Solid image sensor and image fetching method
A solid-state image and sensor technology, applied in image communication, electrical solid-state devices, semiconductor devices, etc., can solve problems such as distortion, offset, and detection time lag
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no. 1 example
[0055] A solid-state image sensor according to a first embodiment of the present invention will be described below with reference to FIGS. 1-8.
[0056] FIG. 1 is a circuit diagram of a solid-state image sensor according to this example. 2-5 are plan views showing the structure of a solid-state image sensor according to a first embodiment of the present invention. 6A and 6B are timing charts explaining an image reading method of the solid-state image sensor according to this example. 7A-7C and 8 are cross-sectional views of the solid-state image sensor according to the first embodiment of the present invention in steps of a method of manufacturing the solid-state image sensor, showing the method.
[0057] First, the structure of the solid-state image sensor according to this example will be described with reference to FIGS. 1-5. FIG. 1 is a circuit diagram of a solid-state image sensor according to this example. In FIG. 1, the pixel array unit 10 is represented by a 2×2 uni...
no. 2 example
[0118] A solid-state image sensor according to a second embodiment of the present invention will be described below with reference to FIGS. 9-12.
[0119] 9-12 are plan views showing the structure of the solid-state image sensor according to this example. In order to avoid repetition or simplify description, the same components in this example as in the solid-state image sensor according to the first embodiment shown in FIG. 1 are denoted by the same reference numerals.
[0120] The solid-state image sensor according to this embodiment is the same as the solid-state image sensor according to the first embodiment in circuit diagram, operation, and manufacturing method except that the planar layout of the respective layers is different from that of the solid-state image sensor according to the first embodiment. That is, in the solid-state image sensor according to this example, the TG line commonly connected to the gate terminals of the transfer transistors TG of the respective ...
no. 3 example
[0132] A solid-state image sensor according to a third embodiment of the present invention will be described below with reference to FIGS. 13-16.
[0133] 13-16 are plan views showing the structure of the solid-state image sensor according to this example. In order to avoid repetition or simplify description, the same components in this example as those in the solid-state image sensors according to the first and second embodiments are denoted by the same reference numerals.
[0134] The solid-state image sensor according to this embodiment is the same as the solid-state image sensor according to the first embodiment in terms of circuit diagram, operation, and manufacturing method, except that the layout of individual layers is different from that according to the first embodiment. That is, in the solid-state image sensor according to this example, the TG line commonly connected to the gate terminal of the transfer transistor TG of each pixel in the nth row and the selection tr...
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