23 results about "Planar inductor" patented technology

The invention discloses a bypass inductor echelon current limiting topology and method for solid-state power distribution equipment, relates to the technical field of power electronic distribution, and is suitable for solid-state power controllers in the fields of aerospace, new energy automobiles and industrial automation. In order to solve the problems that when a large capacitive load is started, a current peak is likely to be generated to damage a device, and an existing current limiting scheme is low in efficiency or large in size, the topology comprises an input circuit, a main power circuit, an auxiliary circuit, a current limiting circuit, an absorption circuit and a load side circuit. According to the method, the auxiliary circuit switch tube is turned on in an echelon mode, and the main switch tube is turned on to complete starting after load voltage approaches power supply voltage and reaches a non-voltage-difference condition. According to the planar inductor integrated PCB, the size is reduced, the problem of long-term heating of a resistor is solved, the TVS overvoltage protection and RC anti-interference design are matched, the current peak is effectively restrained, the system efficiency and reliability are improved, and the high-power-density and differential-pressure-free starting requirements are met.

The application discloses an electronic tuning type multifunctional sensor and a preparation method thereof. The sensor comprises a quartz crystal, a composite electrode and an oscillation circuit; the first end of the composite electrode is connected with the first end of the oscillation circuit, the second end of the oscillation circuit is connected with the first end of the quartz crystal, the second end of the quartz crystal is connected with the second end of the composite electrode, and the second end of the oscillation circuit is an output end. The composite electrode comprises a substrate, a planar inductive microelectrode and a planar capacitive microelectrode which are arranged on two sides and are connected in series through a via hole; a nano-magnetic iron oxide film is deposited on the inductive side, a hydroxylated ultra-high specific surface area disordered porous carbon film is deposited on the capacitive side, and a perfluorosulfonic acid protective layer is coated on the surfaces of the two films. The application forms a frequency selection network by connecting the double-sided electrode and the quartz crystal in series, and outputs an anti-interference frequency signal; the protective layer is insulated and prevents short circuit on the inductive side, and improves the humidity response on the capacitive side; manual overturning can switch the detection of metal damage, non-metal defects and environmental humidity, and the sensor has the advantages of high stability and low cost.

This invention discloses a sensor for detecting ice, water, and dryness states, comprising a substrate, a first metal line, a second metal line, a third metal line disposed on the surface of the substrate, a variable capacitor, an interdigitated capacitor, and a planar inductor. One end of the variable capacitor is connected to one end of the planar inductor via the first metal line, and the other end of the planar inductor is connected to one end of the interdigitated capacitor via the second metal line. The other end of the interdigitated capacitor is connected to the other end of the variable capacitor via the third metal line. The capacitance value of the interdigitated capacitor changes with the different dielectric constants of the materials between the interdigitated fingers. Since the relative dielectric constants of ice, water, and dryness change at different frequencies, the capacitance value of the interdigitated capacitor also changes. Therefore, this sensor for detecting ice, water, and dryness states has advantages such as simple structure, high recognition rate, small size, and process compatibility.

The present application relates to the technical field of wireless passive sensing, and discloses a differential sensing system for metal crack detection and a quantitative detection method thereof, which comprises an RFID reader-writer and a passive RFID differential sensing tag; the passive RFID differential sensing tag comprises a communication antenna, an RFID chip, an impedance matching network, a planar inductive sensing module, a radio frequency switching module, an energy recovery module and a data processing unit; the impedance matching network is connected between the communication antenna and the RFID chip; the planar inductive sensing module comprises a reference planar inductor and a sensing planar inductor; after double-state alternate sampling of the reference sensing, difference is performed, so that environmental disturbances such as reading and writing distance, sensor posture, multipath and temperature drift are significantly suppressed, and differential noise suppression is realized; the switching module is powered by the energy collection antenna, voltage doubling rectification and charge management module in the energy collection management module, battery maintenance is avoided, and passive operation is realized.

The application provides a PCB air-core inductor, a design method thereof and a switching power supply, wherein the design method comprises the following steps: determining the winding turns, winding width and winding thickness of the PCB air-core inductor, and designing the number of winding layers in the PCB and the width and thickness of the winding metal in each winding layer according to the winding turns, winding width and winding thickness; sequentially connecting the winding metal in each winding layer in series to form a PCB winding, wherein the PCB winding is embedded in an insulating support body composed of insulating medium; forming a metal shielding body around the PCB winding, wherein the metal shielding body and the PCB winding are separated by insulating medium; and the metal shielding body comprises four circumferential shielding walls, one upper shielding wall and one lower shielding wall, and the beginning and end of the PCB winding are connected to the input terminal and the output terminal respectively and lead out through the corresponding circumferential shielding walls. The application solves the problems of poor magnetic shielding performance and large high-frequency loss of the PCB planar inductor in the prior art.

The utility model discloses a full-bridge converter module without a blocking capacitor. The full-bridge converter module comprises an input filtering unit, a first inversion bridge arm, a second inversion bridge arm, a planar transformer T, a first rectification bridge arm, a second rectification bridge arm, a planar inductor Lf, an output capacitor Co and a square wave detection unit M, the output capacitor Co is connected between the output positive end and the output negative end; a load Rload is connected between the output positive end and the output negative end; according to the full-bridge converter module, a planar magnetic technology is adopted, blocking capacitor configuration is avoided, positive and negative volt-second products are calculated through square wave voltage sampled by a resistance voltage division circuit and driving edge time captured by a comparator circuit, duty ratio control quantity is output, primary side full-bridge driving signal pulse width is dynamically adjusted, and magnetic flux balance control is achieved; the problem that the blocking capacitor occupies a large area is solved, and the high-power density design of the brick power supply module can be realized.

This disclosure provides a filter and its fabrication method, as well as an electronic device, belonging to the field of microwave technology, and can solve the problem of low Q value of inductors. The filter provided includes: a first substrate and a second substrate disposed opposite to each other, with a dielectric cavity disposed between the first substrate and the second substrate; the filter further includes: at least one inductor, the inductor including a first planar inductor structure disposed on a first surface of the first substrate, a second planar inductor structure disposed on a first surface of the second substrate, and a columnar inductor structure disposed within the dielectric cavity, the first end and the second end of the columnar inductor structure being electrically connected to the first planar inductor structure and the second planar inductor structure, respectively; and at least one capacitor disposed on the first surface of the first substrate, and the capacitor being electrically connected to the inductor.

The invention provides an integrated high-precision plane inductance type linear displacement sensor. The integrated high-precision plane inductance type linear displacement sensor comprises a shell, a cover plate, a movable ruler, a fixed ruler, a sliding block, a sliding plate, a push rod and a side face cover plate. The air gap distance between the movable ruler and the fixed ruler is always kept in a constant and consistent working state in the measurement process, so that the problem of precision deviation caused by air gap fluctuation of a traditional linear displacement sensor is solved, and the problem of poor mechanical environment adaptability is also solved; measurement error fluctuation caused by shaking of the movable ruler due to mechanical environment vibration and impact is effectively inhibited.

The invention discloses a highly-integrated bulk acoustic wave resonator, a filter and a preparation method, and belongs to the technical field of filters, the bulk acoustic wave resonator comprises an active region and a non-active region at least partially surrounding the active region, and the bulk acoustic wave resonator further comprises a substrate, a bottom electrode, a piezoelectric layer and a top electrode which are stacked in the longitudinal direction, the bulk acoustic wave resonator further comprises a planar inductor, a dielectric layer and a capacitor electrode, the planar inductor and the top electrode are in the same layer, the dielectric layer is located on the sides, away from the piezoelectric layer, of the planar inductor and the top electrode, the capacitor electrode is arranged on one side of the dielectric layer, and the capacitor electrode and the top electrode form a capacitor structure. And the planar inductor and the capacitor structure are positioned in the non-active region and are respectively positioned on two sides of the active region. According to the invention, the inductor and the capacitor are integrated in the bulk acoustic wave resonator, so that miniaturization of a radio frequency device is facilitated.

The invention provides a PCB air core inductor, a design method thereof and a switching power supply, and the design method comprises the steps: determining the winding turn number, the winding width and the winding thickness of the PCB air core inductor, and designing the number of winding layers in a PCB and the width and the thickness of winding metal in each winding layer according to the winding turn number, the winding width and the winding thickness; the winding metal in all the winding layers is sequentially connected in series to form a PCB winding, and the PCB winding is embedded in an insulating supporting body formed by insulating media; a metal shielding body is formed on the periphery of the PCB winding, and an insulating medium is arranged between the metal shielding body and the PCB winding; wherein the metal shielding body comprises four peripheral shielding walls, an upper shielding wall and a lower shielding wall, and the starting end and the tail end of the PCB winding penetrate through the corresponding peripheral shielding walls through the input terminal and the output terminal respectively and are led out. The PCB planar inductor solves the problems that in the prior art, a PCB planar inductor is poor in magnetic shielding performance, large in high-frequency loss and the like.

Techniques and mechanisms for providing structures of a magnetic material based inductor. In an embodiment, an inductor comprises a body of a magnetic material, and a conductor which extends along a surface of the body. The body comprises a carrier material and magnetic filler particles distributed in the carrier material. A passivation material of the inductor is provided adjacent to the conductor and to surfaces of the filler particles. The conductor and the passivation material comprise different respective material compositions, wherein the passivation material comprises one of nickel, tin, copper, palladium, or gold. In another embodiment, the inductor is one of a plated through hole inductor type of a planar inductor type.

The present invention relates to an impedance matching circuit (11), an impedance matching module (1) for a plasma process supply system (8) and a plasma process system (9), configured for a power of 500 W or more and a frequency in the range of 2 MHz to 100 MHz, for mounting on a cooling body (7), the impedance matching module comprising: a) a planar inductor (2); b) an insulating circuit board (3); c) a substrate (4), in particular a ceramic plate; d) the planar inductor (2) is divided into two planar conductor paths (2a, 2b) of equal length, connected in parallel and arranged on both sides and congruently on the insulating circuit board (3); e) the two conductor paths (2a, 2b) are two f) the substrate (4) is thicker than the insulating circuit board (3) and is fixedly connected to the surface of the insulating circuit board (3) over most of the lower surface (3b) of the insulating circuit board (3); g) the planar conductor paths (2a, 2b) can be spaced from the cooling body (7) by the substrate (4) to electrically insulate them from the cooling body (7); and h) the substrate (4) and the connection of the circuit board (3) to the substrate (4) are suitable for dissipating heat from the planar conductor paths to the cooling body (7).

The application provides a spiral planar inductance wafer temperature measuring device and a manufacturing method and application thereof, relates to the technical field of wafer temperature measurement, and comprises a silicon-based wafer substrate, an insulating layer on the surface of the wafer substrate, and a spiral planar inductance coil integrated on the insulating layer. A temperature sensing unit is electrically connected with the coil and comprises a high-frequency signal generator, an impedance analysis module and a temperature calculation unit. The inductance of the coil changes with the temperature of the substrate, the temperature calculation unit determines the inductance change by analyzing the impedance parameters, and calculates a real-time temperature value based on a preset temperature-inductance relationship. By optimizing the spiral structure and distributed arrangement of the coil, combining high-frequency detection and three-dimensional calibration algorithms, the application realizes high-precision, rapid, distributed and anti-interference online monitoring of the wafer surface temperature. The device has compact structure, good process compatibility, can be directly integrated into process equipment, and is suitable for temperature monitoring of key processes such as chemical vapor deposition and plasma etching.

A flat-plate inductor is provided for being disposed on an external mainboard. The external mainboard includes an input node and an output node. The flat-plate inductor includes a first core, a first circuit board, and a second circuit board. The first core includes a base, a first column, and a second column. The first column and the second column are disposed on two opposite sides of the base. The first circuit board includes a first coil and a first through hole. A plurality of layers of first traces of the first coil respectively surround the first through hole, and the first coil is sleeved on the first column, and the first column passes through the first through hole. The second circuit board includes a second coil and a second through hole. A plurality of layers of second traces of the second coil respectively surround the second through hole, and the second coil is sleeved on the second column, and the second column passes through the second through hole. The first coil and the second coil are connected in parallel or in series between the input node and the output node, and generate magnetic fluxes in the same direction.

The present application relates to the field of laser-activated selective metallization, and particularly relates to a laser-activated selective metallization composite and a permanent magnet synchronous brushless motor made of the composite. The present application provides a laser-activated selective metallization composite suitable for permanent magnet synchronous brushless motors, and utilizes the composite to prepare a permanent magnet synchronous brushless motor, including the following steps: preparing a laser-activated selective metallization composite, generating a spiral planar inductor coil and a conductive metal through hole on the surface and inside of the laser-activated selective metallization composite respectively through laser activation, electroless plating and electroplating, and assembling the permanent magnet synchronous brushless motor. The permanent magnet synchronous brushless motor of the present application is low in cost and convenient to manufacture, and can significantly reduce production cost. At the same time, the preparation process is highly automated, avoiding tedious manual labor. The prepared permanent magnet synchronous brushless motor is small in size, thin in thickness, low in weight, stable in rotation speed, and has a good application prospect.

This invention discloses a multifunctional wireless sensor based on the breakdown discharge effect. The multifunctional wireless sensor includes a horizontal anchor area, an upper structure, a lower structure, a bistable structural beam, a tip discharger, metal wires, a planar inductor, a temperature-sensitive capacitor, and a horizontal plane. Increased temperature causes the bistable structural beam to change from a bending shape along the negative X-axis to a bending shape along the positive X-axis. Based on the coupling effect of electrostatic induction and triboelectric charging, the polytetrafluoroethylene propylene film and the polymethyl methacrylate film separate, generating a high potential difference, which in turn breaks down the air around the tip discharger, generating an electromagnetic wave signal. The different lengths of the five bistable structural beams cause their bending transformations to occur at different temperatures. The inductor or capacitor in the circuit modulates the characteristic frequency of the electromagnetic wave signal; changes in inductance reflect identification, and changes in the temperature-sensitive capacitor reflect temperature changes, thus achieving multifunctional wireless sensing with temperature range, wide measurement range, and high accuracy for both temperature and identification. This sensor has advantages such as self-powered operation, long transmission distance, multifunctional sensing, and wireless transmission.

An apparatus including a plurality of vertically oriented insulating substrates, each substrate having a planar surface including a looped metal coil structure forming a planar inductor. Each of the substrates and formed planar inductors arranged in parallel and oriented vertically and adjacent each other in a series configuration for increased inductance. The formed inductor and substrate disposed vertically with respect to a horizontal axis and is inclined at an angle with respect to a vertical axis, the angle ranging between less than 90 degrees and greater than 0 degrees. A first magnetic material plate is disposed adjacent the planar inductor at a first planar surface of the substrate, and a second magnetic material plate disposed adjacent a second planar surface having a conductive trace connecting one end of the planar inductor, each first and second plate extending to limit a spatial extent of the magnetic fields created by the inductor.

A selected reject band non-RF-coupling tile includes a ground plate disposed on a first side of a printed circuit board. The selected reject band non-RF-coupling tile also includes a planar inductor disposed on a second side of the printed circuit board. The selected reject band non-RF-coupling tile also includes a conductive via structure extending through the printed circuit board. The conductive via structure electrically connects to both the ground plate and the planar inductor at a location near an interior end of the planar inductor. The selected reject band non-RF-coupling tile is used to shield enclosure walls and / or other electrical circuitry from RF fields. The selected reject band non-RF-coupling tile is also used to encapsulate an RF carrying component to block RF fields that emanate from the RF carrying component.

The invention provides a strain and dielectric sensing compatible wide sensing range flexible LC resonant wireless sensor, and belongs to the technical field of flexible wireless sensing, the sensor comprises a flexible substrate, a flexible package and a liquid metal sensing circuit arranged between the flexible substrate and the flexible package, the liquid metal sensing circuit forms an LC resonant loop, and the LC resonant loop is connected with the flexible package. The LC resonant circuit comprises a planar inductor structure made of liquid metal and a planar interdigital capacitor structure made of liquid metal; the resonant frequency of the sensor changes in response to the tensile strain borne by the sensor, and changes in response to the change of the dielectric properties of an object to which the sensor is attached or a medium adjacent to the sensor. According to the invention, the defect that wireless strain sensing under large tensile strain is difficult to realize in the prior art is overcome, and flexible wireless sensing in a wide sensing range is realized.

The invention discloses a superconducting Josephson traveling wave parameter amplifier chip with distributed phase correction and a preparation method, and relates to the technical field of low-temperature microwave amplifier design and manufacturing, and the superconducting Josephson traveling wave parameter amplifier chip comprises an input / output port, an artificial transmission line formed by a superconducting Josephson series array, and an LC resonator unit array distributed along the artificial transmission line. The artificial transmission line is formed by connecting interdigital electrodes and superconductive Josephson junctions in series, wherein the interdigital electrodes are uniformly distributed along the line. The LC resonator unit is composed of a plate capacitor and a plane inductor, a lower electrode of the plate capacitor is divided into two parts, a polar plate of one part is a complete rectangular metal plate, and a polar plate of the other part is of an interdigital structure and is meshed with the interdigital structure of the superconducting Josephson series array artificial transmission line. Non-linear frequency mixing of input signals can be achieved through an artificial transmission line composed of a superconductive Josephson series array, distributed phase correction is provided for signal transmission along the line through interdigital coupling of an LC resonator array and the artificial transmission line, and gain improvement of the device is achieved.

The invention discloses a planar inductor for high frequency and large current in the technical field of planar inductors, which comprises a magnetic core assembly and a winding mechanism arranged in the magnetic core assembly, the winding mechanism comprises first copper sheet rings and second copper sheet rings which are alternately arranged, an insulating diaphragm is arranged between every two layers of copper sheet rings, and the diameter of each first copper sheet ring is larger than that of each second copper sheet ring. The copper sheet rings with large and small radiuses are arranged in a staggered and stacked manner, so that a plurality of flow channels can be formed between the copper sheet rings, and the fracture position of each layer of copper sheet ring is spirally distributed from bottom to top, so that each layer of independent flow channels can be communicated end to end through the fracture to form a spiral heat dissipation flow channel, and the heat dissipation efficiency is improved. The flow channel can effectively absorb heat of the copper sheet ring, rises based on expansion caused by heat and contraction caused by cold and flows back after cooling to form a self-circulation heat dissipation structure, the temperature of the planar inductor is effectively controlled, the problem that the saturation value of the magnetic core is reduced due to the influence of the temperature is effectively solved, and the high-frequency performance under large current is greatly improved.

The application discloses a highly integrated bulk acoustic resonator, filter and preparation method, and belongs to the technical field of filters.The bulk acoustic resonator comprises an active region and a non-active region surrounding the active region at least partially, and further comprises a substrate, a bottom electrode, a piezoelectric layer and a top electrode arranged in a longitudinal direction, and further comprises a planar inductor, a dielectric layer and a capacitor electrode, wherein the planar inductor is in the same layer as the top electrode, the dielectric layer is located on the side of the planar inductor and the top electrode away from the piezoelectric layer, and the capacitor electrode is arranged on one side of the dielectric layer and forms a capacitor structure with the top electrode, wherein the planar inductor and the capacitor structure are located in the non-active region and are located on the two sides of the active region respectively.The application integrates the inductor and the capacitor in the bulk acoustic resonator, which is conducive to the miniaturization of radio frequency devices.

The utility model relates to the technical field of planar inductors, and discloses a low-loss planar inductor which comprises a packaging shell, a magnetic core and a flat coil, a circular shell is installed in the packaging shell, and the magnetic core is arranged in the circular shell; side sealing plates are welded to the two ends of the circular shell. According to the low-loss planar inductor, the design that the flat coil is wound around the surface of the magnetic core is adopted, high-frequency loss can be reduced, the skin effect and the proximity effect are effectively restrained, copper loss and magnetic loss are reduced, low loss of the planar inductor is guaranteed, meanwhile, silicone rubber is encapsulated in the space formed by combining the limiting plates, and the overall performance of the planar inductor is improved. The first gasket, the filling block and the mounting groove are made of polyurethane materials, the vibration sense of the planar inductor can be reduced, the stability of the magnetic core structure is enhanced, mechanical damage of the planar inductor is reduced, the low-loss performance of the planar inductor is further improved, meanwhile, the second gasket is arranged between the inductor and the circuit board, and the risk that welding spots of pins crack due to vibration is reduced.