The invention discloses an exploding foil integrated chip based on low-temperature co-fired ceramic and a preparation technology thereof. The exploding foil integrated chip comprises a ceramic substrate, a metal layer, a flier-plate layer, an acceleration cavity, an explosive charging groove and an explosive column and further comprises metal via holes formed in the ceramic substrate, slurry, a welding disc zone, a Pd/Ag layer and other structures capable of being connected with other parts conveniently, and the welding disc zone, the Pd/Ag layer and the other structures are arranged on the back of the ceramic substrate. The ceramic substrate serves as a reflecting backboard in the integrated chip; the metal layer comprises a bridge zone, a transition zone and a guide belt; the flier-platelayer comprises a ceramic flier plate formed by integrally sintering a ceramic belt blank, and a Parylene C/W-Ti/Cu composite flier plate; the acceleration cavity is used for providing an acceleration space for the flier plate; and the explosive charging groove is used for providing precise position for placement of the explosive column. Compared with the prior art, the exploding foil integratedchip has the advantages that through the low-temperature co-fired ceramic technique, an exploding foil exploder is higher in integration degree and smaller in size, mass production can be achieved, the product consistency is improved, and the cost is greatly reduced.