204results about "Temperature compensation modification" patented technology

The invention provides a power management chip pin state intelligent detection method and system. The method comprises the steps that temperature difference quantity is input into a gradient heat conduction compensation structure, and compensation current opposite to a temperature gradient vector is generated based on temperature field distribution in the copper-based composite material; superposing and coupling the voltage fluctuation signal and the compensation current to generate a reference voltage signal; performing frequency component separation processing on the reference voltage signal, and extracting electromagnetic interference characteristic data in a frequency component; performing time sequence correlation on the electromagnetic interference characteristic data and the temperature distribution data, dynamically adjusting an interference suppression parameter through closed-loop control, and acting the adjusted interference suppression parameter on an interference suppression process of a reference voltage signal to generate a pin state detection signal; and detecting the pin state of the power management chip according to the pin state detection signal. According to the invention, the pin voltage stability and the state detection precision of the power management chip are improved.

The invention discloses a transformer equipment state real-time monitoring method and system based on multi-source data fusion, and particularly relates to the technical field of transformer equipment state monitoring, and the method comprises the steps: firstly obtaining a unified time reference through the multi-channel time alignment driven by an event anchor point, and employing a strategy of combining rough alignment with refined alignment; on the basis, the channel alignment confidence coefficient is constructed according to the main peak sharpness ratio, the group delay consistency, the phase locking consistency and the geometric consistency of temperature compensation; then acoustic emission spectrum energy and pulse number, vibration impact characteristics and cross-sensor consistency characteristics are extracted under a unified time reference, and dynamic threshold setting is carried out in combination with load and environment context; performing gating weighting, intra-group decorrelation and probability calibration on the multi-source evidence according to the channel health factor to obtain calibrated fault probability and inconsistency; and finally, outputting a grading result under the constraint of multi-stage judgment and physical consistency rechecking controlled by the error discovery rate.

The invention discloses a loop resistance measuring method and device. The method comprises the following steps: generating a current calibration parameter by adopting a current calibration model, calibrating a current source based on the current calibration parameter, and controlling the calibrated current source to output a measurement current to a loop to be measured; acquiring loop current, loop voltage and loop environment data of the loop to be detected; wherein the loop environment data comprises at least one of temperature, humidity and electromagnetic parameters of the environment where the to-be-detected loop is located; determining an environment compensation coefficient corresponding to the loop environment data based on a corresponding relation between the environment data and the environment compensation coefficient; and determining the loop resistance of the loop to be measured according to the loop current, the loop voltage and the environment compensation coefficient. The method can ensure that the loop resistance measurement process has dynamic adaptability, and improves the accuracy of long-term measurement of the loop resistance.

The invention discloses a CVT internal capacitance state comprehensive evaluation method and system based on temperature compensation, and belongs to the field of capacitor voltage transformer optimization compensation, and the method comprises the following steps: S1, detecting the primary voltage amplitude and phase angle of a capacitor transformer, and obtaining the performance parameters of the capacitor transformer; s2, acquiring environment temperature information; s3, determining a mathematical relationship between the environment temperature and the performance parameters of the capacitance transformer, and calculating a temperature compensation coefficient according to the mathematical relationship and the environment temperature value; s4, compensating a primary voltage amplitude and a phase angle by using a temperature compensation coefficient; and S5, analyzing the compensated voltage amplitude and phase angle data to obtain an analysis result, and evaluating whether the internal capacitance state of the capacitance transformer is normal or not according to the analysis result. By accurately detecting the primary voltage amplitude and the phase angle of the capacitance transformer and combining environment temperature information, the method can calculate an accurate temperature compensation coefficient, so that the influence of temperature change on the performance of the CVT is effectively corrected.

The invention provides a resistor detection system and method for distribution network hot-line work, and relates to the field of intelligent resistor detection. A data analysis technology based on artificial intelligence is adopted to respectively carry out time sequence feature association on a time queue of temperature values and a time queue of humidity values in an insulation detection process, and query matching based on principal components is remarkably fused and interacted; on the basis of the temperature time sequence correlation characteristic, the humidity time sequence correlation characteristic and the multi-dimensional correlation representation characteristic between temperature and humidity principal component significant interaction, an insulation resistance measurement compensation factor is intelligently generated, and a compensation insulation resistance value is calculated and obtained on the basis of the compensation factor. Therefore, through an automatic measurement process, the accuracy of measurement data can be ensured, and a more accurate insulation resistance value can be further obtained. And the insulation resistance value is dynamically compensated based on the environment data acquired in real time, so that the performance of the insulation material in a real working environment can be reflected more accurately.

The invention provides a temperature compensation error elimination method in a full-automatic transformer transformation ratio test, and belongs to the technical field of transformers. A heat conduction coefficient matrix, a convective heat transfer coefficient matrix and a radiation form factor matrix are utilized to construct a temperature field dynamic evolution equation set, and a neural network compensation model combining a multi-layer perceptron architecture and an attention mechanism is adopted. A hierarchical fusion weight is dynamically adjusted based on a thermal gain stability matrix eigenvalue, a temperature gradient vector modulus length and a thermal capacity matrix condition number through a gating weight function, compensation parameters are adjusted in advance by using a temperature field prediction algorithm, and continuous improvement of measurement precision is realized through a temperature compensation effect evaluation mechanism and a dynamic parameter optimization strategy. The technical problems that the measurement precision is reduced and accurate temperature compensation cannot be realized due to temperature change in the transformation ratio test process of the transformer are solved.

The invention relates to a self-compensating contact resistance on-line monitoring device and method in a high-temperature environment, and the device comprises a contact point which is used for forming a contact resistance to be measured; the thermocouple is used for monitoring the temperature in the high-temperature box in real time; the constant current source system is used for applying a constant test current to the contact point and dynamically adjusting an output current value; the signal conditioning circuit is used for filtering high-frequency interference in the voltage signal; the data acquisition card is used for acquiring voltage signals at high speed; and the processor is used for calculating the real value of the compensated contact resistance. The LSTM network based on Kalman filtering and physical constraint has the beneficial effects that in the LSTM network based on Kalman filtering and physical constraint, the KF outputs the denoised base value state in real time through dynamic fusion observation value and model prediction, and clean input is provided for the LSTM. The LSTM models a temperature-resistance nonlinear relation based on a denoising result of the KF, and makes up for a linear hypothesis defect of the KF.

The embodiment of the invention provides a temperature drift compensation device, method and equipment for contact impedance of a high-frequency probe card. The system is applied to the technical field of semiconductor testing and comprises a temperature monitoring module, an impedance modeling module, a compensation execution module and a cooperative control module which are connected in sequence. In this way, the technical problems that in the prior art, temperature drift compensation is slow in response and insufficient in precision are solved through the sub-millisecond-level temperature monitoring network, the nonlinear compensation model and multi-probe cooperative compensation in combination with the self-adaptive Kalman filtering algorithm.

The invention discloses a non-equilibrium Michelson interferometer electric field sensor capable of automatically calibrating temperature influence, which has the characteristics of wide bandwidth, high measurement precision and small interference of distribution of an electric field to be measured, and can also automatically calibrate temperature influence and prevent a working point of the non-equilibrium Michelson interferometer electric field sensor from deviating. The electric field sensor comprises a lithium niobate substrate, the lithium niobate substrate is provided with a non-equilibrium Michelson interferometer, the non-equilibrium Michelson interferometer comprises an input and output waveguide, the input and output waveguide is connected with a first waveguide arm and a second waveguide arm which are different in length, two sides of the first waveguide arm are provided with electrodes, and the second waveguide arm is provided with electrodes. An antenna is arranged on the electrode, a first metal reflecting mirror is arranged at the tail end of the first waveguide arm, a second metal reflecting mirror is arranged at the tail end of the second waveguide arm, the first metal reflecting mirror and the second metal reflecting mirror are both arranged on the lithium niobate substrate, and the thermal expansion coefficients of the first metal reflecting mirror and the second metal reflecting mirror are different.

A method for manufacturing a probe head for the functionality testing of devices under test (DUT) is disclosed. The method includes providing a containment element, arranging a lower guide at a lower face of the containment element which faces toward the devices under test during the test, and arranging an upper guide at an upper face of the containment element. The containment element is interposed between the lower and upper guides which are initially in the shape of a single plate connected to the containment element. The method further includes cutting the lower and / or upper guide thereby defining a plurality of guide portions that are independent and separated from each other, and inserting a plurality of contact elements into respective guide holes formed in the guides. The contact elements are adapted to contact pads of the devices under test. A probe head obtained by the method is also disclosed.

The invention discloses a continuous high-precision pulse width measurement method and system based on a high-speed serdes, and relates to the technical field of electronic measurement, and the method comprises the steps: S1, transmitting a matching calibration signal; s2, a calibration signal is selected and copied; s3, setting an initial delay value; s4, receiving the data and performing template comparison to complete initial calibration; s5, setting phase offsets of a plurality of links; s6, carrying out delay adjustment on the link; s7, carrying out precise delay calibration on link data; s8, analyzing the measurement precision; s9, selecting and copying a tested signal; s10, carrying out parallel interleaving sampling to output sampling data; s11, calculating a pulse width value; s12, calculating a compensated pulse width value according to the compensation coefficient; through the method, the time resolution is less than or equal to 10ps, and the maximum throughput rate is greater than 300M event / s; channel expansion is supported, and the interleaving sampling rate is improved; and a time delay chip with higher resolution can be used as a time delay adjusting module, so that the performance is improved.

The invention discloses a relay fault detection circuit, method and system applied to an energy storage system, and relates to the technical field of electrical control, and the method comprises the following steps: resistance dynamic compensation, coil fault analysis, contact fault analysis, mechanical performance analysis and comprehensive fault risk assessment. The comprehensive performance of the relay is analyzed through a comprehensive evaluation algorithm in combination with a coil aging coefficient, a contact health index H and a mechanical degradation index, a comprehensive fault index is obtained, the overall performance condition of the relay is judged according to the comprehensive fault index, and corresponding measures are taken. According to the method, the temperature fluctuation interference is eliminated, the accuracy of contact resistance detection is improved, the mechanical fault of the relay can be found in time through coil aging analysis, contact health evaluation and mechanical performance evaluation algorithms in combination with compensated data, multi-dimensional fault detection is realized, misjudgment and missed judgment are effectively reduced, and the fault judgment accuracy of the relay is remarkably improved.

The invention discloses a temperature drift dynamic compensation system and method for a Hall current sensor. The system comprises a thermistor assembly, a power supply module, an analog-to-digital conversion module, a processor module and a compensation algorithm module. The thermistor is directly coupled to the surface of the Hall element, and an improved Kalman filtering algorithm is combined, so that dynamic compensation in a wide temperature range is realized. According to the invention, the measurement precision and stability can be significantly improved, the hardware complexity and cost are reduced, the temperature drift and nonlinearity influence of other elements is reduced, and the method is suitable for a high-precision current detection scene.

The invention provides a copper-aluminum transition splicing sleeve performance evaluation method, system and equipment under a long-term working condition, and the method comprises the steps: carrying out the material performance test of a to-be-tested pipe, and obtaining a material performance evaluation result; placing the plurality of to-be-tested tubes in a multi-loop parallel large-current test structure for synchronous electrical contact performance test, and performing temperature bidirectional compensation to obtain an electrical contact performance evaluation result; performing a stability simulation test on the to-be-tested pipe to obtain a long-term operation reliability evaluation result; synthesizing the three evaluation results of the to-be-tested pipe to obtain a comprehensive evaluation result of the to-be-tested pipe; according to the method and system, overall performance evaluation is achieved by comprehensively considering the aspects of material performance, electrical contact performance and long-term operation reliability, then temperature bidirectional compensation is carried out on the electrical contact performance of the multi-loop parallel large-current test structure, so that the precision of an electrical contact performance evaluation result is improved, local evaluation is achieved, and the reliability of the test structure is improved. And a set of complete high-precision copper-aluminum transition splicing sleeve performance evaluation method is formed.

The utility model discloses a self-adaptive temperature compensation device based on a multipath voltage acquisition system, which comprises an MCU, an ADC acquisition module, a reference source module, a temperature acquisition circuit and a calibration circuit, the MCU is respectively connected with the ADC acquisition module, the reference source module and the temperature acquisition circuit, the reference source module is connected with the calibration circuit, the ADC acquisition module is used for acquiring voltage, and the temperature acquisition circuit is connected with the calibration circuit. The reference source module is used for providing reference voltage, the temperature acquisition circuit is used for acquiring real-time temperature, the calibration circuit is used for calibrating circuit voltage, the MCU fits a real-time compensation curve by acquiring working environment temperature and the reference voltage, real-time compensation is carried out on acquired voltage signals according to the compensation curve, and the MCU is connected with a communication interface. The communication interface is connected with an upper computer, and the MCU can communicate with the upper computer. According to the utility model, compensation calibration can be carried out according to the ambient temperature, so that the consistency and accuracy of voltage acquisition can be still maintained in a wide temperature range, and the use requirements are met.

The density and power consumption of modern integrated circuits, such as Graphic Processing Units (GPUs), Central Processing Units (CPUs), and Network Processing Units (NPUs) is growing rapidly, which necessitates designing advanced cooling systems. Existing solutions for characterizing and validating these cooling system are inadequate. A flexible, scalable Thermal Test Vehicle (TTV) is disclosed which is based on an array of power transistors, measurement / control circuitry, and onboard computer. The TTV is configured for characterizing the performance of electronic cooling solutions under a variety of operating conditions.

The invention relates to the technical field of electronic measurement, and discloses a cable fault point positioning method, device and equipment, and the method comprises the steps: controlling a time domain reflection unit to generate a pulse signal with preset phase deviation, and collecting a reflection signal generated by the pulse signal in a to-be-detected cable; processing data points in the reflected signal according to a preset signal processing algorithm to obtain a denoised signal; determining an initial fault point of the to-be-detected cable based on the denoised signal; and acquiring temperature data of the to-be-detected cable, and performing position compensation on the initial fault point based on the temperature data and a preset temperature compensation algorithm to obtain a target fault point. Through fusion of multi-phase pulse collaborative acquisition and a multistage signal processing algorithm, physical sampling rate limitation of traditional equipment is broken through, a temperature dynamic compensation mechanism is combined, the problem of positioning drift caused by thermal expansion and cold contraction of a cable and dielectric constant change is solved, and high-precision positioning of a fault point in a complex environment is realized.

According to the power semiconductor device test system and method provided by the invention, the gate signal of the device to be tested under the actual working condition can be simulated through the signal generation module. The clamp module can be connected with the to-be-tested device and the performance test module, and in order to avoid the influence of parasitic parameters of the clamp on electric heat balance, device seats in the clamp module can be symmetrically distributed, so that the parasitic parameters of the clamp on each parallel branch can be the same, and errors introduced by the clamp module are eliminated. Besides, the performance test module is used for simulating the working condition of the to-be-tested device connected with the clamp module, and the monitoring control module is used for collecting the device temperature and voltage and current signals of the to-be-tested device in the performance test module, and monitoring and recording the voltage and current signals according to the device temperature to determine a test result. Monitoring and recording of voltage and current signals are automatically triggered through the numerical value of the temperature of the device, so that the accuracy of a test result can be improved while the labor cost is reduced.

The present invention relates to a method and an exhaust gas sensor for determining a corrected nitrogen oxide content in the exhaust gas of an internal combustion engine. The exhaust gas sensor (10) comprises a main body (12), a measuring cavity (40) arranged in the main body (12), in which a measuring electrode (44) is arranged, an exhaust gas electrode (22) exposed to the exhaust gas, which forms an amperometric measuring cell with the measuring electrode (44), and a reference cavity (50) connected to the ambient air, in which a reference electrode (52) is arranged.The method according to the invention comprises applying a measuring current (IP2) to the measuring electrode (44) such that a measuring voltage (V2) developing between the measuring electrode (44) and the reference electrode (52) is maintained at a predetermined first setpoint value, determining a nitrogen oxide content at least partially on the basis of the measuring current (IP2) applied to the measuring electrode (44), determining the electrical impedance of the amperometric measuring cell and determining a corrected nitrogen oxide content at least partially on the basis of the determined nitrogen oxide content and at least partially on the basis of the determined electrical impedance of the amperometric measuring cell.

The invention discloses a silicon rod surface resistance automatic detection and intelligent correction system and method. The system comprises a measurement execution module, a data processing module, a temperature correction module, an exception handling module and a result judgment module. The measurement execution module accurately positions and measures the temperature and the surface resistance of the silicon rod; the data processing module preliminarily corrects the data and identifies abnormity; the temperature correction module optimizes and corrects the measured value according to the temperature data and the influence curve; the exception handling module automatically retests the exception data; and the result judgment module gives final evaluation. The method sequentially comprises the steps of measurement preparation, data acquisition, primary processing, temperature correction, exception processing and result judgment and uploading. The problems that traditional measurement is greatly influenced by temperature, data deviation is prone to occurring and the automation degree is low are solved, the requirement of detection for the environment can be effectively lowered, energy waste is avoided, abnormal data are automatically recognized and processed, manual intervention is reduced, the detection accuracy and efficiency are improved, quality detection of the silicon rod in photovoltaic production is guaranteed, and the production efficiency is improved. And powerful technical support is provided for development of the photovoltaic industry.

The present invention relates to a pogo pin cooling system and a pogo pin cooling method and an electronic device testing apparatus having the system. The system uses a cooling fluid supply module for the cooling of the pogo pin, and the cooling fluid may be either a coolant or a cooling gas. When an electronic device is accommodated in the chip socket, the cooling fluid supply module supplies a cooling fluid into the chip socket through the cooling fluid supply channel and the inlet, and the cooling fluid passes through the pogo pins and then flows into the cooling fluid discharge channel through the outlet. In the present invention, the cooling fluid is mainly used to cool not only the pogo pins in the chip socket but also the bottom surface of the electronic device and the solder ball contacts on the bottom surface.

The invention discloses an electrometer based on constant temperature control, and belongs to the technical field of electrometers. Comprising an electrometer, the electrometer is connected with a temperature control component, a temperature control component circuit board is arranged in the temperature control component, and a temperature control circuit is arranged on the temperature control component circuit board; a refrigeration sheet and a temperature sensor are arranged in the cavity of the electrometer, and the refrigeration sheet and the temperature sensor are connected with a temperature control circuit through cables; and the temperature control circuit is used for receiving a temperature signal output by the temperature sensor and outputting a feedback control signal to the refrigeration sheet according to the temperature signal to adjust the temperature, so that the working temperature of the electrometer is constant. According to the invention, through the temperature control circuit, the temperature change caused by the external temperature change or the self-heating of the component can be reduced, the error caused by the temperature drift of the component is further reduced, and the stability of the electrometer is improved.

The invention provides a picoampere-level current measuring device and method with leakage estimation and digital compensation, and the device comprises an electrometer-level operational amplifier and a transimpedance feedback network which are used for converting a measured current into a voltage signal; in combination with a retaining ring conductor driven by a retaining ring buffer and an inner and outer double-layer metal shielding structure, high-resistance node leakage and external interference are remarkably reduced. The digital controller injects 5mV-50mV micro excitation into the retaining ring in a non-sampling window and detects output response so as to estimate input equivalent leakage conductance and perform online compensation; and meanwhile, environment self-adaptive correction is carried out according to a temperature and humidity-leakage admittance model. The system adopts a 24-bit analog-to-digital converter, two-stage zero-drift amplification and multi-point linearity calibration can be switched, picoampere-level current measurement with high precision, low noise and wide dynamic range is realized, and the system is suitable for the fields of high-insulation detection, light current measurement, electrochemical micro-current analysis and the like.

A method and a system for optimization to non-contact micro intelligent sensing in secondary DC loop potential are provided, including demodulating a weak AC current modulation signal through a demodulation circuit and amplifying the weak AC current modulation signal; amplifying the weak AC current modulation signal to output a stable and amplified measurable potential signal; processing the potential signal for noise to obtain a stable DC potential signal; inputting the DC potential signal to a comprehensive computing module for analysis and processing; using micro sensors to measure information. The measured potential results are input to the comprehensive computing module to analyze and correct, and the measurement results are output to the communication module for external output. The equipment is packaged to form a potential collection “probe” and a potential measurement “unit”. The potential measurement “unit” supports multiple potential collection “probes” for accessing.

The present application provides a resistance detection system and method for live working on distribution networks, which relates to the field of intelligent resistance detection. It uses data analysis technology based on artificial intelligence to respectively perform temporal feature correlation on the time queue of temperature values and the time queue of humidity values during the insulation detection process, and performs significant fusion interaction based on the query matching of principal components. Based on this, an insulation resistance measurement compensation factor is intelligently generated based on the multi-dimensional correlation representation features among the temperature temporal correlation features, the humidity temporal correlation features, and the significant interaction of temperature and humidity principal components, and the compensated insulation resistance value is calculated based on the compensation factor. In this way, through the automated measurement process, the accuracy of the measurement data can be ensured, and then a more accurate insulation resistance value can be obtained. Moreover, by dynamically compensating the insulation resistance value based on the real-time collected environmental data, the performance of the insulation material in the real working environment can be more accurately reflected.

The present invention provides a calibration device and corresponding calibration method for calibrating a chuck, and a calibration instrument, including a calibration card (6) attachable to or within an insertion opening (E) of a wafer prober (1), forming a corresponding substantially closed space when the calibration card (6) is attached, calibration temperature probes (60, 61) attached to the calibration card (6), and a chuck (3) for carrying a wafer (4), the chuck (3) being temperature-controlled to a set temperature by a temperature controller (300) and movable in a lateral direction (x, y) and a height direction (z) by a position controller (350), and a temperature probe (60, 61) mounted on or above the surface (O) of the chuck (3). and an evaluation device (600) connectable to the calibration temperature probes (60, 61), the temperature controller (300), and the position controller (350), the evaluation device (600) being configured to calibrate temperature output values ​​of the one or more temperature probes (S1-S9) based on the current temperatures at the various positions detected by the calibration temperature probes (60, 61).

The invention provides a temperature control assembly for a probe card and the probe card, and relates to the field of wafer testing. The temperature control assembly for the probe card comprises a cover plate; the heating assembly is arranged on the side, away from the probe card, of the cover plate, and the heating assembly is electrically connected with the testing machine table; the heating buffer assembly is arranged on one side, close to the probe card, of the cover plate; the heat preservation assembly is arranged on the side, close to the probe card, of the cover plate, and the heat preservation assembly is an assembly with a closed pattern and is distributed on the outer side of the probe card; wherein the cover plate, the heat preservation assembly and the probe card form a heat receiving space, and the orthographic projection of the heating assembly on the cover plate is within the orthographic projection of the heating buffer assembly and the heat preservation assembly on the cover plate. According to the embodiment of the invention, the probe mark offset caused by temperature difference generated by heating of the probe card in the test process can be avoided, so that the test efficiency can be improved.

Provided is an inspection apparatus capable of improving the responsiveness of temperature adjustment of a substrate. The inspection apparatus of the present invention includes: a stage capable of placing a substrate; a cooling section that cools the substrate placed on the stage; a probe card having a probe that contacts the substrate to supply power; a light irradiation mechanism that irradiates a surface of the substrate opposite the placement surface with light; and a control section that controls the light irradiation mechanism.

The invention relates to the technical field of transformers, in particular to a current transformer with a temperature compensation function. The current transformer comprises a magnetic circuit structure used for sensing a primary side current and outputting a secondary side current signal; the signal processing unit is integrated in the current transformer and is used for executing the current measurement process; wherein the current measurement process comprises the following steps: injecting a test signal into the magnetic circuit structure; wherein the frequency of the test signal is higher than the power frequency and is not integer multiples of the power frequency; measuring amplitude response and phase response of the magnetic circuit structure to the test signal; calculating magnetic conductivity response data under the test signal based on the amplitude response and the phase response; according to the magnetic conductivity response data and a preset magnetic conductivity-temperature mapping relation, determining a temperature variation; generating a current compensation coefficient based on the temperature variation; and correcting the original current signal by using the current compensation coefficient to obtain a compensated current signal. According to the invention, the measurement reliability of the mutual inductor under various temperature conditions is improved.

The invention relates to the technical field of electronics, in particular to a bus capacitor life estimation method and device, a storage medium and electronic equipment, and the method comprises the steps: collecting the operation characteristic parameters and instantaneous environment temperature of a system where a bus capacitor is located in real time according to a sampling period; judging a working condition category corresponding to the current sampling period according to the operation characteristic parameters, and obtaining a unit damage life and a correction coefficient corresponding to the working condition category; calculating to obtain the damage life increment of the current sampling period, wherein the calculation formula is shown in the specification; accumulating the damage increments of all the sampling periods to obtain a total accumulated damage life; and subtracting the total accumulated damage life from the rated life of the bus capacitor to obtain the residual life of the bus capacitor. On the premise that additional hardware sampling equipment is not added, high-precision and high-efficiency bus capacitor online service life estimation can be completed, and meanwhile the good working condition self-adaptive capacity is achieved.