46results about How to "Layers is relatively thick" patented technology

An oxide and non-oxide based ceramic matrix composite (“CMC”) component for a combustion turbine engine has a solidified ceramic core with a three-dimensional preform of ceramic fibers, embedded therein. Engineered surface features (“ESFs”) are cut into an outer surface of the core and fibers of the preform. A thermal barrier coat (“TBC”) is applied over and coupled to the core outer surface and the ESFs. The ESFs provide increased surface area and mechanically interlock the TBC, improving adhesion between the ceramic core and the TBC.

The invention provides an illumination device (100) comprising a translucent exit window (200), one or more transmissive windows (300), arranged upstream from LED(s) and downstream from the translucent exit window (200), and one or more luminescent material layers (400), which may particularly be coated to the downstream and upstream faces of the transmissive windows (300).

A brazed joint between an armature bar strand package and an end fitting includes a plurality of strands arranged in a tiered array and forming the strand package; a cavity in the end fitting, free ends of the plurality of strands extending through opening in the end fitting and received in the cavity; and an essentially phosphorous-free copper-silver braze alloy joining the free ends of the plurality of strands to each other and to interior surfaces of the end fitting.

An organic thin film transistor comprising: a substrate; a source electrode and a drain electrode defining a channel; a layer of insulating material disposed over the source and drain electrodes; a layer of organic semi-conductive material extending across the channel; a layer of dielectric material; and a gate electrode disposed over the layer of dielectric material.

Firearm projectiles and methods of manufacturing firearm projectiles from a supply of clad wire. In some embodiments, the clad wire is manufactured as electrical wire, such as copper-clad steel wire. Bullets and shot, as well as methods of forming bullets and shot, from clad wire are disclosed.

An etchant includes: 5 to 20 wt % of persulfate, 1 to 10 wt % of at least one compound of an inorganic acid, an inorganic acid salt, or a mixture thereof, 0.3 to 5 wt % of a cyclic amine compound, 1 to 10 wt % of at least one compound of an organic acid, an organic acid salt, or a mixture thereof, 0.1 to 5 wt % of p-toluenesulfonic acid, and water, based on the total weight of the etchant. A copper-titanium etchant further includes 0.01 to 2 wt % of a fluoride-containing compound. A method of forming a display device using the etchant, and a display device, are also disclosed.

A hot runner nozzle system (500) comprising a nozzle tip (100) adjacent to a nozzle (405) in series, and a retainer (400) adjoining both the nozzle tip (100) and the nozzle (405) in parallel, the retainer (400) having a first retainer thread (435), for connection to a nozzle thread (420) to form a first seal (450) between the nozzle end (440) of the retainer (400) and a nozzle shoulder (430), a second retainer thread (460), for connection to a tip thread (455) to form a second seal (470) between the inlet end (475) of the nozzle tip (100) and the gate end (425) of the nozzle (405), a seal ring (115) for creating a gate seal (496) with a gate insert (120), and a plurality of flats (410) thereon to facilitate torquing of the retainer (400) to the nozzle (405), the torque value applied to the retainer (400) being about two to four times of that applied to the nozzle tip (100) to facilitate removal of the nozzle tip (100) independent of the retainer (400).

A semiconductor device and method of manufacturing the same are disclosed. A conductive structure, spacers and a dielectric layer are formed on a substrate. Thereafter, a portion of the cap layer, a portion of the spacers and a portion of the dielectric layer of the conductive structure are removed to form a funnel-shaped opening. The shoulder section of the conductive layer exposed by the funnel-shaped opening is removed to form a shoulder recess. A liner layer is formed on the sidewall of the funnel-shaped opening and then a bottom plug is formed inside the funnel-shaped opening. Another dielectric layer is formed over the substrate. A top plug is formed in the dielectric layer such that the top plug and the bottom plug are electrically connected. Finally, a wire line is formed over the substrate.