372 results about "Pogo pin" patented technology

A portable electronic system including a body and a dock is described. The body has a waterproof first connector and a first attracting portion, wherein the first connector has a plurality of electrical terminals. The dock has a second connector and a second attracting portion, wherein the second connector has a plurality of retractable pogo pins. When the body is placed on the dock to make the first connector connected to the second connector, the magnetic force between the second attracting portion and the first attracting portion makes the electrical terminals compress the retractable pogo pins to a critical distance to achieve the electrical connection between the body and the dock.

A floating interface assembly provides signal paths between an integrated circuit (IC) test head and contact pads on a load board or probe card accessing an IC to be tested. Pogo pins or other contactors for contacting the contact pads are mounted on the interface assembly and linked to the test head by flexible conductors. The interface assembly is attached to the test head by springs to allow it the freedom to rotate to some extent about any axis. As the test head approaches the contact pads, alignment pins engage and orient the interface assembly so that its contactors will mate with the contact pads. As the contactors come into contact with the contact pads, the interface assembly adjusts the plane of the contactors so as to evenly distribute contact pressure over all contactor pads.

An audio jack can allow electrical connections between an audio plug and an electronic device. The audio jack can include a series of pogo pins operative to extend into an audio jack cavity to provide conductive contacts for an audio plug placed within the audio jack. When an audio plug is inserted in the audio jack, the deflectable tips of each pogo pin can deflect and contact audio plug contact portions or regions. The end of the pogo pins opposite the deflectable tips can be coupled to an appropriate electronic device component, such as a printed circuit board, flex circuit, cable, or any other suitable component to provide a conductive path for signals between the audio plug and the electronic device.

A nonresilient rigid test probe arrangement which is designed for testing the integrity of silicon semiconductor device wafers or chips, and which eliminates pliant conditions encountered by current text fixtures, which are adverse to the attainment of satisfactory test results with rigid probes. The test system interface assembly includes a rigid ceramic substrate which forms a pedestal over which the rigid probe makes electrical contact. A PC board is located on the opposite side of the ceramic substrate. A clamp ring retains the PC board to a test head system with mating precision reference surfaces formed therebetween. Pogo pin connectors extend between the PC board and the test head system. A stiffening element having a control aperture is bolted through the PC board to the clamp ring, all of which form a rigid test probe arrangement.

Wafer probing test apparatus includes a main body, a test head having a plurality of pogo pins at its bottom surface, a probe card for engagement with the test head, a position sensor for sensing when the test head is oriented properly for docking with the probe card, and a docking height sensor for sensing when the test head arrives at the proper docking height. The sensors include a plurality of position sensor protrusions and at least one height sensor protrusion formed on the bottom of the test head, a plurality of position limit switches and a down limit switch. The switches are operated in response to the insertion and withdrawal of the position sensor protrusions into and from holes formed in the probe card.

A modular probe card comprises a printed circuit board, an interposer, and a probe head where the printed circuit board has a plurality of first contact pads, the probe head has a plurality of second contact pads. The interposer is disposed between the printed circuit board and the probe head where the interposer includes a substrate and a plurality of pogo pins. The substrate has a first surface, a second surface, and a plurality of through holes penetrating from the first surface to the second surface. The pogo pins are secured in the through holes of the substrate. Each of the pogo pins has a first contact point, a second contact point, and a spring therebetween, whereby the first contact points are elastically extruded from the first surface to contact the first contact pad, and the second contact points are elastically extruded from the second surface to contact the second contact pad, so as to overcome the poor electrical connections between the printed circuit board and the probe head through the interposer due to poor coplanarity of the first contact pads of the printed circuit board.

A mobile device mounting and charging system having a device case with female connection points on the back of the mobile device case connected to the device through charging connections. A charging base has male contacts for mating with the female connection points, preferably in the form of pogo pins, with a magnet that maintains base and case connection. The charging base is connected to a power source.

Thermal sensing devices can include two subsets of thermal sensors connected in a bridge by circuitry on the same support layer or surface with the sensors. Each thermal sensor can be formed in a patterned layer of semiconductor material, and the bridge circuitry can include leads formed in a patterned layer of conductive material, over or under the semiconductor layer. In one implementation, the bridge circuitry includes conductive portions that extend across and electrically contact the lower surface of each sensor's semiconductor slab. The bridge circuitry can also include pads that can be electrically contacted, such as by pogo pins. The device's reaction surface can be spaced apart from or over the thermal sensors. The device's components can be shaped and positioned so that the bridge's offset voltage is below the sensitivity level required for an application, such as by left-right symmetry about an axis.

An aiming apparatus using digital magnification includes a main cylinder body, an object lens, an eyepiece, an erector device and a magnification ring. The main cylinder body includes a front end connecting to the object lens and a rear end connecting to the eyepiece. The erector device is disposed within the main cylinder body and includes an inner tube, an outer tube, a ring resistor board, a pogo pin and a parallel resistor. The inner tube jackets the outer tube. The pogo pin is disposed in the outer tube and contacts the ring resistor board. The ring resistor board connects to the parallel resistor in parallel. The magnification ring is rotatably disposed in the main cylinder body to rotate the outer tube with respect to the inner tube so as to change the contact position of the pogo ring on the ring resistor board.

The invention discloses a novel pogo pin. The novel pogo pin comprises multiple insulated and concentric contact needles. Each contact needle corresponds to a needle tube matched with the contact needle, a tension spring is connected between each contact needle and the needle tube corresponding to the contact needle, and each contact needle can move in a telescopic mode in the axial direction of the corresponding needle tube. The needle tube corresponding to each contact needle is fixedly and electrically connected with a corresponding circuit, and each contact needle is elastically connected with a corresponding conductive terminal. By the adoption of the scheme, the contact needles can move in the telescopic mode along the corresponding needle tubes, it can be guaranteed that the contact needles stably make contact with contacts in the using process, and open circuits are avoided. It can be guaranteed that first contact needles and the second contact needles are independently separated through insulating bushes, and short circuits are avoided. Each contact needle is of a columnar boss structure with the front portion narrower than the rear portion, the contact needles and the needle tubes are easy to install in the assembly process, production efficiency is high, and no additional buckle structure is needed for fixation.

An electrical characteristics test for a semiconductor integrated circuit using a Kelvin contact method can be conducted in a pre-process without obstructing the reduction in size of a semiconductor chip or without complicating the circuit design. A probe card in a testing apparatus includes probes for Kelvin contact, the probes for Kelvin contact including a coil probe and a POGO pin probe disposed inside the coil probe, and a probe for two-terminal measurement. Electrode pads formed in each chip area over a wafer are in a relation of A=B<2A, given that the area of one of the electrode pads with which the probe for Kelvin contact comes into contact is B and the area of the other electrode pad with which the probe for two-terminal measurement comes into contact is A.

An electronic device, configured to be blindly mated with a printed circuit board, comprises a housing and at least one RF interconnect. The RF interconnect comprises an outer conductor, an insulator, and an inner conductor that function in a manner similar to the outer conductor, insulator, and inner conductor of a coaxial cable, respectively. The inner conductor comprises a spring-loaded electrical contact such as a POGO pin. An upper end of the outer conductor is electrically coupled to the housing and a lower end of the outer conductor is configured to electrically couple to a ground return path of the printed circuit board. In its normally extended position, the spring-loaded contact extends beyond the lower end of the outer conductor, and the outer conductor limits the compression distance of the spring-loaded contact.

A compact tunable antenna for a handheld electronic device and methods for calibrating and using compact tunable antennas are provided. The antenna can have multiple ports. Each port can have an associated feed and ground. The antenna design can be implemented with a small footprint while covering a large bandwidth. The antenna can have a radiating element formed from a conductive structure such as a patch or helix. The antenna can be shaped to accommodate buttons and other components in the handheld device. The antenna may be connected to a printed circuit board in the handheld device using springs, pogo pins, and other suitable connecting structures. Radio-frequency switches and passive components such as duplexers and diplexers may be used to couple radio-frequency transceiver circuitry to the different feeds of the antenna. Antenna efficiency can be enhanced by avoiding the use of capacitive loading for antenna tuning.

A POGO pin that can measure low frequency products as well as RF products and also have a long life span, and a test socket including the POGO pin are provided. The POGO pin includes a metal plunger formed of a conductive metal so as to electrically contact the semiconductor package, and a rubber contact pin connected with the metal plunger and formed of a conductive rubber so as to electrically contact the test board.

A device for interfacing a test head and a prober is disclosed using wires or cables to provide the connection from a probe card interface boards to the probe card. The use of wires or cables, in place of the traditional pogo pin arrangement allows for more reliable and efficient testing, as well as additional high performance tests to be run. Optionally, a probe interface contains a stiffening member with multiple sidewalks and individual, configuration-specific probe card interface strips are connected to a probe card through zero insertion force clamps. The probe card interface attaches to the test head using standard probe interface board (“PIB”) docking mechanics. The assembly is then connected to a probe to carry out the testing procedures.

A system and a method of testing a semiconductor die is provided. An embodiment comprises a plurality of tips that each comprise a substrate with a conductive via, a first dielectric layer with vias connected to the conductive via, a second dielectric layer with vias over the first dielectric layer, and a metal layer over the second dielectric layer. Additional dielectric layers with vias may be used. This tip is electrically connected to a redistribution line that routes signals between the tip to electrical connections on a space transformation layer. The space transformation layer is electrically connected to a printed circuit board using, for example, a spring loaded connection such as a pogo pin. The space transformation layer is aligned onto the printed circuit board by a series of guidance mechanisms such as guide pins or smooth fixtures, and the planarity of the tips is adjusted by adjusting the screws.