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Combined planar heat pipe radiator used for cooling light emitting diode (LED)

A technology of flat heat pipes and radiators, applied in cooling/heating devices of lighting devices, indirect heat exchangers, lighting and heating equipment, etc., can solve the problem of poor start-up characteristics of pulsating heat pipes, inappropriate high-power LEDs, heat pipes of heat sinks Small space and other problems, to achieve the effect of improving start-up performance, simple and cheap processing, and increasing overall heat exchange capacity

Inactive Publication Date: 2010-11-17
SHANGHAI JIAO TONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This technology uses the high heat transfer characteristics of the pulsating heat pipe in a steady state to dissipate heat. However, due to the geometrical constraints of the pulsating heat pipe itself, the distance between the tubes is very large, and the space available for the heat pipe on the cooling plate is very small.
At the same time, because the start-up characteristics of the pulsating heat pipe itself are not good, and the maximum heat transfer capacity is not large, it is not suitable for high-power LEDs to use the pulsating heat pipe alone.

Method used

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  • Combined planar heat pipe radiator used for cooling light emitting diode (LED)
  • Combined planar heat pipe radiator used for cooling light emitting diode (LED)
  • Combined planar heat pipe radiator used for cooling light emitting diode (LED)

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Embodiment Construction

[0024] The embodiments of the present invention are described in detail below. This embodiment is implemented on the premise of the technical solution of the present invention, and detailed implementation methods and specific operating procedures are provided, but the protection scope of the present invention is not limited to the following implementation example.

[0025] like figure 1 and figure 2 As shown, this embodiment includes: aluminum plate 1, die-cast heat pipe group channel fin cover plate 2, pulsating heat pipe channel 3, inner wire mesh heat pipe group channel 4, outer wire mesh heat pipe group channel 5, inner gravity The heat pipe group channel 6 and the peripheral gravity heat pipe group channel 7, wherein: the upper and lower ends of the aluminum plate 1 are respectively fixedly connected with the LED substrate 8 and the die-cast heat pipe group channel fin cover plate 2, the pulsating heat pipe channel 3, the inner surrounding wire Mesh heat pipe group cha...

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Abstract

The invention discloses a combined planar heat pipe radiator used for cooling a light emitting diode (LED) in the technical field of LEDs. The combined planar heat pipe radiator comprises an aluminium plate, a die-casting heat pipe set channel fin cover plate, pulse heat pipe channels and shared channels, wherein each shared channel consists of an internal mesh heat pipe set channel, an external mesh heat pipe set channel, an internal gravity heat pipe set channel and an external gravity heat pipe set channel; the pulse heat pipe channels have an independent sealed annular structure comprising a plurality of bending sections and are uniformly distributed on the inner surface of the whole aluminium plate; and the shared channels are arranged inside the pulse heat pipe channels in a staggered mode. The combined planar heat pipe radiator, as a novel large-power LED cooling method, has the advantages of large radiation area, high radiation efficiency and startup performance, light weight, high temperature uniformity, compact structure and convenient process.

Description

technical field [0001] The invention relates to a device in the technical field of light-emitting diodes, in particular to a combined flat heat pipe radiator for cooling LEDs with power above 100W. Background technique [0002] With the continuous expansion of LED application fields, high-power LEDs gradually show their unique advantages. The high-power LED chip is integrated and packaged on a metal base LED substrate, and an optical cup is arranged on the metal base. This package structure has high light efficiency and easy control of the light angle, but the problem of heat dissipation has not been solved, which has hindered the application of high-power LEDs. The bottleneck problem in the field of lighting. The photoelectric conversion efficiency of the high-power LED packaging structure is about 20%, and about 80% of the electric energy is directly converted into heat energy and emitted. The performance and lifetime of LEDs are inversely proportional to the temperature...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F21V29/00F21Y101/02F21V29/51F21V29/74
CPCF28D15/0266
Inventor 刘振华李元阳
Owner SHANGHAI JIAO TONG UNIV
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