to realize the weldability of the product. However, in actual operation, in addition to the tip silver electrode 2, metal Ni and Sn will also be deposited on the surface of the chip ferrite...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): C25D5/54
Inventor 郭海刘先忺戴春雷
Owner SUNLORD (SHANGHAI) ELECTRONICS CO
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com