The invention discloses a
tungsten-
copper alloy, a preparation method thereof and an electronic device, and belongs to the technical field of
metal-based composite materials. The preparation method of the
tungsten-
copper alloy comprises the following steps: adding a dispersing agent into an
ammonium metatungstate
saturated aqueous solution, uniformly stirring, and then adding
ammonia water to obtain a pore-forming agent solution of which the pH value is greater than or equal to 7.8; then
tungsten powder and the pore-forming agent solution are mixed and then subjected to ultrasonic treatment, obtained mixed
slurry is dried at the temperature of 20-60 DEG C, and composite
powder is obtained; the composite
powder is sequentially subjected to
decomposition heat treatment, reduction heat treatment and
sintering treatment, and a tungsten framework is obtained; the
decomposition heat treatment temperature lt; the temperature of reduction heat treatment is lt; the temperature of
sintering treatment; and the tungsten framework and the
copper are subjected to infiltration treatment, and the tungsten-
copper alloy is obtained. According to the preparation method for tungsten
copper alloy treatment, the problems of local thermal
stress concentration, crack expansion under high-temperature service, interface layering or thermal failure and the like existing in an existing tungsten
copper alloy can be solved to a certain extent.