123results about How to "Reduce the packing density" patented technology

An IC includes a substrate having a semiconductor top surface, a plurality of metal interconnect levels having inter-level dielectric (ILD) layers therebetween on the top surface, and a bottom surface. A plurality of through substrate vias (TSVs) extend from a TSV terminating metal interconnect level downward to the bottom surface. The plurality of TSVs include an electrically conductive filler material surrounded by a dielectric liner that define a projected volume. The projected volume includes a projected area over the electrically conductive filler material and a projected height extending upwards from the TSV terminating metal interconnect level to a metal interconnect level above, and a projected sidewall surface along sidewalls of the projected volume. A crack suppression structure (CSS) protects TSVs and includes a lateral CSS portion that is positioned lateral to the projected volume and encloses at least 80% of the projected sidewall surface.

A longitudinal G sensor 51 and a roll rate sensor 54 are mounted onto a back surface 61b of a substrate 61 in parallel with an X-axis and a lateral G sensor 52 and a pitch rate sensor 55 are mounted thereon in parallel with a Y-axis, the longitudinal G sensor 51 and the lateral G sensor 52 are positioned thereon in close vicinity to each other, and the roll rate sensor 54 and the pitch rate sensor 55 are positioned thereon in close vicinity to each other, while a vertical G sensor 53 and a yaw rate sensor 56 are mounted onto a surface 61a of the substrate 61 in orthogonal to a Z-axis and also the vertical G sensor 53 and the yaw rate sensor 56 are mounted thereon in close vicinity to each other.

The present invention provides a high frequency power amplifier of an open-loop type, which outputs a signal having a level corresponding to an output level required under control of a power supply voltage for each output power FET, based on a control signal for the output level. The high frequency power amplifier is provided with a bias voltage generating circuit which generates a gate bias voltage of each output power FET according to an output voltage of a power control circuit for controlling the power supply voltage for the output power FET, based on the control signal for the output level.

A conditioning detergent composition comprised of a surfactant portion comprising at least one of anionic, amphoteric, and nonionic surfactants and a conditioner portion comprising at least one branched cationic polymers and a silicone which is different from said branched cationic polymer and which is matrix soluble. The conditioning detergent composition imparts cleansing, wet detangling, dry detangling and manageability to hair and which is relatively non-irritating and thus suitable for use by young children and adults having sensitive skin and eyes. The conditioning detergent composition is able to provide such benefits in an aesthetically pleasing formulation without the need for suspending agents, opacifiers, or pearlizing agents.

The invention discloses a pyrrole aromatic diamine containing a phthalic nitrile structure and a preparation method thereof. 2-bromoacetophenone is taken as a raw material to prepare 4-(2,5-bi(4-aminophenyl)-pyrryl) phthalonitrile by reaction of four steps, namely condensation, closed loop, nitration and reduction. The aromatic diamine disclosed by the invention is high in purity, and stable at room temperature, and is an important monomer component for preparing a plurality of polyimides, and an application of the polyimides in the fields such as a high-performance fiber, organic luminescent materials, a functional coating, a special adhesive and the like is expanded.

Sintered fiber filters are provided that can afford high particle capture efficiency and/or low pressure drop during operation, and are useful in applications such as semiconductor processing. The shape of at least a portion of the individual fibers (e.g., metal fibers) used to make the filter have a three-dimensional aspect, which allows for a low packing density and high porosity filtration media. Certain filters have a cylindrical or tube-like shape with tapered ends of higher density. Methods of making such filters, for example, using axial pressing, are also described.

A semiconductor device includes an output pad and a surge absorption unit formed above a semiconductor region of a first conductivity type. The surge absorption unit includes: a semiconductor island region of a second conductivity type; a buried layer of the second conductivity type formed between a bottom of the semiconductor island region of the second conductivity type and the semiconductor region of the first conductivity type; a dopant layer of the first conductivity type formed in an upper portion of the semiconductor island region of the second conductivity type and connected to have the same potential as the semiconductor region of the first conductivity type; a dopant layer of the second conductivity type formed in an upper portion of the dopant layer of the first conductivity type and electrically connected to the output pad; and a ring layer of the second conductivity type surrounding the dopant layer of the first conductivity type and reaching the buried layer of the second conductivity type. In this device, the ring layer of the second conductivity type is electrically connected to a terminal with a fixed potential and contains a dopant of the second conductivity type having a higher concentration than the semiconductor island region of the second conductivity type.

The invention provides a display device, an array substrate and a driving method thereof. Sub pixels from a first to a sixth in a each pixel unit in the array substrate are arranged in a two-row three-column mode; a first gate line in each gate line group is connected with the first sub pixel and the third sub pixel; a second gate line is connected with the second sub pixel and the fourth sub pixel; a third gate line is connected with the fifth sub pixel and the sixth sub pixel; a first data line in a first sub data line group is connected with the first sub pixel, the fourth sub pixel and the fifth sub pixel; and a second data line is connected with the second sub pixel, the third sub pixel and the sixth sub pixel. In comparison with the prior art, one data line is reduced for each three columns of sub pixels, the arrangement density of the data lines in a transition region can thus be reduced, and short circuit or broken circuit of the data lines can be avoided.

The present invention provides a carbon composite material which is a molded material comprising (a) an expanded graphite powder and (b) a thermoplastic resin or a thermosetting resin or a fired product of the thermosetting resin, and the expanded graphite powder (a) being dispersed in the component (b), wherein the expanded graphite powder has an average particle diameter of 5-12 mu m and at least 80% of the total particles of the expanded graphite powder have particle diameters of 0.1-20 mu m; and a process for producing a carbon composite material, which comprises mixing and dispersing a thermoplastic or thermosetting resin and the expanded graphite powder as mentioned above, and then pressure-molding the resulting mixture at room temperature to 400 DEG C., or a process for producing a carbon composite material, which comprises mixing and dispersing a thermosetting resin and the expanded graphite powder as mentioned above, pressure-molding the resulting mixture at room temperature to 400 DEG C., and firing the resulting molding at 700-3,000 DEG C. in a non-oxidizing atmosphere. The carbon composite material produced by the above process is free from the problems of the prior art and is superior in both gas non-permeability and electroconductivity.

The invention discloses a green roof for regulating and controlling aiming at the defects of high radial flow and pollution load yield of a hard roof in a city during rainy days. The green roof consists of a vegetable layer, a plant layer, a filter layer, a drain layer and a waterproof layer, wherein the vegetable layer comprises plants with strong capability of resisting drought stress and controlling nitrogen and phosphorus and is extensively managed; the planting layer is formed by mixing fly ash, porcelain granules and sandy loam or loamy sand; the filter layer comprises geotextile and waste sponge; and the drain layer consists of light filler. The green roof has the following advantages that the planted plants have strong survivability and are simply managed; nutrient substances in the planting layer have low background content, so that the phenomenon that nutrient salts are separate out caused by a leaching action during rainy days is avoided; the filter layer not only has a favorable capability of intercepting the granules, but also has stronger capabilities of absorbing and storing water; the drain layer consists of a waste rod brick and tile sheet, porcelain granules or slag with a certain mechanical strength; the green roof has small density; and in addition, the water quality of a radial flow of the green roof is further ensured by using an adsorption performance of the green roof.

The present invention provides for a copper CMP slurry composition which comprises a complexing agent, an oxidizer, an abrasive and a passivating agent. The present invention also provides for a method of chemical mechanical planarization of a copper conductive structure which comprises administering the copper CMP slurry composition during the planarization process.

The invention relates to a fluorine-containing flexible-rigid polyimide film, and a preparation method and application thereof. The film comprises flexible fluorine-containing aromatic diamines, aromatic dianhydride-1, rigid aromatic diamines and rigid aromatic dianhydrides. The preparation method of the film comprises the following steps: preparing a fluorine-containing flexible-rigid block polyamic acid resin solution from flexible fluorine-containing aromatic diamines, and carrying out solvent removal and imidization to finally form the polyimide film. The polyimide film can be used as an insulation film base plate material for flexible printed circuits, an insulation film base plate material for flexible photoelectric display devices and an insulation film base plate material for flexible film solar cells. The resin has low thermal expansion coefficient, low dielectric constant and low water absorptivity, and has important application value in the fields of micro-electronics, photoelectric display and the like.

The invention relates to production equipment of compound non-woven fabric absorber, which comprises a transmission unit, a lapping unit and a consolidating unit. The lapping unit is used to form a non-woven fabric fiber compound on the transmission unit and the non-woven fabric fiber compound is formed by at least a first thermally melting fiber layer and a hydrophilic fiber layer that are laminated. The transmission unit is used to transmit the non-woven fabric fiber compound in a predetermined transmission direction. the consolidating unit is used to provide at least a pulse hot air which is used to spray and impact the non-woven fabric fiber compound so as to soften the thermally melt fiber of the first thermally melting fiber layer and introduce the softened thermally melt fiber into the hydrophilic fiber layer so as to form consolidating points. The invention further relates to a preparation process of the compound non-woven fabric absorber and the compound non-woven fabric absorber.

A semiconductor device includes: a semiconductor substrate; a heat sink mounted on an upper surface of the semiconductor substrate; wirings formed on a lower surface of the semiconductor substrate; and the like. The heat sink is mounted on the upper surface of the semiconductor substrate, and a planar size thereof is approximately the same as that of the semiconductor substrate. Moreover, the heat sink has a thickness of 500 μm to 2 mm, and may be formed to be thicker than the semiconductor substrate. By using the heat sink to reinforce the substrate, a thickness of the semiconductor substrate can be reduced to, for example, about 50 μm. As a result, a thickness of the entire semiconductor device can be reduced.

The invention discloses an oil-natural gas drilling PDC drill bit, which comprises the following parts: drill body, main knife-wing, second knife-wing, big diameter PDC cutting part, small diameter PDC cutting part and nozzle, wherein the main knife-wing and second knife-wing appear in pairs and interseparate upwards on the drill; big diameter PDC cutting part is fixed on the main knife-wing and small diameter PDC cutting part is fixed on the second knife-wing; the thickness and back inclination angle of big diameter PDC cutting part are less than the small diameter PDC cutting part's; the outcropping height of big diameter PDC cutting part is higher than small diameter PDC cutting part's. The structure can drill in the alternative hard-and-soft formation effectively.

The invention discloses a current monitoring circuit with the accurate current-limit function. The current monitoring circuit with the accurate current-limit function comprises an operational amplifier, wherein a forward input end and a reverse input end of the operational amplifier are respectively connected with a resistor in series, the resistors are symmetrical to each other, the reverse input end of the operational amplifier is connected to the output end of the operational amplifier in series through a resistor R1 and a capacitor C1, the symmetrical resistors which are connected with the operational amplifier in series are further in ground connection, an output filtering loop is formed by an inductor L1 and a capacitor CL, a load RL is connected to the capacitor CL in parallel, and is connected with a feedback resistor Rf in series, the feedback resistor Rf is connected to the forward input end of the operational amplifier am1 in series, and is used for carrying out sampling on current change signals of the output filtering loop, and the sampled current change signals are converted into voltage signals to be input into the forward input end of the operational amplifier. The current monitoring circuit with the accurate current-limit function directly detects output current signals, the output current signals are converted into the voltage signals through the resistors, and compared with reference voltage, the level of an enabling end can be reduced through output overturn of the operational amplifier, and short-circuit protection is achieved.

The invention discloses a compound microbial active filling material for removing sulphur-containing repugnant substances, as well as preparation and application of the compound microbial active filling material. Ochrobactrum anthropi SL1 and aquamicrobium defluvii SU1 related in the invention are isolated bacteria obtained in a reactor for processing repugnant substances, such as H2S, in a water pollution control laboratory of the ecological environment research centre of the Chinese academy of sciences. The bacterial strains are preserved in the general microbial centre of the Chinese general microbial strain preservation and management committee. The preservation numbers are CGMCC No.7400 and CGMCC No.7399 respectively. The compound microbial active filling material disclosed by the invention has the advantages of being large in specific area, high in porosity, good in air permeability, low in resistance, high in bacterial cell loading capacity and less prone to run away; and because of being loaded with ochrobactrum anthropi SL1 and aquamicrobium defluvii SU1, the compound microbial active filling material is difficult to decay and deform in a bioreactor for purifying waste gas, and therefore, the compound microbial active filling material can be used for a long time and is applied to complex processing conditions.

The invention discloses a wheat straw powder composite wire for fused deposition modeling and a preparation method and a 3D (Three-dimensional) printing method thereof, and belongs to the technical field of a preparation technology and application of composite materials. At present, a 3D printing technology is in rapid development, but materials suitable for 3D printing are in slow development. The wheat straw powder composite wire for the fused deposition modeling is prepared from the following raw materials in parts by weight: 1 to 5 parts of wheat straw powder, 95 to 99 parts of polylactic acid, 0.02 to 0.4 part of a coupler, 0.5 to 1.5 parts of a compatilizer and 0.2 to 1 part of a lubricant. A product printed by the wheat straw powder composite wire for the fused deposition modeling, disclosed by the invention, has a woodiness feeling, the raw materials of the wheat straw powder and the polylactic acid are completely biodegradable, and any pollution to an environment cannot be caused.