Heat dissipation conductive shielding buffer foam and application

Abstract

The invention discloses heat dissipation conductive shielding buffer foam which comprises a buffer foam layer and a conductive film layer arranged on one side or two sides of the buffer foam layer, and the conductive film layer is attached to the surface of the buffer foam layer in a layer-by-layer sputtering mode. The thickness of the heat dissipation conductive shielding buffer foam ranges from 0.06 mm to 1 mm, the density ranges from 0.03 g / cm < 3 > to 0.8 g / cm < 3 >, the maximum compression ratio is larger than or equal to 60%, the maximum bubble hole diameter in each direction does not exceed 80 micrometers, and the foam aperture ratio is smaller than or equal to 30%. The buffer foam layer contains fibrous heat-conducting filler which is used for improving the heat-conducting property of the buffer foam layer, and the heat conductivity coefficient is within 1-10w / m.k. The heat dissipation conductive shielding buffer foam is soft, has a higher compression ratio, can better adapt to concave-convex gap scenes in electronic equipment, fills interface gaps, reduces contact thermal resistance, and improves the heat conduction effect by combining with the internally added heat conduction filler; and meanwhile, the conductive film layer has better surface conductivity, so that the material can be used as an electromagnetic wave shielding material.

Description

technical field [0001] The invention belongs to the technical field of foam materials, and in particular relates to a heat-dissipating conductive shielding buffer foam and applications thereof. Background technique [0002] With the rapid development of the fifth-generation mobile communication technology (referred to as 5G or 5G technology), the introduction of high frequencies, the upgrade of hardware components, and the exponential increase in the number of networking equipment and antennas Electromagnetic interference is everywhere, and the harm of electromagnetic interference and electromagnetic radiation to electronic equipment is becoming more and more serious, and the need for electromagnetic shielding is more and more urgent. At the same time, as electronic devices have more and more functions and become more powerful, the corresponding internal chips or electronic modules are also increasing, which will generate more heat while bringing electromagnetic wave interfe...

AI Technical Summary

Problems solved by technology

[0003] At present, shielding covers can be used outside the main electromagnetic wave generating components such as chips and CPUs to shield electromagnetic waves, but the cost of using shielding covers between larger modules such as the motherboard, casing, and under the screen is high, and it does not meet the current thin and light electronic equipment. At the same time, because there are many irregular gaps between the components, the existence of gaps makes it difficult for the electronic module to dissipate heat, which will also reduce the buffer resistance of electronic equipment and reduce the service life of electronic equipment

[0004] At present, the way to solve the above problems is mainly to use the composite structure foam formed by wrapping the sponge with conductive cloth to fill the gap, but this structure not only has the disadvantages of high hardness, large material loss and large volume, but also has poor heat dissipation effect. Generally, composite thermal conductive sheets are used at the same time, which is costly. When used inside electronic equipment, its concave-convex compliance is poor, which reduces the life of electronic devices, and is also not conducive to the processing of 5G electronic devices at the back end and the miniaturization of products.

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