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Fluorine-containing flexible-rigid polyimide film, and preparation method and application thereof

A technology of polyimide film and hard block, which is applied in the field of fluorine-containing soft-hard block polyimide film and its preparation, can solve the problems of low thermal expansion coefficient, high dielectric constant, low dielectric constant, etc. Achieve the effect of low thermal expansion coefficient, large free volume and low dielectric constant

Active Publication Date: 2016-05-25
INST OF CHEM CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Japan's KANEKA company discloses a method for preparing a soft-hard block polyimide film. The prepared polyimide film has a low thermal expansion coefficient and good fracture toughness, and is suitable for manufacturing printed circuit boards. ; However, the prepared polyimide film has a high dielectric constant and high water absorption, which is difficult to meet the application requirements of high-frequency printed circuits. Therefore, the development of low thermal expansion coefficient and low water absorption and low dielectric The electric constant of the polyimide film has important value

Method used

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  • Fluorine-containing flexible-rigid polyimide film, and preparation method and application thereof
  • Fluorine-containing flexible-rigid polyimide film, and preparation method and application thereof
  • Fluorine-containing flexible-rigid polyimide film, and preparation method and application thereof

Examples

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Embodiment 1

[0079] This embodiment provides a polyimide film, containing flexible fluorine-containing aromatic diamine, aromatic dianhydride-1, rigid aromatic diamine and rigid aromatic dianhydride;

[0080] Wherein the flexible fluorine-containing aromatic diamine is preferably 6FBAPP, the aromatic dianhydride-1 is preferably a mixture of BTDA and PMDA, the rigid aromatic diamine is preferably p-PDA, and the rigid aromatic dianhydride is preferably PMDA;

[0081] Wherein, the molar ratio 6FBAPP:(BTDA+PMDA):p-PDA:PMDA=40:(10+26):60:64.

[0082] The resin preparation method is as follows:

[0083] (1) Weigh 10.37g (0.02mol) of flexible fluorine-containing aromatic diamine 6FBAPP and 63.16g (0.86mol) of organic solvent DMF in a 250ml round-bottomed flask equipped with mechanical stirring and nitrogen inlet and outlet, and stir in a nitrogen atmosphere to form homogeneous solution, then place the flask in an ice-water bath (0°C), add 1.6111g (0.005mol) aromatic dianhydride-1BTDA and 2.8356g...

Embodiment 2

[0097] This embodiment provides a polyimide film, containing flexible fluorine-containing aromatic diamine, aromatic dianhydride-1, rigid aromatic diamine and rigid aromatic dianhydride;

[0098] Wherein the flexible fluorine-containing aromatic diamine is preferably 6FBAPP, the aromatic dianhydride-1 is preferably a mixture of BTDA and PMDA, the rigid aromatic diamine is preferably p-PDA, and the rigid aromatic dianhydride is preferably PMDA;

[0099] Wherein, the molar ratio 6FBAPP:(BTDA+PMDA):p-PDA:PMDA=50:(10+35):50:55.

[0100] The resin preparation method is as follows:

[0101] (1) Weigh 12.9625g (0.025mol) flexible fluorine-containing aromatic diamine 6FBAPP and 349.42g (4.78mol) organic solvent DMF in a 500ml round bottom flask equipped with mechanical stirring and nitrogen inlet and outlet, and stir in a nitrogen protective atmosphere to form homogeneous solution, then put the flask in a low-temperature reaction box (-10°C), add 1.6111g (0.005mol) aromatic dianhydri...

Embodiment 3

[0115] This embodiment provides a polyimide film, containing flexible fluorine-containing aromatic diamine, aromatic dianhydride-1, rigid aromatic diamine and rigid aromatic dianhydride;

[0116] Wherein the flexible fluorine-containing aromatic diamine is preferably 6FBAPP, the aromatic dianhydride-1 is preferably a mixture of BTDA and PMDA, the rigid aromatic diamine is preferably p-PDA, and the rigid aromatic dianhydride is preferably PMDA;

[0117] Wherein, the molar ratio 6FBAPP:(BTDA+PMDA):p-PDA:PMDA=60:(10+44):40:46.

[0118] The resin preparation method is as follows:

[0119] (1) Weigh 15.5550g (0.030mol) flexible fluorine-containing aromatic diamine 6FBAPP and 65.89g (0.90mol) organic solvent DMF in a 250ml round bottom flask equipped with mechanical stirring and nitrogen inlet and outlet, and stir in a nitrogen protective atmosphere to form Homogeneous solution, then place the flask in a constant temperature water bath (30°C), add 1.6111g (0.005mol) aromatic dianhy...

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Abstract

The invention relates to a fluorine-containing flexible-rigid polyimide film, and a preparation method and application thereof. The film comprises flexible fluorine-containing aromatic diamines, aromatic dianhydride-1, rigid aromatic diamines and rigid aromatic dianhydrides. The preparation method of the film comprises the following steps: preparing a fluorine-containing flexible-rigid block polyamic acid resin solution from flexible fluorine-containing aromatic diamines, and carrying out solvent removal and imidization to finally form the polyimide film. The polyimide film can be used as an insulation film base plate material for flexible printed circuits, an insulation film base plate material for flexible photoelectric display devices and an insulation film base plate material for flexible film solar cells. The resin has low thermal expansion coefficient, low dielectric constant and low water absorptivity, and has important application value in the fields of micro-electronics, photoelectric display and the like.

Description

technical field [0001] The invention relates to the technical field of polyimide materials, in particular to a fluorine-containing soft-hard block polyimide film, a preparation method and an application thereof. Background technique [0002] Flexible printed circuits are usually made of flexible high heat-resistant polyimide film as an insulating substrate, and a flexible copper-clad substrate is formed after bonding conductive metal copper foil on its surface, and then manufactured by photolithography. The polyimide insulating film of the traditional flexible copper-clad substrate and the conductive metal copper foil are bonded by a layer of epoxy resin or polyacrylic resin adhesive (three-layer copper-clad substrate). This flexible printed circuit is heat-resistant Poor performance, resulting in its solder resistance, dimensional stability, and electrical stability, which are difficult to meet the application requirements of high-density and thinner microelectronic devices...

Claims

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Application Information

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IPC IPC(8): C08G73/10C08J5/18C08L79/08
CPCC08G73/1071C08J5/18C08J2379/08
Inventor 杨士勇王振合何民辉
Owner INST OF CHEM CHINESE ACAD OF SCI
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