3results about How to "Good surface conductivity" patented technology

This invention relates to a nickel-plated steel sheet with excellent corrosion resistance for battery casings and a method for manufacturing the same. In one specific embodiment, the nickel-plated steel sheet comprises: a base steel sheet; a nickel plating layer formed on at least one surface of the base steel sheet; and a nickel-iron diffusion layer formed between the base steel sheet and the nickel plating layer. The nickel plating layer and the nickel-iron (Ni-Fe) diffusion layer are formed by heat treatment after forming an electroplated nickel layer on the base steel sheet and a chemically plated nickel layer on at least a portion of the surface of the electroplated nickel layer. The nickel plating layer contains one or more vacancy elements selected from phosphorus (P), boron (B), tungsten (W), cobalt (Co), molybdenum (Mo), and copper (Cu) on its surface.

A silicon-based negative electrode composite material and a lithium secondary battery. The silicon-based negative electrode composite material is a composite material composed of silicon-based particles and a carbon coating layer coated on the surface of the silicon-based particles; the silicon-based particles in a lithium insertion state are a composite material containing a LixMy Siz alloy, wherein 0<x<25, 0<y<5, and 0<z<6, and M is one or more of Ni, Cu, Zn, Al, Na, Mg, Au, N, and P; the silicon-based particles have an average particle diameter (D50) of 0.1-40 pm and a specific surface area of 0.5 m2 / g-40 m2 / g; after lithium insertion, the LixMySiz alloy is diffusely distributed in the whole silicon-based particles and has the crystallite dimension of 0.5.

The present invention discloses a heat dissipation conductive shielding buffer foam, comprising a buffer foam layer and a conductive film layer arranged on one side or both sides of the buffer foam layer, and the conductive film layer is attached to the surface of the buffer foam layer by sputtering layer by layer; the heat dissipation conductive shielding buffer foam has a thickness range of 0.06 mm to 1 mm and a density range of 0.03 g / cm 3 ~0.8g / cm 3 The maximum compression ratio is ≥60%, the maximum pore size in each direction does not exceed 80μm, and the foam opening rate is ≤30%; the buffer foam layer contains fibrous thermal conductive fillers to improve the thermal conductivity of the buffer foam layer, and the thermal conductivity coefficient is within 1w / m·k~10w / m·k. The heat dissipation conductive shielding buffer foam of the present invention is soft and has a higher compression ratio. It can better adapt to the concave and convex gap scenes inside electronic equipment, fill the interface gap, reduce the contact thermal resistance, and combine with the addition of thermal conductive fillers to improve the thermal conductivity effect; at the same time, the conductive film layer has good surface conductivity, so that the material can be used as a shielding electromagnetic wave material.