132 results about "Planar inductor" patented technology

Embodiments of the invention relate to a method and system for transferring power wirelessly to electronic devices. The system can utilize magnetic coupling between two coils at close proximity to transfer sufficient power to charge an electronic device. Embodiments of the invention pertain to an array of spiral coils that can be used to transmit power for transfer to receiver coils. Potential applications of this technology include charging consumer electronic devices (cell phones, laptops, PDAs, etc), developing hermetically sealed devices for extreme environments, and less invasive transcutaneous energy transfer (TET) systems. Various embodiments of the subject system can be referred to as PowerPad system. Embodiments can incorporate one or more of the following: planar inductors, PCB transformers, and very high frequency power supplies. Embodiments of the invention also pertain to planar inductors having characteristics that allow the production of even magnetic field, as well as systems that incorporate such planar inductors.

A power converter integrates at least one planar transformer comprising a multi-layer transformer substrate and/or at least one planar inductor comprising a multi-layer inductor substrate with a number of power semiconductor switches physically and thermally coupled to a heat sink via one or more multi-layer switch substrates.

A storage magnetic element, which minimizes the power loss in the planar winding due to the fringe magnetic field associated with a discrete air gap, is presented. The invention describes a construction technique wherein the magnetic core is formed by an E section made of high permeability magnetic material and an I section made by a material capable to store energy due to its distributed gap structure. The I section of the magnetic core in one of the embodiments is covered by an electrically conductive shied to force the magnetic flux into the I section and to minimize the component of the fringe magnetic field perpendicular on the planar winding. In another embodiment of this invention the electrically conductive shield is replaced by a high magnetic permeability material to accomplished the same goal of reducing the magnetic field component perpendicular on the planar winding. In a prefer embodiment of this invention the I section of the magnetic core has a cavity which will accommodate the middle leg of the E section. This construction will force the fringe magnetic field at the edge of the gap to be parallel with the planar winding of the storage magnetic element. In another embodiment of this invention a flat I section is used with the addition of another high permeability magnetic material placed on the I section on top of the winding. This construction will force the fringe magnetic field around the edge of the gap to be parallel with the planar winding. The embodiments of this invention are aimed at reducing the fringe magnetic field perpendicular on the planar winding, lowering the eddy current induced by this field.

As wireless communication technology evolves, various transceivers become integrated into a single system, which implements a seamless connection to search available frequency bands and to provide wireless connections regardless of their wireless standards. One of the key technologies for seamless implementation is an ultra-wideband local oscillator, which can overcome the restriction of limited tuning range in typical RF local oscillators. Many RF oscillators incorporate LC-tuned oscillators because of their good noise performance while their tuning range is limited by fixed inductance and varied capacitance. The planar inductor fabricated on the CMOS process occupies a large area as well. By replacing the planar inductor with the array of bondwires, and including switches to provide proper impedance for the circuit to generate negative impedance, the tuning range of a CMOS voltage-controlled oscillator (VCO) is extended more than 100%, which number can not be achieved in a convention VCO.

Low Q associated with passive components of monolithic integrated circuits (ICs) when operated at microwave frequencies can be avoided or mitigated using high resistivity (e.g., ≧100 Ohm-cm) semiconductor substrates (60) and lower resistance inductors (44′, 45′) for the IC (46). This eliminates significant in-substrate electromagnetic coupling losses from planar inductors (44, 45) and interconnections (50-1′, 52-1′, 94, 94′, 94″) overlying the substrate (60). The active transistor(s) (41′) are formed in the substrate (60) proximate the front face (63). Planar capacitors (42′, 43′) are also formed over the front face (63) of the substrate (60). Various terminals (42-1′, 42-2′, 43-1, 43-2′,50′, 51′, 52′, 42-1′, 42-2′, etc.) of the transistor(s) (41′), capacitor(s) (42′, 43′) and inductor(s) (44′, 45′) are coupled to a ground plane (69) on the rear face (62) of the substrate (60) using through-substrate-vias (98, 98′) to minimize parasitic resistance. Parasitic resistance associated with the planar inductors (44′, 45′) and heavy current carrying conductors (52-1′) is minimized by placing them on the outer surface of the IC where they can be made substantially thicker and of lower resistance. The result is a monolithic microwave IC (46, 58) previously unobtainable.

A planar-like inductor coupling structure includes a first planar inductor embedded in an insulating material layer and a second planar inductor also embedded in the insulating material layer. The first planar inductor and the second planar inductor are substantially at the same height, and have a portion in a horizontal distribution serving as a coupled overlapping region with electric insulation from each other. In addition, the first planar inductor and the second planar inductor may be at different heights.

An in-line surge suppressor assembly having a body with a side aperture and an inner conductor positioned coaxial within a bore of the body. An insert having a planar inductor coil with a post extending from an origin point of the planar inductor coil is positioned with the post passing through the side aperture and coupled to the inner conductor at a distal end. An outer rim of the planar inductor coil is electrically coupled to the body.

The inductance of a monolithic planar inductor is distributed into smaller inductor portions. The smaller inductor portions are provided in a cascode configuration in a manner that causes inductor to function as a differential inductor device. The node between the immediate inductor portions is a common-mode point of the inductor device, which is typically connected to the signal ground. The nodes at the outer ends of the inductor portions are differential outputs, e.g. output nodes of an amplifier device at the interface of the device itself and the following device (e.g. input stage of a mixer). Some of the inductor portions are arranged to be symmetrically bypassed or shortcut in relation to the common point in one or more steps for operation in one or more higher radio frequency band. By means of the switchable symmetric shortcut, a controllable inductance step can be provided. The common-mode signal is affected the same inductance regardless of the controlled condition.

A substantially symmetric inductor comprising a plurality of windings, at least one conductor crossover, and a peripheral conductor disposed at the periphery of the plurality of windings, the plurality of windings having a generally symmetric shape, each of the plurality of windings having a center and being of a different size from other ones of the plurality of windings, the peripheral conductor being generally symmetric and having a center, the plurality of windings and the peripheral conductor being substantially concentric, the conductor crossovers being disposed such that the symmetry of the inductor in substantially preserved. A method of winding an inductor such that the inductor is substantially symmetric about a center of the inductor, whereby signal degradation due to asymmetry of the inductor is substantially minimized.

Disclosed is methodology and apparatus for producing a planar inductor having a high quality (Q) factor. The inductor is formed by providing a first, relatively wide coil turn, and at least a pair of relatively more narrow second coil turns, displaced in a different plane from that occupied by the first coil turn. The configuration of such coil turns produces a high value of mutual coupling among the coil turns, resulting in an inductor having a high quality (Q) factor.

The invention discloses a flexible-substrate-based passive wireless pressure sensor with a self-packaging function. The pressure sensor comprises an upper flexible substrate, an upper metal layer, a middle flexible substrate, a lower metal layer and a lower flexible substrate, which are sequentially arranged from top to bottom and fixedly connected. An electric through hole and a cavity are formed in the middle flexible substrate. The upper metal layer comprises a planar inductance coil and a capacitor upper polar plate positioned on the middle part of the planar inductance coil. An inner connector of the planar inductance coil is connected with the capacitor upper polar plate. The lower metal layer comprises a capacitor lower polar plate opposite to the upper plate capacitor and an interconnecting wire connected with the capacitor upper polar plate. The sizes of the capacitor upper polar plate and capacitor lower polar plate are the same. An outer connector of the planar inductance coil of the upper metal layer is connected with the interconnecting wire of the lower metal layer through a conductive medium column in the electric through hole. The cavity of the middle flexible substrate is positioned between the capacitor upper polar plate and capacitor lower polar plate. The pressure sensor has the high performance of self packaging, non-contact, high sensitivity and high quality factor.

A power converter integrates at least one planar transformer (T1, T2) comprising a multi-layer transformer substrate and/or at least one planar inductor comprising a multi-layer inductor substrate with a number of power semiconductor switches (S7-S10) physically and thermally coupled to a heat sink via one or more multi-layer switch substrates.

The invention discloses a micro-electronic mechanical tunable band pass filter that consists of a group of micro-electronic mechanical capacitance serial switch and an planar inductor(L), the amount of the capacitance that is connected to the wave filter capacitance is regulated by the on and off of the micro-electronic capacitance serial switch(kn) so as to regulate the central frequency point of the wave filter. The planar inductor(L) applies the GaAs liner(1) as the liner, the two sides of the upper surface of the GaAs liner are provided with a transmission line, the inductive choke(3) is connected with the transmission line through a connecting support pole and is suspended at the silicon nitride media layer(9-0) and the transmission line(2-2); the micro-electric capacitance type serial switch applies the GaAs liner as the liner, the upper surface of the GaAs liner is provided with transmission line(5) and a pull down electrode(8). One part of the transmission line and the pulldown electrode are provided with a layer of SiN media layer(9), an anchor area(6) that is connected with one end of the switch gird(7) is arranged on the transmission line so as to suspend the switch gird above the SiN media layer.

The invention provides a passive wireless pressure and temperature integrated sensor based on LTCC and a preparation method of the integrated sensor and solves the problem that existing sensor measurement parameters and signal response are single. The sensor has a wireless pressure sensitive part and a wireless temperature sensitive part which are stacked mutually; the wireless pressure sensitivepart comprises four layers of LTCC base plates, namely, a middle layer, a first layer with cavity, a second layer with cavity and a bottom layer, the first layer with cavity and the second layer withcavity are located above and below the middle layer and have corresponding cavities, the bottom layer is located below the second layer with cavity, a planar inductor and a cavity parallel plate capacitor first electrode are formed on the upper surface of the middle layer, a cavity parallel plate capacitor second electrode is formed on the upper surface of the bottom layer, and the two electrodescorrespond to the cavities of the first layer with cavity and the second layer with cavity; the temperature sensitive part comprises a base layer which is formed by an LTCC base plate, and a planer thermosensitive inductor and a planer interdigitated capacitor are formed on one surface of the base layer; the pressure sensitive part and the temperature sensitive part form two LC resonance circuitswith different resonant frequencies.

Method of forming a ferromagnetic layer on at least one surface of a dielectric material that may be serve as an inductive core on a printed circuit board or a multichip module. Conductive leads can form two separate coils around the core to form a transformer, and a planar conducing sheet can be placed on or between one or more of the dielectric layers as magnetic shielding. The core can be formed at least in part by electroless plating, and electroplating can be used to add a thicker layer of less conductive ferromagnetic material. Ferromagnetic layers are formed by dipping the dielectric surface in a solution containing catalytic metal particles having a slight dipole, and placing the surface in a metal salt to cause a layer containing metal to be electrolessly plated upon the dielectric. Surface roughening techniques can be used before the dipping to help attract the catalytic particles.

An apparatus includes a first conductive loop coupled to conduct a first current and a second conductive loop coupled in parallel with the first conductive loop and further coupled to conduct a second current. A first conductive portion forms a part of the first conductive loop and the second conductive loop. The first conductive portion is coupled to conduct the first current and the second current. In at least one embodiment of the apparatus, the first conductive loop and the second conductive loop are planar inductors formed in a conductive layer on a substrate of an integrated circuit.

The invention discloses an inductor and a manufacturing method thereof. The manufacturing method of the inductor includes the following steps: S1, manufacturing a magnetic core, pressing granulated magnetic powder into a high-density block, cutting into a magnetic core structure, and sintering to make it compact; The magnetic core includes a central column and two leaf pendulums; S2, winding the coil: winding the coil on the central column, after winding, the section of the coil is parallel to the long-height plane of the inductor, and the coil The two lead-out ends are located on both sides of the center column and are on the same plane; S3, compression molding: fill a layer of the granulated magnetic powder at the bottom of the mold for pre-compression and densification, and then place the magnetic core wound with the coil in step S2 Implantation into a mold; after implantation, filling the mold with the granulated magnetic powder for compression molding; S4, heat treatment of semi-finished products; S5, production of terminal electrodes. The inductor and its manufacturing method of the present invention have higher self-resonance frequency on the basis of obtaining an inductor with large inductance.

A circuit device having an inductor and a capacitor in parallel connection includes a planar inductor embedded in an insulating material layer, wherein the planar inductor has a winding wire portion, a first connection terminal and a second connection terminal. The first connection terminal and the second connection terminal are located at different elevations and have an overlapping region. A capacitor dielectric layer is located within the overlapping region between the first connection terminal and the second connection terminal, and the capacitor dielectric layer and the first connection terminal and the second connection terminal together form a capacitor.