Method for handling electric circuitry, and structure

A conductive circuit and manufacturing method technology, applied in the direction of conductive pattern formation, printed circuit components, etc., can solve the problems of inability to increase circuit layout density, easy to create public nuisance, copper foil falling off, etc.
CN1960604AInactive Publication Date: 2007-05-09何建汉
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Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
何建汉
Publication Date
2007-05-09
Estimated Expiration
Not applicable · inactive patent

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Abstract

The method comprises: in the first, providing an insulated baseboard; etching a groove of circuit on the insulated baseboard; filling in a first colloid in the groove of circuit used for generating bridge-erecting action with the insulated colloid; finally, filling in a second colloid capable of generating chemical reaction with the first colloid to form a wire colloid in the groove of circuit.
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Description

technical field

[0001] The invention relates to a manufacturing method and structure of a conductive circuit, especially a conductive circuit of conductive colloid formed by a first colloid and a second colloid. Background technique

[0002] The printed circuit board is a circuit board composed of drawing the electrical wiring connecting the circuit parts into a wiring pattern according to the circuit design, and then reproducing the electrical conductor on the insulator by the mechanical processing and surface treatment specified by the design. In other words, the printed circuit board refers to the substrate before it is equipped with electronic components.

[0003] In the known printed circuit board, the conductive circuit is formed by first pasting the copper foil layer on the insulating substrate, and then using procedures such as drilling, developing and etching.

[0004] However, in this known method, the insulation value between the lines is not high enough because ...

Claims

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