The invention discloses a DRAM and a forming method thereof. The method comprises the following steps: after the active region and the isolation layer are etched to form a word line trench, continuously etching the isolation layer along the side wall of the word line trench in the isolation layer, so that the width of the word line trench in the isolation layer is increased, and the width of the part of the word line trench in the isolation layer is greater than that of the part of the word line trench in the active region; and forming a word line structure in the word line trench, wherein thewidth of the part of word line structure in the isolation layer is greater than the width of the part of word line structure in the active region. The formed word line structure is wavy, so that on one hand, the resistance of the word line structure is reduced; and on the other hand, a channel is formed at the boundary of the active region, that is, the width of the conductive channel of a deviceis increased, and the conduction current of the transistor of the DRAM is increased, so that the reading speed of memory is increased, and the integration level of the transistor of the DRAM is increased.