7results about How to "Reduce size requirements" patented technology

The utility model relates to the stamping field discloses a kind of lateral material pressing mechanism of stamping die. Including lateral material presser and elastic reset piece, the elastic reset piece is opposite with lateral material presser and is used to make lateral material presser reset, lateral material presser is located above positive material presser and is slidably matched with positive material presser, lateral material presser is equipped with inclined wedge upper baffle, inclined wedge upper baffle extends along the sliding direction of lateral material presser, the lateral material presser is slidably matched with inclined wedge upper baffle. The lateral material pressing mechanism of stamping die in the utility model solves the problem that the weight of upper die holder is too large, resulting in high cost of stamping die.

The utility model discloses a multipurpose test field for agricultural technology development belongs to multipurpose test field technical field field, including test basin, the inside fixed cross bulkhead of test basin, and one side of cross bulkhead is inserted and is connected with no.

This invention discloses a rapid prediction method for the thermal conductivity of phenolic resin based on scanning electron microscopy (SEM) images. This invention requires only conventional SEM images, extracts structural parameters such as porosity, equivalent particle diameter, and bond ratio through automated image processing, and then inputs these structural parameters into a pre-trained machine learning surrogate model to achieve rapid prediction of the material's thermal conductivity. Compared with existing methods that require multi-scale 3D reconstruction and direct numerical solutions, this invention significantly reduces the requirements for sample size and characterization equipment, simplifies the modeling process, and achieves high computational efficiency. Furthermore, because the prediction model fully incorporates the influence of nanoscale pores and particle structure on thermal conductivity during the training phase, this invention can quickly provide the effective thermal conductivity of resin-based composite materials while maintaining high accuracy, providing an efficient and reliable means of evaluating thermal conductivity performance for material formulation design and process optimization.

The utility model belongs to ship loader technical field, concretely relates to a ship loader pitch rotation device, including support platform, be provided with the hinged support on support platform rotation, be provided with the cantilever frame on the hinged support hinged setting, the support platform is fixedly provided with the support frame, support frame top one side is provided with the steering device, the steering device includes the mounting seat and the goose head frame, be provided with the first pulley on the goose head frame, the goose head frame is hinged and is connected with the mounting seat, the mounting seat fixed connection support frame, be provided with the winding device on the support frame, the winding device is around and is provided with the steel wire, and the other end of steel wire passes through the first pulley after connecting cantilever frame far from the one end of hinged support. The utility model through setting up hinged cantilever frame swing when driving hinged support rotation, need not drive support frame rotation, simultaneously make the goose head frame of installing first pulley hinged installation, make it can swing with cantilever frame synchronization, guarantee cantilever frame angle adjustment smoothly.

The utility model provides a kind of foldable handheld fan, including fan unit, handle and rotating support.Handle extends along length direction, and inside has accommodating cavity.Rotating support one end is connected with fan unit, and the other end is rotatably connected with handle through hinging structure.In handheld mode, define a minimum circumscribed cuboid space defined by fan unit and handle together.Rotating support at least a part is overlapped with handle in length direction, to shorten the combined span of fan unit and handle in length direction.At least a part of hinging structure is offset outside accommodating cavity in thickness direction, and simultaneously located in minimum circumscribed cuboid space.The utility model realizes rotating support and handle length overlap and hinging structure convex by rotating support rear shift offset, under the premise of keeping compact appearance, effectively shorten handheld overall length and release handle internal space.

The utility model discloses an air spring positioning anti-rotation structure and air spring, air spring positioning anti-rotation structure includes the air spring upper seat, piston seat, the bearing of being connected between the air spring upper seat and piston seat and makes the air spring upper seat and piston seat rotate and connect, the air cock of being installed on the piston seat, air spring positioning anti-rotation structure still includes the limiting hole of being located on the air spring upper seat, the inside end portion is matched with the air cock and can be inserted on the air cock with the outside end portion and the limiting hole cooperation and can be located in the limiting hole in the fixed pin, can make the air spring upper seat positioning, prevent the air spring upper seat from rotating to other angle when assembling, and when the fixed pin is taken down, other structure that cooperates with the fixed pin will not interfere with the suspension peripheral piece, and the plug-in is convenient and reliable, will not be abnormal and fall off, also will not cause air spring function to be damaged because of the leakage.

The application provides a chip aging circuit and electronic equipment, which are applied to a to-be-tested module. The chip aging circuit comprises a control module, a connecting module and an aging box. The control module is arranged outside the aging box and connected with the connecting module. The control module is used for controlling the to-be-tested module to enter an aging state through the connecting module. The connecting module is arranged on the side wall of the aging box. The connecting module is used for connecting the control module outside the aging box and the to-be-tested module inside the aging box. The chip aging circuit can simultaneously test multiple chips, thereby reducing the size requirement of the aging box. When the to-be-tested module is subjected to high-temperature aging, the normal work of the control module is not affected. The service life of the control module is prolonged, and the performance stability of the control module is improved.