296results about How to "Reduce electric field" patented technology

A flexible core (60) for a composite structure is described. The core includes a first core layer (62), a second core layer (64), and a ground plane (66) between the first and second core layers. A plurality of slits (72) is provided in the core, and each slit extends through one of the first of second core layers and through the ground plane. The core may be the core of a sandwich panel, for example a sandwich panel of the type used in the composite construction of wind turbine blades (10).

The invention relates to a production method of a water-blocking band, in particular to a production method of a semi-conductive buffer water-blocking band. The production method comprises the following steps: firstly, supercharging and soaking a high-temperature resistant polyester sponge and terylene cloth in conductive liquid, spraying high water-absorbent resin on the terylene cloth and compounding the high-temperature resistant polyester sponge and the terylene cloth; then, spraying the conductive liquid with a high-pressure spray gun and drying the high-temperature resistant polyester sponge and the terylene cloth which are compounded in vacuum at a high temperature; and finally, coiling, cutting and packaging the high-temperature resistant polyester sponge and the terylene cloth which are compounded in vacuum to be a finished semi-conductive buffer water-blocking band . Proved by detection, the semi-conductive buffer water-blocking band has the advantages of high intensity, thinness, rapid swelling in water, high water absorption, good water-blocking effect, high-temperature environment influence resistance, small surface resistance, low volume electric resistivity, European Union environmental protection accordance, and the like, can satisfy the water blocking and the electric field shielding among parts of power cables, and the like, maintains the safe use of the cables, can generate the semi-conductive shielding action so as to buffer an electric field, can be lined at the inner side of a metal protective sleeve to buffer the friction between the inner protective sleeve and the metal protective sleeve and can satisfy the normal working temperature of the cables.

The invention relates to a power transistor, which comprises a substrate, an active region and a terminal region, wherein the active region and the terminal region are formed on the substrate; the terminal region comprises a transition field limiting ring, field limiting rings, a cut-off ring and voltage-sharing protection structures; the transition field limiting ring, the field limiting rings and the cut-off ring are formed on the substrate and are sequentially arranged from inside to outside; gate oxidation layers in the voltage-sharing protection structures are formed on the surfaces of various doped regions; the field oxidation layers, first dielectric layers and second dielectric layers are formed on substrates at one side of various doped regions and are sequentially distributed upwards in a stepped form; the thickness of each field oxidation layer is greater than that of each gate oxidation layer; polysilicon field plates partially cover the gate oxidation layers and partially cover the field oxidation layers; first contact holes are formed in the first dielectric layers, run through the first dielectric layers and are connected to the polysilicon field plates; metal field plates partially cover the first dielectric layers and the second dielectric layers; and the metal field plates are connected with the polysilicon field plates through the first contact holes. The breakdown voltage of the power transistor is relatively high. The invention further relates to a manufacturing method of the power transistor.

A semiconductor device includes: a drift layer having a first conductivity type; a body layer having a second conductivity type; a first semiconductor region having the first conductivity type; a gate insulation film; a trench gate electrode; a first main electrode; a second semiconductor region having the second conductivity type; and a conductor region. The first main electrode is electrically connected with the body layer and the first semiconductor region. The second semiconductor region is disposed on a bottom part of the gate trench, and is surrounded by the drift layer. The conductor region is configured to electrically connect the first main electrode with the second semiconductor region and is configured to equalize, when the semiconductor device is in an off-state, a potential of the second semiconductor region and a potential of the first main electrode.

The invention relates to a semiconductor device, an n-type MOS transistor and a manufacturing method thereof. The semiconductor device comprises a semiconductor substrate, a grid medium layer, a grid electrode, side walls, a light doping source/drain region, a heavy doping source/drain region, and a fluorine ion implantation region, wherein the gird medium layer, the grid electrode and the side wall are positioned inside an input/output device region of the semiconductor substrate; the low doping source/drain region and the heavy doping source/drain region are positioned inside semiconductor substrates in an n-type MOS transistor region and a p-type MOS transistor region of the input/output device region; and the fluorine ion implantation region is positioned inside a semiconductor substrate in the n-type MOS transistor region of the input/output device region. Correspondingly, the invention also provides a method for manufacturing the semiconductor device, the n-type MOS transistor and the method for manufacturing the n-type MOS transistor. The fluorine ion implantation region is formed in the low doping source/drain region of the n-type MOS transistor region, and fluorine ions in the fluorine ion implantation region and silicon in the semiconductor substrate form fluorine-silicon groups so as to prevent the formation of charge traps, prevent the aggregation of charges in the low doping source/drain region under the condition of additional voltage, and forming hot carrier effect.

The invention discloses a LDMOS. Based on the traditional LDMOS (laterally diffused metal oxide semiconductor) structure, a light dope area (30) is arranged on the side wall and the bottom close to a groove (13) in a well (12). The doping types of the light dope area (30) and the well (12) are the same and the doping density of the light dope area (30) is lower. The invention also discloses a manufacturing method of an LDMOS. The shifting area of the traditional LDMOS is the well (12) but the shifting area of the LDMOS provided by the invention is the well (12) and the light dope area (30), so that the electric field along vertical and horizontal directions of the groove in the LDMOS provided by the invention is conveniently reduced, therefore reducing the electron collision strength in the shifting area, restraining the hot carrier injection effect, and increasing the safety working area and reliability of the LDMOS device.

The invention discloses a manufacturing method of a through hole interconnection structure. The manufacturing method of the through hole interconnection structure comprises the following steps: (a) a blind hole is machined in one surface of a substrate; (b) an insulating layer and a barrier layer are deposited on the whole surface in sequence, where the blind hole is machined, of the substrate; (c) a light-sensitive dry film is paved on and attached to the surface, containing the barrier layer, of the substrate, and exposure imaging treatment is carried out on the surface, so that an opening exposed out of the blind hole is formed; (d) the dry film is used as a covering film, a seed layer is formed on the barrier layer on the bottom of the blind hole, and the seed layer is prevented from covering the barrier layer deposited on the lateral wall of the blind hole; (e) growth from bottom to top is achieved with the seed layer on the bottom of a through hole as guiding media, and the thickness of another surface of the substrate is reduced until the blind hole is machined to be the through hole. The invention further discloses a product of the through hole interconnection structure. According to the manufacturing method of the through hole interconnection structure and the product of the through hole interconnection structure, through hole electroplating which is convenient to control, low in cost, and high in efficiency can be achieved, and the product of the through hole interconnection structure and with better filling effect can be obtained.

The invention discloses an ESD (electrostatic discharge) protection circuit. The protection circuit is composed of a first branch and a second branch which are connected in parallel, wherein the first branch is formed by connecting a Zener diode (21) with a first diode (22) in serials; and the second branch is a second diode (23). The protection circuit is characterized in that an n-type heavily doped Zener ion implantation region (11) and a p-type heavily doped substrate (10) form the Zener diode (21); a p-type heavily doped region (15a) and an n well (13a) form the first diode (22); and an n well (13b) and the p-type heavily doped substrate (10) form the second diode (23). The invention also discloses a manufacturing method of the ESD protection circuit. The ESD protection circuit has the advantages of low parasitic capacitance and high response speed, is simple to manufacture, and is especially suitable for protection of input/output ESD circuits with voltages lower than 5V.

The invention belongs to the field of power semiconductors, and particularly provides a SiC power device. The SiC power device comprises a SiC MOSFET and a SiC IGBT. For the SiC MOSFET device integrated with a PN junction body diode, the reverse recovery charge and related loss of the body diode can be greatly reduced, the reverse recovery peak current is reduced, and the EMI noise is reduced; forthe SiC MOSFET device integrated with an N-type Schottky diode or an integrated heterojunction diode, the voltage drop during reverse conduction of the MOSFET can be reduced, and the minority carrierinjection effect is eliminated, so that the conduction loss and reverse recovery loss of the diode are reduced; for the reverse conduction type SiC IGBT device integrated with the PN junction body diode, the reverse recovery charge and related loss of the body diode can be greatly reduced, the reverse recovery peak current is reduced, and the EMI noise is reduced; and moreover, for the reverse conduction type SiC IGBT device integrated with the N-type Schottky diode or the heterojunction diode, the voltage drop during reverse conduction of the reverse conduction IGBT can be reduced, the minority carrier injection effect is eliminated, and the conduction loss and reverse recovery loss of the diode are reduced.

A Hall sensor has at least three Hall sensor elements (1, 2,..., 94) which each have at least three element connections (A, B, C, D, E, F, G, H) and are connected in a circuit grid having a structure which is more than one-dimensional, and at least three sensor connections (EXT_A, EXT_B, EXT_C, EXT_D) for making contact with the Hall sensor. In this case, each sensor connection (EXT_A, EXT_B, EXT_C, EXT_D) is connected to at least one of the Hall sensor elements (1, 2,..., 94) at one of the element connections (A, B, C, D, E, F, G, H) thereof.

The invention discloses a heterojunction field effect transistor of a groove-insulated gate type composite source field plate. The transistor comprises a substrate, a transition layer, a barrier layer, a source electrode, a drain electrode, an insulation medium layer, an insulated groove gate, a passivation layer, a source field plate and a protection layer from bottom to top; a groove is opened on the barrier layer, the insulated groove gate is arranged on the insulation medium layer at the upper part of the groove, the source field plate is arranged on the passivation layer, and the source electrode is electrically connected with the source field plate, wherein, n floating field plates are deposited on the passivation layer arranged between the source field plate and the drain field plate. The floating field plates have the same size and are mutually independent, and the spacing between two adjacent floating field plates increases based on the number of the floating field plates arranged along the direction from the source field plate to the drain electrode. The n floating field plates are in floating state and completed together with the source field plate on the passivation layer by one-time process. The heterojunction field effect transistor has the advantages of simple process, good reliability, strong stability, good frequency characteristic and high output power, and can be used for fabricating microwave power devices based on III-V group compound semiconductor heterojunction structure.

A lateral junction field-effect transistor includes a substrate of a first conductivity type having a dopant concentration; a first semiconductor layer of the first conductivity type having a first dopant concentration lower than the dopant concentration and disposed on the substrate; a second semiconductor layer of a second conductivity type having a second dopant concentration, the second conductivity type being different from the first conductivity type, the second semiconductor layer disposed on the first semiconductor layer; a third semiconductor layer of the first conductivity type having a third dopant concentration, the third semiconductor layer disposed on the second semiconductor layer; a fourth semiconductor layer of the first conductivity type having a fourth dopant concentration lower than the dopant concentration, the fourth semiconductor layer disposed on the third semiconductor layer; a source region and a drain region disposed in the second semiconductor layer and on opposite sides of the third semiconductor layer.

The invention provides a silicon carbide trench gate metal oxide with semiconductor field effect transistor (SiC UMOSFET) structure integrated Schottky diode (SBD) and a method for manufacturing the same, The structure is characterized by, a p +-type bury layer (50) is formed on the n-type current transport layer (40) by implantation, and further an n-type current transport layer (40) is epitaxially formed so that the p +-type buried layer (50) floats, and the p +-type buried layer (50) can effectively reduce the electric field in the gate trench oxide and the electric field at the Schottky contact position in the blocking mode, so that the SBD integrated SiC UMOSFET has high blocking ability, and the high temperature and high field reliability of the device are greatly improved. At that same time, the relative position of the main trench (80), the main trench (80') and the p +-type buried layer (50) and the n-type current transport layer (40) are adjusted so that when the MOSFET is operated in the first quadrant, the conduction characteristic of the MOSFET does not degrade significantly; When the MOSFET is operated in the third quadrant, the conduction of the parasitic pn diode inthe MOSFET is effectively suppressed and the Schottky diode conduction mode is obtained. SiC UMOSFETs with integrated SBD have a lower total chip area than discrete SBD and MOSFET devices.

In this switching device, a field relaxation electrode is provided on the movable contact of a disconnector so that the movable contact can be connected to a fixed contact by changing the position of the field relaxation electrode between an open state and a closed state. By providing the field relaxation electrode on the movable contact of the disconnector, the ground dielectric strength and interpolar dielectric strength in the open state position can be improved to reduce the size and cost of the equipment. By improving the charging current interrupting performance and exciting current interrupting performance, the applicable range on system of the equipment can be extended.

The invention relates to the SOI (silicon on insulator) technology. The invention solves the problem that the heating effect of the existing conventional SOI device is obvious, and provides a partial SOI traverse double-diffused device. The technical scheme of the invention is summarized as follows: one end of an oxide buried layer of the partial SOI traverse double-diffused device is arranged below a source electrode and is contacted with the edge of the device, the horizontal distance between the other end of the oxide buried layer and a drain type II impurity ohm contact area is not less than zero, a PN (phosphorus-nitrogen) junction is formed by the way that a type I impurity substrate is contacted with the silicon layer of the type II impurity top layer between the other end of the oxide buried layer and the edge of the device below the drain. The partial SOI traverse double-diffused device has the beneficial effects that the oxide buried layer is provided with an opening below the drain, the heat produced by an SOI device can be effectively transferred, and the partial SOI traverse double-diffused device is applicable to SOI devices.