The invention provides a VCP copper plating process for a flexible printed circuit board. The VCP copper plating process comprises the following steps of firstly, cleaning a vertical continuous copperplating tank; continuously washing with deionized water, adding the deionized water, copper sulfate pentahydrate, sulfuric acid, hydrochloric acid and a copper-plated additive (polyethylene glycol, sodium polythiodipropionate and Janus Green) into the copper plating tank, starting a circulation filter pump, inputting the to-be-electroplated flexible circuit board into the tank, and starting the current; after electroplating, taking out the circuit board, and cleaning the circuit board with water; and after blow-drying by hot air, transferring the circuit board into a pattern transferring procedure. According to the vertical continuous (VCP) copper plating process for the flexible printed circuit board, after the flexible circuit board is plated copper, the flexibility is stronger and theexpansion shrinkage of the flexible circuit board is smaller, and the deep plating capability of a through hole is higher, so that the bending resistance of the flexible circuit board is greatly improved, the film alignment in subsequent pattern transfer is facilitated, etching of the flexible circuit board with high-density line width/line distance (0.05 mm/0.05 mm) is more facilitated, the product quality and the product reliability are improved, the production process is pollution-free, and the process is suitable for industrial production.