154results about "Temperature compensation modification" patented technology

The invention discloses a transformer equipment state real-time monitoring method and system based on multi-source data fusion, and particularly relates to the technical field of transformer equipment state monitoring, and the method comprises the steps: firstly obtaining a unified time reference through the multi-channel time alignment driven by an event anchor point, and employing a strategy of combining rough alignment with refined alignment; on the basis, the channel alignment confidence coefficient is constructed according to the main peak sharpness ratio, the group delay consistency, the phase locking consistency and the geometric consistency of temperature compensation; then acoustic emission spectrum energy and pulse number, vibration impact characteristics and cross-sensor consistency characteristics are extracted under a unified time reference, and dynamic threshold setting is carried out in combination with load and environment context; performing gating weighting, intra-group decorrelation and probability calibration on the multi-source evidence according to the channel health factor to obtain calibrated fault probability and inconsistency; and finally, outputting a grading result under the constraint of multi-stage judgment and physical consistency rechecking controlled by the error discovery rate.

The invention provides a temperature compensation error elimination method in a full-automatic transformer transformation ratio test, and belongs to the technical field of transformers. A heat conduction coefficient matrix, a convective heat transfer coefficient matrix and a radiation form factor matrix are utilized to construct a temperature field dynamic evolution equation set, and a neural network compensation model combining a multi-layer perceptron architecture and an attention mechanism is adopted. A hierarchical fusion weight is dynamically adjusted based on a thermal gain stability matrix eigenvalue, a temperature gradient vector modulus length and a thermal capacity matrix condition number through a gating weight function, compensation parameters are adjusted in advance by using a temperature field prediction algorithm, and continuous improvement of measurement precision is realized through a temperature compensation effect evaluation mechanism and a dynamic parameter optimization strategy. The technical problems that the measurement precision is reduced and accurate temperature compensation cannot be realized due to temperature change in the transformation ratio test process of the transformer are solved.

The embodiment of the invention provides a temperature drift compensation device, method and equipment for contact impedance of a high-frequency probe card. The system is applied to the technical field of semiconductor testing and comprises a temperature monitoring module, an impedance modeling module, a compensation execution module and a cooperative control module which are connected in sequence. In this way, the technical problems that in the prior art, temperature drift compensation is slow in response and insufficient in precision are solved through the sub-millisecond-level temperature monitoring network, the nonlinear compensation model and multi-probe cooperative compensation in combination with the self-adaptive Kalman filtering algorithm.

The invention discloses a non-equilibrium Michelson interferometer electric field sensor capable of automatically calibrating temperature influence, which has the characteristics of wide bandwidth, high measurement precision and small interference of distribution of an electric field to be measured, and can also automatically calibrate temperature influence and prevent a working point of the non-equilibrium Michelson interferometer electric field sensor from deviating. The electric field sensor comprises a lithium niobate substrate, the lithium niobate substrate is provided with a non-equilibrium Michelson interferometer, the non-equilibrium Michelson interferometer comprises an input and output waveguide, the input and output waveguide is connected with a first waveguide arm and a second waveguide arm which are different in length, two sides of the first waveguide arm are provided with electrodes, and the second waveguide arm is provided with electrodes. An antenna is arranged on the electrode, a first metal reflecting mirror is arranged at the tail end of the first waveguide arm, a second metal reflecting mirror is arranged at the tail end of the second waveguide arm, the first metal reflecting mirror and the second metal reflecting mirror are both arranged on the lithium niobate substrate, and the thermal expansion coefficients of the first metal reflecting mirror and the second metal reflecting mirror are different.

A method for manufacturing a probe head for the functionality testing of devices under test (DUT) is disclosed. The method includes providing a containment element, arranging a lower guide at a lower face of the containment element which faces toward the devices under test during the test, and arranging an upper guide at an upper face of the containment element. The containment element is interposed between the lower and upper guides which are initially in the shape of a single plate connected to the containment element. The method further includes cutting the lower and / or upper guide thereby defining a plurality of guide portions that are independent and separated from each other, and inserting a plurality of contact elements into respective guide holes formed in the guides. The contact elements are adapted to contact pads of the devices under test. A probe head obtained by the method is also disclosed.

The invention discloses a relay fault detection circuit, method and system applied to an energy storage system, and relates to the technical field of electrical control, and the method comprises the following steps: resistance dynamic compensation, coil fault analysis, contact fault analysis, mechanical performance analysis and comprehensive fault risk assessment. The comprehensive performance of the relay is analyzed through a comprehensive evaluation algorithm in combination with a coil aging coefficient, a contact health index H and a mechanical degradation index, a comprehensive fault index is obtained, the overall performance condition of the relay is judged according to the comprehensive fault index, and corresponding measures are taken. According to the method, the temperature fluctuation interference is eliminated, the accuracy of contact resistance detection is improved, the mechanical fault of the relay can be found in time through coil aging analysis, contact health evaluation and mechanical performance evaluation algorithms in combination with compensated data, multi-dimensional fault detection is realized, misjudgment and missed judgment are effectively reduced, and the fault judgment accuracy of the relay is remarkably improved.

The invention discloses a temperature drift dynamic compensation system and method for a Hall current sensor. The system comprises a thermistor assembly, a power supply module, an analog-to-digital conversion module, a processor module and a compensation algorithm module. The thermistor is directly coupled to the surface of the Hall element, and an improved Kalman filtering algorithm is combined, so that dynamic compensation in a wide temperature range is realized. According to the invention, the measurement precision and stability can be significantly improved, the hardware complexity and cost are reduced, the temperature drift and nonlinearity influence of other elements is reduced, and the method is suitable for a high-precision current detection scene.

The utility model discloses a self-adaptive temperature compensation device based on a multipath voltage acquisition system, which comprises an MCU, an ADC acquisition module, a reference source module, a temperature acquisition circuit and a calibration circuit, the MCU is respectively connected with the ADC acquisition module, the reference source module and the temperature acquisition circuit, the reference source module is connected with the calibration circuit, the ADC acquisition module is used for acquiring voltage, and the temperature acquisition circuit is connected with the calibration circuit. The reference source module is used for providing reference voltage, the temperature acquisition circuit is used for acquiring real-time temperature, the calibration circuit is used for calibrating circuit voltage, the MCU fits a real-time compensation curve by acquiring working environment temperature and the reference voltage, real-time compensation is carried out on acquired voltage signals according to the compensation curve, and the MCU is connected with a communication interface. The communication interface is connected with an upper computer, and the MCU can communicate with the upper computer. According to the utility model, compensation calibration can be carried out according to the ambient temperature, so that the consistency and accuracy of voltage acquisition can be still maintained in a wide temperature range, and the use requirements are met.

The density and power consumption of modern integrated circuits, such as Graphic Processing Units (GPUs), Central Processing Units (CPUs), and Network Processing Units (NPUs) is growing rapidly, which necessitates designing advanced cooling systems. Existing solutions for characterizing and validating these cooling system are inadequate. A flexible, scalable Thermal Test Vehicle (TTV) is disclosed which is based on an array of power transistors, measurement / control circuitry, and onboard computer. The TTV is configured for characterizing the performance of electronic cooling solutions under a variety of operating conditions.

The invention relates to the technical field of electronic measurement, and discloses a cable fault point positioning method, device and equipment, and the method comprises the steps: controlling a time domain reflection unit to generate a pulse signal with preset phase deviation, and collecting a reflection signal generated by the pulse signal in a to-be-detected cable; processing data points in the reflected signal according to a preset signal processing algorithm to obtain a denoised signal; determining an initial fault point of the to-be-detected cable based on the denoised signal; and acquiring temperature data of the to-be-detected cable, and performing position compensation on the initial fault point based on the temperature data and a preset temperature compensation algorithm to obtain a target fault point. Through fusion of multi-phase pulse collaborative acquisition and a multistage signal processing algorithm, physical sampling rate limitation of traditional equipment is broken through, a temperature dynamic compensation mechanism is combined, the problem of positioning drift caused by thermal expansion and cold contraction of a cable and dielectric constant change is solved, and high-precision positioning of a fault point in a complex environment is realized.

The present invention relates to a pogo pin cooling system and a pogo pin cooling method and an electronic device testing apparatus having the system. The system uses a cooling fluid supply module for the cooling of the pogo pin, and the cooling fluid may be either a coolant or a cooling gas. When an electronic device is accommodated in the chip socket, the cooling fluid supply module supplies a cooling fluid into the chip socket through the cooling fluid supply channel and the inlet, and the cooling fluid passes through the pogo pins and then flows into the cooling fluid discharge channel through the outlet. In the present invention, the cooling fluid is mainly used to cool not only the pogo pins in the chip socket but also the bottom surface of the electronic device and the solder ball contacts on the bottom surface.

The invention provides a picoampere-level current measuring device and method with leakage estimation and digital compensation, and the device comprises an electrometer-level operational amplifier and a transimpedance feedback network which are used for converting a measured current into a voltage signal; in combination with a retaining ring conductor driven by a retaining ring buffer and an inner and outer double-layer metal shielding structure, high-resistance node leakage and external interference are remarkably reduced. The digital controller injects 5mV-50mV micro excitation into the retaining ring in a non-sampling window and detects output response so as to estimate input equivalent leakage conductance and perform online compensation; and meanwhile, environment self-adaptive correction is carried out according to a temperature and humidity-leakage admittance model. The system adopts a 24-bit analog-to-digital converter, two-stage zero-drift amplification and multi-point linearity calibration can be switched, picoampere-level current measurement with high precision, low noise and wide dynamic range is realized, and the system is suitable for the fields of high-insulation detection, light current measurement, electrochemical micro-current analysis and the like.

The invention provides a temperature control assembly for a probe card and the probe card, and relates to the field of wafer testing. The temperature control assembly for the probe card comprises a cover plate; the heating assembly is arranged on the side, away from the probe card, of the cover plate, and the heating assembly is electrically connected with the testing machine table; the heating buffer assembly is arranged on one side, close to the probe card, of the cover plate; the heat preservation assembly is arranged on the side, close to the probe card, of the cover plate, and the heat preservation assembly is an assembly with a closed pattern and is distributed on the outer side of the probe card; wherein the cover plate, the heat preservation assembly and the probe card form a heat receiving space, and the orthographic projection of the heating assembly on the cover plate is within the orthographic projection of the heating buffer assembly and the heat preservation assembly on the cover plate. According to the embodiment of the invention, the probe mark offset caused by temperature difference generated by heating of the probe card in the test process can be avoided, so that the test efficiency can be improved.

Provided is an inspection apparatus capable of improving the responsiveness of temperature adjustment of a substrate. The inspection apparatus of the present invention includes: a stage capable of placing a substrate; a cooling section that cools the substrate placed on the stage; a probe card having a probe that contacts the substrate to supply power; a light irradiation mechanism that irradiates a surface of the substrate opposite the placement surface with light; and a control section that controls the light irradiation mechanism.

The invention relates to the technical field of transformers, in particular to a current transformer with a temperature compensation function. The current transformer comprises a magnetic circuit structure used for sensing a primary side current and outputting a secondary side current signal; the signal processing unit is integrated in the current transformer and is used for executing the current measurement process; wherein the current measurement process comprises the following steps: injecting a test signal into the magnetic circuit structure; wherein the frequency of the test signal is higher than the power frequency and is not integer multiples of the power frequency; measuring amplitude response and phase response of the magnetic circuit structure to the test signal; calculating magnetic conductivity response data under the test signal based on the amplitude response and the phase response; according to the magnetic conductivity response data and a preset magnetic conductivity-temperature mapping relation, determining a temperature variation; generating a current compensation coefficient based on the temperature variation; and correcting the original current signal by using the current compensation coefficient to obtain a compensated current signal. According to the invention, the measurement reliability of the mutual inductor under various temperature conditions is improved.

The invention relates to the technical field of electronics, in particular to a bus capacitor life estimation method and device, a storage medium and electronic equipment, and the method comprises the steps: collecting the operation characteristic parameters and instantaneous environment temperature of a system where a bus capacitor is located in real time according to a sampling period; judging a working condition category corresponding to the current sampling period according to the operation characteristic parameters, and obtaining a unit damage life and a correction coefficient corresponding to the working condition category; calculating to obtain the damage life increment of the current sampling period, wherein the calculation formula is shown in the specification; accumulating the damage increments of all the sampling periods to obtain a total accumulated damage life; and subtracting the total accumulated damage life from the rated life of the bus capacitor to obtain the residual life of the bus capacitor. On the premise that additional hardware sampling equipment is not added, high-precision and high-efficiency bus capacitor online service life estimation can be completed, and meanwhile the good working condition self-adaptive capacity is achieved.

The invention relates to an ultra-large current source nonlinear fitting and multi-section temperature compensation method and device and a medium, and the method comprises the steps: dividing a total range of a current source into a large section of independent range and a small section of independent range according to a preset threshold value, configuring an independent sampling circuit with adaptive parameters, and shielding a small-range sampling circuit during wide-range work to eliminate interference; respectively executing multi-section linear calibration for the two sections of measuring ranges to generate exclusive calibration parameters; on the basis of negative correlation characteristics of temperature and current output, temperature compensation functions of all measuring ranges are fit, and targeted temperature drift compensation is achieved; finally, a final set value is calculated based on the calibrated intermediate set value and the temperature drift compensation amount, the current source is driven to output accurately, the full-scale output precision and stability of the ultra-large current source are effectively improved, and the requirements of high-precision testing and driving scenes are met.

A system includes a battery assembly. The system includes a circuit board comprising circuitry. The circuitry includes a first trace. The system includes an integrated circuit mounted on the circuit board. The integrated circuit includes a thermistor pin. The thermistor pin is configured to initiate a first mode of the integrated circuit. The integrated circuit is configured to monitor cells of the battery assembly. The system includes a first switch mounted on the circuit board. The first switch includes a first position and a second position. The first position is configured conduct and the second position configured to impede. The circuitry is configured to change a voltage of the thermistor pin based on the first trace according to the first switch.

The invention relates to a resistor assembly (2) comprising at least one connecting element (3, 3 ') and at least one resistor element (4). A coating (5) is applied as a substrate to at least a portion (411) of the surface (41) of the resistor element (4) or as a substrate to at least a portion (311) of the surface (31) of the connecting element (3, 3 '), said coating having at least one layer (50, 51, 52, 53). According to the invention, the coating (5) is designed such that the metal and the semiconductor are in direct contact at a boundary surface (61) between the substrate and the coating (5), such that a p-n transition is formed at the boundary surface (61), and / or the metal and the semiconductor or the first semiconductor and the second semiconductor are in direct contact at least at a boundary surface (62) between the first layer (50, 51) and the second layer (52) of the coating (5), such that a p-n transition is formed at the boundary surface (61). This is such that a p-n transition is formed at the boundary surface (62). The layer (50, 51, 52, 53) of the coating (5) may be in contact with an uncoated portion (412, 412 ') of the surface (41) of the resistor element (4) or an uncoated portion (312) of the surface (31) of the connection element (3, 3'), or both the first layer (50, 51) and the other layer (52, 53) of the coating (5), in order to detect a measurement signal for determining the temperature of the resistor assembly (2).

The present invention provides resistors having various arrangements of conductive parts and resistive elements, current sensing resistors, battery shunt resistors, and shunt resistors. [Solution] The resistor 610 has one or more resistive elements 611 and a plurality of conductive parts 612, 614. Openings or slots 672, 676 are formed within the resistive elements in a configuration that allows adjustment of the resistor's TCR (temperature coefficient of resistance). The shape, number, and orientation of the openings or slots are variable. In one embodiment, a header member is provided to fix or hold pins to the resistor.

The invention belongs to the technical field of discharge detection, and particularly relates to a discharge detection method and system for a high-low voltage power distribution cabinet, and the method comprises the steps: obtaining a measurement vector generated by a discharge source and a real-time temperature reading, and loading a preset reference sensing matrix; constructing a dynamic environment correction coefficient; adjusting the reference sensing matrix based on the dynamic environment correction coefficient to generate a dynamic sensing matrix matched with the current thermal field environment; and determining the position of the discharge source through a sparse reconstruction algorithm based on the dynamic sensing matrix and the measurement vector so as to realize discharge detection of the high and low voltage power distribution cabinet. According to the method, model mismatch caused by temperature change can be dynamically compensated by constructing the environment-adaptive dynamic sensing matrix, so that the accuracy and reliability of discharge fault positioning under complex working conditions are remarkably improved.

The application provides a double alternating current bridge impedance separation detection circuit and a detection method. One end of a first connecting terminal of a first alternating current bridge is connected with one end of a voltage source and one end of a first connecting terminal of a second alternating current bridge; one end of a second connecting terminal of the first alternating current bridge is connected with one end of a first balance resistor R s1 ; one end of a third connecting terminal of the first alternating current bridge is connected with one end of a second balance resistor R s2 ; the other end of the first balance resistor R s1 is connected with the other end of the second balance resistor R s2 , the other end of the voltage source, one end of a third balance resistor R s3 and one end of a fourth balance resistor R s4 ; the other end of a second connecting terminal of the second alternating current bridge is connected with the other end of the third balance resistor R s3 ; and the other end of a third connecting terminal of the second alternating current bridge is connected with the other end of the fourth balance resistor R s4 . The application can accurately separate the impedance and inductance change amount of a large-range eddy current displacement sensor in a detection process, and more accurately measure the displacement size between an eddy current probe and a target.

Disclosed in the present invention are a peak current sampling circuit, a switching power supply controller and a switching power supply. The switching power supply uses a power switch transistor to control transfer of electric energy from an input end to an output end, so as to generate an output voltage on the basis of an input voltage. The peak current sampling circuit comprises: a voltage sampling module, an input end of the voltage sampling module being connected to a drain electrode of the power switch transistor, and the voltage sampling module being used for sampling a drain-source voltage difference of the power switch transistor synchronously with turn-on and turn-off actions of the power switch transistor, so as to obtain a first sampled signal having a positive temperature coefficient; and a temperature compensation module, which is used for performing temperature compensation on the first sampled signal, so as to obtain a second sampled signal having a zero temperature coefficient, the second sampled signal carrying peak current information of the switching power supply. The present application can achieve peak current sampling without providing a sampling resistor in a switching power supply, thus reducing power consumption and costs of the circuit and further ensuring that the sampling accuracy of the circuit is not affected.

To provide a method of easily, accurately and efficiently adjusting a temperature coefficient of resistance of a current sense resistor and a shunt resistor, and the resistors.SOLUTION: A resistor 10 has one or more resistive elements 11, 13 and a plurality of conductive portions 12, 14, 16. Openings or slots 72 allowing adjustment of temperature coefficient of resistance (TCR) values of the resistor are formed adjacently to a second side, namely an inner side 20, of the first conductive portion 12. The shape, quantity and orientation of the openings or slots can vary. In one aspect, header members 80a, 80b are provided for securing or holding pins 84 relative to the resistor.SELECTED DRAWING: Figure 1

The invention relates to a radio frequency power detector with offset and temperature compensation. Wireless circuitry may include a transmit line carrying a signal and a power detector measuring the signal. The detector may include a rectifier coupled to the comparator through a differential path. An offset calibration digital-to-analog converter (OSDAC), a reference generator, and a multiplexer may be disposed on a negative line of the differential path. The OSDAC may generate an offset compensation voltage by superimposing different offset voltages over time to a voltage on the second line. The reference generator may generate a set of threshold voltages by superimposing different reference voltages to the offset compensation voltage. A temperature sensor may adjust the reference voltages used to generate the threshold voltages based on a temperature of the power detector. The multiplexer may route different threshold voltages to the negative input of the comparator.

The objective of the present invention is to provide a low-power instrument transformer having a temperature compensation function, in which a circuit whose output is adjusted according to a temperature is added to the inside of a signal converter without additionally implementing the temperature compensation function in a merge unit. The low-power instrument transformer having a temperature compensation function, according to one embodiment of the present invention, may comprise: a detection unit for detecting a voltage of an object to be measured; and a temperature compensation unit for compensating for a change, according to temperature, in voltage information measured by the detection unit, and outputting same to the merge unit.

The invention relates to the technical field of current sensing and testing, in particular to a modular intelligent current probe structure with a temperature compensation function and application thereof, the modular intelligent current probe structure comprises a base, a plurality of current sensing mechanisms are arranged on the top surface of the base, and each current sensing mechanism comprises a probe seat, a main body probe and a sampling probe which are sequentially arranged from outside to inside. According to the modularized intelligent current probe structure with the temperature compensation function and the application thereof, when refrigerant fluid directly and actively dissipates heat for a main body probe and a sampling probe, hydraulic force drives a piston to press downwards, and the hydraulic force is transmitted to a third spring through an outward extending sliding block and a movable ring, so that elastic potential energy of the third spring is converted into additional contact pressure for a movable bottom probe, and the temperature compensation function is realized. And the contact resistance between the movable bottom needle and the test point is reduced by enhancing the contact pressure, the temperature drift is counteracted on a mechanical and electrical coupling layer, and the accuracy and long-term stability of signal acquisition of the current sensing mechanism in a high-temperature environment are ensured through two compensation modes.

The invention relates to the technical field of electrical equipment detection, in particular to a multifunctional integrated insulation resistance tester and an operation method thereof.The multifunctional integrated insulation resistance tester comprises an insulation resistance tester body which is composed of a panel assembly, a case assembly and a detachable expansion cabin which can be disassembled and assembled, and a signal processing module collects environment data and sample signal data; carrying out filtering, amplification and temperature and humidity compensation correction on the data; the multifunctional integrated test module integrates multiple test functions and a cable length measurement function, can carry out flexible voltage adjustment, and supports seven fixed voltage ranges and a customized continuous adjustable mode. The intelligent control module performs task adaptive scheduling, and dynamically configures and coordinates a working time sequence and parameters; the man-machine interaction module is used for switching test functions, setting test parameters and displaying and recording test numerical values and dynamic states; the safety protection module comprises a structure protection mechanism and an active protection mechanism. Therefore, the problems of single function, lack of function extension, non-visual data presentation and the like are solved.

An inspection apparatus includes: a wafer fixing mechanism unit configured to support a wafer including a device under test having an electrode terminal on one surface and an optical input / output unit on the other surface; an optical probe provided on the one surface side of the wafer, and configured to transmit / receive an optical signal to / from the optical input / output units of the device under test; a conductive probe provided on the other surface side of the wafer, and electrically contacted with the electrode terminal of the device under test; and a wafer non-contact state maintaining unit which is a planar member having an opening in a center portion, and configured to maintain a distance from the wafer by intaking / exhausting pressurized air with respect to the wafer and to enable access to the device under test on the wafer through the opening.

Method for the automatic detection of a thermal anomaly in equipment, associated device. The present invention relates to a method for the automatic detection of a thermal anomaly in equipment, comprising the steps of: calculating the temperature T(t) of the equipment towards which it tends in the vicinity of , verifying, by local extrapolation of T(t) in exponential form: ; predicting an asymptotic equilibrium temperature , as a function of usage variables, characterizing the use and context of use of the equipment at time t; determining, as a function of , the presence of a thermal anomaly in the equipment. Figure for the abstract: Figure 1