Heterojunction field effect transistor for groove insulated gate type multiple source field plate

Abstract

The invention discloses a heterojunction field effect transistor of a groove-insulated gate type composite source field plate. The transistor comprises a substrate, a transition layer, a barrier layer, a source electrode, a drain electrode, an insulation medium layer, an insulated groove gate, a passivation layer, a source field plate and a protection layer from bottom to top; a groove is opened on the barrier layer, the insulated groove gate is arranged on the insulation medium layer at the upper part of the groove, the source field plate is arranged on the passivation layer, and the source electrode is electrically connected with the source field plate, wherein, n floating field plates are deposited on the passivation layer arranged between the source field plate and the drain field plate. The floating field plates have the same size and are mutually independent, and the spacing between two adjacent floating field plates increases based on the number of the floating field plates arranged along the direction from the source field plate to the drain electrode. The n floating field plates are in floating state and completed together with the source field plate on the passivation layer by one-time process. The heterojunction field effect transistor has the advantages of simple process, good reliability, strong stability, good frequency characteristic and high output power, and can be used for fabricating microwave power devices based on III-V group compound semiconductor heterojunction structure.

Description

technical field [0001] The invention belongs to the field of microelectronics technology, and relates to semiconductor devices, in particular to a heterojunction field effect transistor based on a grooved insulating gate type composite source field plate based on a III-V compound semiconductor material heterojunction, which can be used as a microwave and millimeter wave communication device. system and the basic components of the radar system. technical background [0002] As is well known in the industry, semiconductor materials composed of group III elements and group V elements, that is, group III-V compound semiconductor materials, such as gallium nitride (GaN)-based, gallium arsenide (GaAs)-based, indium phosphide (InP)-based And other semiconductor materials, their bandgap widths are often quite different, so people usually use these III-V compound semiconductor materials to form various heterojunction structures. Due to the large difference in the band gap of III-V c...

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Problems solved by technology

However, the manufacturing process of the heterojunction field effect transistor using the stacked field plate structure is relatively complicated. Each additional layer of field plate requires additional process steps such as photolithography, metal deposition, insulating dielectric material deposition, stripping, and cleaning. To make the insulating dielectric material deposited under the field plates of each layer have an appropriate thickness, cumbersome process debugging must be carried out, which greatly increases the difficulty of device manufacturing and reduces the yield of devices.

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