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Three-dimensional LED (light emitting diode) luminous body and processing method thereof

A processing method and technology for luminous bodies, which are applied to semiconductor devices, electric solid state devices, electrical components, etc., can solve the problems of difficult fixing of lead wires, affecting the quality of lamp bodies, and easy falling off, so as to facilitate the fixing of production operations and reduce the difficulty of production operations. , the effect of reducing production costs

Inactive Publication Date: 2014-06-18
东莞市昱鸿光电有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The lead wire is used as its own stress support and fixed to the lamp holder in the bulb body. Since the transparent substrate of the light-emitting part has a width of about 1 mm and a thickness of about 0.5 mm, the lead wires are nano-scale gold wires. In production, it is difficult to weld and connect because the lead wire is not easy to fix. At the same time, there are defects that are easy to fall off and disconnect after welding, which affects the quality of the lamp body.

Method used

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  • Three-dimensional LED (light emitting diode) luminous body and processing method thereof
  • Three-dimensional LED (light emitting diode) luminous body and processing method thereof
  • Three-dimensional LED (light emitting diode) luminous body and processing method thereof

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Embodiment Construction

[0044] Such as Figure 1 to Figure 7 As shown: a three-dimensional LED illuminant, including a strip-shaped transparent substrate 1 and several LED chips 2 connected in series. The two ends of 1 are respectively provided with metal connectors 3, and the metal connectors 3 are provided with U-shaped bayonets 31, which are buckled on both ends of the transparent substrate 1, and the metal connectors 3 and the transparent substrate 1 are fixed with glue. , the lead wire 21 is electrically connected to the metal connector 3 .

[0045] Such as Figure 7 As shown, metal terminals 11 are printed on both ends of the transparent substrate 1 , and the U-shaped metal connector 3 is buckled on the metal terminals 11 .

[0046] The lead wire 21 is welded to the metal connector 3 .

[0047] The lead wire 21 is welded to its opposite metal terminal 11 and sandwiched between the metal connector 3 and the metal terminal 11 .

[0048] The glue is a conductive glue.

[0049] The substrate o...

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Abstract

The invention relates to a three-dimensional LED (light emitting diode) luminous body and a processing method of the three-dimensional LED luminous body. The three-dimensional LED luminous body comprises a strip-shaped transparent base plate and a plurality of LED wafers in tandem connection, wherein the LED wafers are positioned on the transparent base plate through transparent silica gel, and two ends of the LED wafers are provided with leads, wherein two ends of the transparent base plate are respectively provided with metal connecting elements, the metal connecting elements are provided with U-shaped clamp openings and are clamped and buckled at two ends of the transparent base plate, adhesives are adopted between the metal connecting elements and the transparent base plate for fixation, and the leads are electrically connected with the metal connecting elements. The invention aims at providing the three-dimensional LED luminous body with simple structure and stable connection, and the processing method of the three-dimensional LED luminous body.

Description

technical field [0001] The invention relates to an LED light source, more specifically, to a three-dimensional LED light source and a processing method thereof. Background technique [0002] With the advancement of electronic technology, the use of LED lighting fixtures is becoming more and more common. LEDs use the luminous properties of semiconductors to emit light. Because LEDs are a green and environmentally friendly light source with long life, low power, and no radiation, they are widely used. Used in backlight, display, traffic lights, urban lighting and other fields. In the future, it will replace incandescent lamps and energy-saving lamps for lighting applications and become a new generation of lighting sources, widely used in indoor and outdoor general lighting and special lighting. [0003] The heat dissipated by traditional light-emitting diodes relies on the circuit substrate to conduct to the aluminum metal lamp holder and contact with the outside air to condu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/075H01L33/62H01L33/64
CPCH01L2924/181H01L2224/48091H01L2224/48137H01L2224/73265H01L2924/00014H01L2924/00012
Inventor 欧南杰
Owner 东莞市昱鸿光电有限公司
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