The invention discloses a method for monitoring a packaging aging mode of a
power module in real time and a related device, and belongs to the technical field of power electronic devices. According to the method,
thermal network models corresponding to different packaging aging
modes are established according to the structure of the
power module, and
frequency separation points corresponding to the different packaging aging
modes are found; setting a test frequency, and collecting the conduction
voltage drop of the
power module and the load current of the
inverter circuit; and analyzing the difference of the conduction
voltage drop hysteretic curve according to the deviation or rotation of the conduction
voltage drop hysteretic curve caused by different aging
modes such as bonding wire falling,
welding layer fatigue and heat dissipation
system aging, and determining the packaging aging mode of the power module. By adopting the method, the packaging aging mode of the power module can be monitored in real time, aging reasons can be effectively distinguished, maintenance measures can be accurately taken, serious faults can be avoided, and the maintenance cost can be reduced; and meanwhile, the reliability and the stability of the whole
system can be improved by monitoring and repairing the packaging aging problem in time.