The application provides a manufacturing method of a high-heat-dissipation HDI circuit board, which realizes
chip sinking through manufacturing of a
chip Die bond area; after overall
assembly is completed, the overall space utilization is high, the volume of the final product can be reduced, the electronic product
layout density is improved, and the product performance is improved; the
chip sinking surface is connected with the holes of the
copper paste through the sinking layer
copper foil, and is further extended and connected to the surface
copper layer, so that the heat dissipation area is greatly improved. The HDI copper paste
blind hole, the buried copper block and the through-type copper paste plug hole form an integrated three-dimensional heat dissipation path, the heat conduction efficiency is high, the
thermal resistance is small, the chip heat can be quickly dredged, and the heat dissipation effect is greatly improved; the structure parameters are matched with each other, the high-density
interconnection, the heat dissipation performance and the
processing process requirements are considered, the use requirements of high-power and high-integration electronic products are met, and the method is worth promoting.