37 results about "Planar inductor" patented technology

The invention discloses a bypass inductor echelon current limiting topology and method for solid-state power distribution equipment, relates to the technical field of power electronic distribution, and is suitable for solid-state power controllers in the fields of aerospace, new energy automobiles and industrial automation. In order to solve the problems that when a large capacitive load is started, a current peak is likely to be generated to damage a device, and an existing current limiting scheme is low in efficiency or large in size, the topology comprises an input circuit, a main power circuit, an auxiliary circuit, a current limiting circuit, an absorption circuit and a load side circuit. According to the method, the auxiliary circuit switch tube is turned on in an echelon mode, and the main switch tube is turned on to complete starting after load voltage approaches power supply voltage and reaches a non-voltage-difference condition. According to the planar inductor integrated PCB, the size is reduced, the problem of long-term heating of a resistor is solved, the TVS overvoltage protection and RC anti-interference design are matched, the current peak is effectively restrained, the system efficiency and reliability are improved, and the high-power-density and differential-pressure-free starting requirements are met.

The invention provides an inductor structure and a preparation method thereof, and a chip packaging structure of an integrated inductor and a preparation method thereof, the inductor is formed in an empty slot in a plastic packaging layer, and a first inductor pattern structure, a vertical bonding wire and a second inductor pattern structure of a substrate are utilized to form a plane inductor or a three-dimensional inductor in the vertical direction. Compared with a traditional planar inductor in the horizontal direction, the inductor with the large inductance value can be formed under the relatively small area, the problem of welding failure of the surface-mounted inductor does not need to be considered compared with the surface-mounted inductor, the surface-mounted inductor is provided with the inductor shell, the overall size is large, however, the inductor does not need to be manufactured with the shell, and the manufacturing cost is reduced. And the area of the inductance region corresponding to the same inductance value is smaller than that of a surface-mounted inductor, so that the inductor is particularly suitable for application scenes with higher requirements on the performance of the inductor and limited sizes.

A semiconductor device having a front and a back and comprising a package substrate, an epoxy base layer applied to a back side of the package substrate, and a planar inductor in the epoxy base layer is etched to make a trench at the back of the semiconductor device in the epoxy base layer adjacent the planar inductor, and a thermal interface material is put in the trench, whereby a heat transfer antenna is formed. A semiconductor device has a package substrate having a front and a back; an epoxy base layer applied to a back side of the package substrate, a planar inductor at the back of the package substrate in the epoxy base layer, and a heat transfer antenna at the back of the package substrate in the epoxy base layer.

The application discloses an electronic tuning type multifunctional sensor and a preparation method thereof. The sensor comprises a quartz crystal, a composite electrode and an oscillation circuit; the first end of the composite electrode is connected with the first end of the oscillation circuit, the second end of the oscillation circuit is connected with the first end of the quartz crystal, the second end of the quartz crystal is connected with the second end of the composite electrode, and the second end of the oscillation circuit is an output end. The composite electrode comprises a substrate, a planar inductive microelectrode and a planar capacitive microelectrode which are arranged on two sides and are connected in series through a via hole; a nano-magnetic iron oxide film is deposited on the inductive side, a hydroxylated ultra-high specific surface area disordered porous carbon film is deposited on the capacitive side, and a perfluorosulfonic acid protective layer is coated on the surfaces of the two films. The application forms a frequency selection network by connecting the double-sided electrode and the quartz crystal in series, and outputs an anti-interference frequency signal; the protective layer is insulated and prevents short circuit on the inductive side, and improves the humidity response on the capacitive side; manual overturning can switch the detection of metal damage, non-metal defects and environmental humidity, and the sensor has the advantages of high stability and low cost.

This invention discloses a sensor for detecting ice, water, and dryness states, comprising a substrate, a first metal line, a second metal line, a third metal line disposed on the surface of the substrate, a variable capacitor, an interdigitated capacitor, and a planar inductor. One end of the variable capacitor is connected to one end of the planar inductor via the first metal line, and the other end of the planar inductor is connected to one end of the interdigitated capacitor via the second metal line. The other end of the interdigitated capacitor is connected to the other end of the variable capacitor via the third metal line. The capacitance value of the interdigitated capacitor changes with the different dielectric constants of the materials between the interdigitated fingers. Since the relative dielectric constants of ice, water, and dryness change at different frequencies, the capacitance value of the interdigitated capacitor also changes. Therefore, this sensor for detecting ice, water, and dryness states has advantages such as simple structure, high recognition rate, small size, and process compatibility.

The present application relates to the technical field of wireless passive sensing, and discloses a differential sensing system for metal crack detection and a quantitative detection method thereof, which comprises an RFID reader-writer and a passive RFID differential sensing tag; the passive RFID differential sensing tag comprises a communication antenna, an RFID chip, an impedance matching network, a planar inductive sensing module, a radio frequency switching module, an energy recovery module and a data processing unit; the impedance matching network is connected between the communication antenna and the RFID chip; the planar inductive sensing module comprises a reference planar inductor and a sensing planar inductor; after double-state alternate sampling of the reference sensing, difference is performed, so that environmental disturbances such as reading and writing distance, sensor posture, multipath and temperature drift are significantly suppressed, and differential noise suppression is realized; the switching module is powered by the energy collection antenna, voltage doubling rectification and charge management module in the energy collection management module, battery maintenance is avoided, and passive operation is realized.

The application discloses a low-loss planar inductor magnetic core and a design method thereof. The planar inductor magnetic core comprises an upper magnetic yoke and a lower magnetic yoke, a left column, a right column and a middle column. The upper magnetic yoke and the lower magnetic yoke, the left column, the right column and the middle column form a full-enclosed structure on the side surface, eliminating the traditional air gap structure. The upper magnetic yoke and the lower magnetic yoke are made of a first magnetic core material. The left column, the right column and the middle column are made of a second magnetic core material. The magnetic permeability of the first magnetic core material is lower than that of the second magnetic core material. The magnetic resistance of the planar inductor magnetic core is symmetrically distributed about a transverse symmetry axis. The magnetic core has a simple structure and is easy to implement, can significantly reduce the high-frequency copper loss of a high-frequency power magnetic component, and effectively solves the problem that the existing winding structure optimization method for MMF distribution optimization cannot be applied to the inductor.

The application provides a PCB air-core inductor, a design method thereof and a switching power supply, wherein the design method comprises the following steps: determining the winding turns, winding width and winding thickness of the PCB air-core inductor, and designing the number of winding layers in the PCB and the width and thickness of the winding metal in each winding layer according to the winding turns, winding width and winding thickness; sequentially connecting the winding metal in each winding layer in series to form a PCB winding, wherein the PCB winding is embedded in an insulating support body composed of insulating medium; forming a metal shielding body around the PCB winding, wherein the metal shielding body and the PCB winding are separated by insulating medium; and the metal shielding body comprises four circumferential shielding walls, one upper shielding wall and one lower shielding wall, and the beginning and end of the PCB winding are connected to the input terminal and the output terminal respectively and lead out through the corresponding circumferential shielding walls. The application solves the problems of poor magnetic shielding performance and large high-frequency loss of the PCB planar inductor in the prior art.

The utility model discloses a full-bridge converter module without a blocking capacitor. The full-bridge converter module comprises an input filtering unit, a first inversion bridge arm, a second inversion bridge arm, a planar transformer T, a first rectification bridge arm, a second rectification bridge arm, a planar inductor Lf, an output capacitor Co and a square wave detection unit M, the output capacitor Co is connected between the output positive end and the output negative end; a load Rload is connected between the output positive end and the output negative end; according to the full-bridge converter module, a planar magnetic technology is adopted, blocking capacitor configuration is avoided, positive and negative volt-second products are calculated through square wave voltage sampled by a resistance voltage division circuit and driving edge time captured by a comparator circuit, duty ratio control quantity is output, primary side full-bridge driving signal pulse width is dynamically adjusted, and magnetic flux balance control is achieved; the problem that the blocking capacitor occupies a large area is solved, and the high-power density design of the brick power supply module can be realized.

This disclosure provides a filter and its fabrication method, as well as an electronic device, belonging to the field of microwave technology, and can solve the problem of low Q value of inductors. The filter provided includes: a first substrate and a second substrate disposed opposite to each other, with a dielectric cavity disposed between the first substrate and the second substrate; the filter further includes: at least one inductor, the inductor including a first planar inductor structure disposed on a first surface of the first substrate, a second planar inductor structure disposed on a first surface of the second substrate, and a columnar inductor structure disposed within the dielectric cavity, the first end and the second end of the columnar inductor structure being electrically connected to the first planar inductor structure and the second planar inductor structure, respectively; and at least one capacitor disposed on the first surface of the first substrate, and the capacitor being electrically connected to the inductor.

The invention provides an integrated high-precision plane inductance type linear displacement sensor. The integrated high-precision plane inductance type linear displacement sensor comprises a shell, a cover plate, a movable ruler, a fixed ruler, a sliding block, a sliding plate, a push rod and a side face cover plate. The air gap distance between the movable ruler and the fixed ruler is always kept in a constant and consistent working state in the measurement process, so that the problem of precision deviation caused by air gap fluctuation of a traditional linear displacement sensor is solved, and the problem of poor mechanical environment adaptability is also solved; measurement error fluctuation caused by shaking of the movable ruler due to mechanical environment vibration and impact is effectively inhibited.

The invention discloses a highly-integrated bulk acoustic wave resonator, a filter and a preparation method, and belongs to the technical field of filters, the bulk acoustic wave resonator comprises an active region and a non-active region at least partially surrounding the active region, and the bulk acoustic wave resonator further comprises a substrate, a bottom electrode, a piezoelectric layer and a top electrode which are stacked in the longitudinal direction, the bulk acoustic wave resonator further comprises a planar inductor, a dielectric layer and a capacitor electrode, the planar inductor and the top electrode are in the same layer, the dielectric layer is located on the sides, away from the piezoelectric layer, of the planar inductor and the top electrode, the capacitor electrode is arranged on one side of the dielectric layer, and the capacitor electrode and the top electrode form a capacitor structure. And the planar inductor and the capacitor structure are positioned in the non-active region and are respectively positioned on two sides of the active region. According to the invention, the inductor and the capacitor are integrated in the bulk acoustic wave resonator, so that miniaturization of a radio frequency device is facilitated.

The invention provides a PCB air core inductor, a design method thereof and a switching power supply, and the design method comprises the steps: determining the winding turn number, the winding width and the winding thickness of the PCB air core inductor, and designing the number of winding layers in a PCB and the width and the thickness of winding metal in each winding layer according to the winding turn number, the winding width and the winding thickness; the winding metal in all the winding layers is sequentially connected in series to form a PCB winding, and the PCB winding is embedded in an insulating supporting body formed by insulating media; a metal shielding body is formed on the periphery of the PCB winding, and an insulating medium is arranged between the metal shielding body and the PCB winding; wherein the metal shielding body comprises four peripheral shielding walls, an upper shielding wall and a lower shielding wall, and the starting end and the tail end of the PCB winding penetrate through the corresponding peripheral shielding walls through the input terminal and the output terminal respectively and are led out. The PCB planar inductor solves the problems that in the prior art, a PCB planar inductor is poor in magnetic shielding performance, large in high-frequency loss and the like.

An integrated circuit (IC) package has a ferrite-dielectric shield layer between a planar inductor coil and a semiconductor chip. The shield layer blocks electromagnetic interference (EMI) generated by current in the inductor coil from reaching the semiconductor chip. The shield layer has a ferrite layer surrounded by upper and lower dielectric layers to prevent electrical shorting. A center terminal of the inductor coil is connected to the semiconductor chip through a center post that passes through an opening in the shield layer over the center of the inductor coil air core. The center post can be connected to a chip mount pad on which the semiconductor chip is mounted. Wire bonds connect pads on the semiconductor chip to lead frame pads on lead frame posts whose distal ends are external package connectors. The outer terminals of the inductor coil are connected to lead frame outer posts that also have external package connectors, such as pins or solder balls.

The invention relates to a battery pack comprising a housing, at least a first battery cell, in particular a pouch cell, arranged within the housing, the housing of the first battery cell comprising an electrically conductive material, and at least one expansion sensor. The at least one expansion sensor is arranged between the conductive material of the housing of the first battery cell and an abutment surface adjacent to the first battery cell, and comprises: at least one planar inductor circuit arranged on a flexible substrate, the at least one planar inductor circuit is arranged in a contact region between the first battery cell and the abutment surface adjacent to the first battery cell; at least a first compressible buffer layer disposed between the flexible substrate having the inductor circuit and the conductive material of the housing of the first battery cell; and a detection circuit coupled to the at least one planar inductor circuit by means of a respective connector line arranged on the flexible substrate for detecting a change in inductance of the at least one planar inductor circuit.

The application provides a heterogeneous integrated filter structure with transient voltage protection and a manufacturing method. The filter structure comprises an insulating substrate, a mounting groove is arranged on the upper surface of the insulating substrate, a semiconductor chip with transient voltage protection function is arranged in the mounting groove, a double-layer spiral inductor is arranged on the upper surface of the insulating substrate, the double-layer spiral inductor comprises a first planar inductor coil and a second planar inductor coil which are arranged in a stack mode, a first passivation layer is arranged between the semiconductor chip and the first planar inductor coil, a second passivation layer is arranged between the first planar inductor coil and the second planar inductor coil, a third passivation layer is arranged on the upper surface of the second planar inductor coil, the first passivation layer and the second passivation layer are both provided with through holes for electrically connecting the upper and lower layers, filter pins are arranged on the third passivation layer, and the filter pins are electrically connected with the second planar inductor coil. The application can improve the differential mode bandwidth index of the filter.

Techniques and mechanisms for providing structures of a magnetic material based inductor. In an embodiment, an inductor comprises a body of a magnetic material, and a conductor which extends along a surface of the body. The body comprises a carrier material and magnetic filler particles distributed in the carrier material. A passivation material of the inductor is provided adjacent to the conductor and to surfaces of the filler particles. The conductor and the passivation material comprise different respective material compositions, wherein the passivation material comprises one of nickel, tin, copper, palladium, or gold. In another embodiment, the inductor is one of a plated through hole inductor type of a planar inductor type.

The application discloses a novel magnetic integrated planar inductor and a manufacturing method thereof, and belongs to the field of inductor manufacturing. The inductor comprises a special EI or EE magnetic core with the cross-sectional area of the side column being larger than that of the middle column, and a PCB winding plate containing a first winding unit and a second winding unit; the two winding units are arranged around the two side columns of the magnetic core respectively, and form two independent inductors which are not connected in circuit and not interacted in space, so that two inductors are integrated by one set of magnetic core. During manufacturing, the independent double winding is formed by the PCB manufacturing process, the equal-depth air gaps are ground on the two side columns of the E piece of the magnetic core, and the magnetic sheet or the ceramic sheet is bonded to fix the I piece of the magnetic core, the lead-out end is welded by using the reflow soldering technology, and the integrated device is obtained through high-temperature curing. The application improves the utilization rate of the magnetic core, and compared with the traditional discrete inductor, the volume is reduced by more than 20%, the mass is reduced by more than 35%, the degree of automation of the process is high, the consistency is good, and the demand of miniaturization of the switching power supply is met.

The present invention relates to an impedance matching circuit (11), an impedance matching module (1) for a plasma process supply system (8) and a plasma process system (9), configured for a power of 500 W or more and a frequency in the range of 2 MHz to 100 MHz, for mounting on a cooling body (7), the impedance matching module comprising: a) a planar inductor (2); b) an insulating circuit board (3); c) a substrate (4), in particular a ceramic plate; d) the planar inductor (2) is divided into two planar conductor paths (2a, 2b) of equal length, connected in parallel and arranged on both sides and congruently on the insulating circuit board (3); e) the two conductor paths (2a, 2b) are two f) the substrate (4) is thicker than the insulating circuit board (3) and is fixedly connected to the surface of the insulating circuit board (3) over most of the lower surface (3b) of the insulating circuit board (3); g) the planar conductor paths (2a, 2b) can be spaced from the cooling body (7) by the substrate (4) to electrically insulate them from the cooling body (7); and h) the substrate (4) and the connection of the circuit board (3) to the substrate (4) are suitable for dissipating heat from the planar conductor paths to the cooling body (7).

The application provides a spiral planar inductance wafer temperature measuring device and a manufacturing method and application thereof, relates to the technical field of wafer temperature measurement, and comprises a silicon-based wafer substrate, an insulating layer on the surface of the wafer substrate, and a spiral planar inductance coil integrated on the insulating layer. A temperature sensing unit is electrically connected with the coil and comprises a high-frequency signal generator, an impedance analysis module and a temperature calculation unit. The inductance of the coil changes with the temperature of the substrate, the temperature calculation unit determines the inductance change by analyzing the impedance parameters, and calculates a real-time temperature value based on a preset temperature-inductance relationship. By optimizing the spiral structure and distributed arrangement of the coil, combining high-frequency detection and three-dimensional calibration algorithms, the application realizes high-precision, rapid, distributed and anti-interference online monitoring of the wafer surface temperature. The device has compact structure, good process compatibility, can be directly integrated into process equipment, and is suitable for temperature monitoring of key processes such as chemical vapor deposition and plasma etching.

A flat-plate inductor is provided for being disposed on an external mainboard. The external mainboard includes an input node and an output node. The flat-plate inductor includes a first core, a first circuit board, and a second circuit board. The first core includes a base, a first column, and a second column. The first column and the second column are disposed on two opposite sides of the base. The first circuit board includes a first coil and a first through hole. A plurality of layers of first traces of the first coil respectively surround the first through hole, and the first coil is sleeved on the first column, and the first column passes through the first through hole. The second circuit board includes a second coil and a second through hole. A plurality of layers of second traces of the second coil respectively surround the second through hole, and the second coil is sleeved on the second column, and the second column passes through the second through hole. The first coil and the second coil are connected in parallel or in series between the input node and the output node, and generate magnetic fluxes in the same direction.

The present application relates to the field of laser-activated selective metallization, and particularly relates to a laser-activated selective metallization composite and a permanent magnet synchronous brushless motor made of the composite. The present application provides a laser-activated selective metallization composite suitable for permanent magnet synchronous brushless motors, and utilizes the composite to prepare a permanent magnet synchronous brushless motor, including the following steps: preparing a laser-activated selective metallization composite, generating a spiral planar inductor coil and a conductive metal through hole on the surface and inside of the laser-activated selective metallization composite respectively through laser activation, electroless plating and electroplating, and assembling the permanent magnet synchronous brushless motor. The permanent magnet synchronous brushless motor of the present application is low in cost and convenient to manufacture, and can significantly reduce production cost. At the same time, the preparation process is highly automated, avoiding tedious manual labor. The prepared permanent magnet synchronous brushless motor is small in size, thin in thickness, low in weight, stable in rotation speed, and has a good application prospect.

A semiconductor device having a front and a back and comprising a package substrate, an epoxy base layer applied to a back side of the package substrate, and a planar inductor in the epoxy base layer is etched to make a trench at the back of the semiconductor device in the epoxy base layer adjacent the planar inductor, and a thermal interface material is put in the trench, whereby a heat transfer antenna is formed. A semiconductor device has a package substrate having a front and a back; an epoxy base layer applied to a back side of the package substrate, a planar inductor at the back of the package substrate in the epoxy base layer, and a heat transfer antenna at the back of the package substrate in the epoxy base layer.

This invention discloses a multifunctional wireless sensor based on the breakdown discharge effect. The multifunctional wireless sensor includes a horizontal anchor area, an upper structure, a lower structure, a bistable structural beam, a tip discharger, metal wires, a planar inductor, a temperature-sensitive capacitor, and a horizontal plane. Increased temperature causes the bistable structural beam to change from a bending shape along the negative X-axis to a bending shape along the positive X-axis. Based on the coupling effect of electrostatic induction and triboelectric charging, the polytetrafluoroethylene propylene film and the polymethyl methacrylate film separate, generating a high potential difference, which in turn breaks down the air around the tip discharger, generating an electromagnetic wave signal. The different lengths of the five bistable structural beams cause their bending transformations to occur at different temperatures. The inductor or capacitor in the circuit modulates the characteristic frequency of the electromagnetic wave signal; changes in inductance reflect identification, and changes in the temperature-sensitive capacitor reflect temperature changes, thus achieving multifunctional wireless sensing with temperature range, wide measurement range, and high accuracy for both temperature and identification. This sensor has advantages such as self-powered operation, long transmission distance, multifunctional sensing, and wireless transmission.

An apparatus including a plurality of vertically oriented insulating substrates, each substrate having a planar surface including a looped metal coil structure forming a planar inductor. Each of the substrates and formed planar inductors arranged in parallel and oriented vertically and adjacent each other in a series configuration for increased inductance. The formed inductor and substrate disposed vertically with respect to a horizontal axis and is inclined at an angle with respect to a vertical axis, the angle ranging between less than 90 degrees and greater than 0 degrees. A first magnetic material plate is disposed adjacent the planar inductor at a first planar surface of the substrate, and a second magnetic material plate disposed adjacent a second planar surface having a conductive trace connecting one end of the planar inductor, each first and second plate extending to limit a spatial extent of the magnetic fields created by the inductor.

The invention discloses a multifunctional wireless sensor based on a disruptive discharge effect. The multifunctional wireless sensor comprises a horizontal anchor area, an upper layer structure, a lower layer structure, a bistable structure beam, a point discharger, a metal wire, a planar inductor, a temperature-sensitive capacitor and a horizontal plane. The bistable structure beam is changed from a bending shape along the negative direction of the X axis to a bending shape along the positive direction of the X axis by temperature rise, and based on the coupling effect of electrostatic induction and triboelectrification, the fluorinated ethylene propylene film and the polymethyl methacrylate film are separated to generate a high potential difference, so that air around the point discharger is broken down to discharge to generate an electromagnetic wave signal. The lengths of the five bistable structure beams are different, so that the bending transformation temperatures of the five bistable structure beams are different, the inductance or capacitance in the circuit modulates the characteristic frequency of an electromagnetic wave signal, the inductance change reflects identity recognition, and the temperature-sensitive capacitance change reflects the temperature change, so that temperature-zone-divided, wide-range and high-precision temperature and identity recognition multifunctional wireless sensing is realized. The sensor has the advantages of self energy supply, long transmission distance, multifunctional sensing, wireless transmission and the like.

A selected reject band non-RF-coupling tile includes a ground plate disposed on a first side of a printed circuit board. The selected reject band non-RF-coupling tile also includes a planar inductor disposed on a second side of the printed circuit board. The selected reject band non-RF-coupling tile also includes a conductive via structure extending through the printed circuit board. The conductive via structure electrically connects to both the ground plate and the planar inductor at a location near an interior end of the planar inductor. The selected reject band non-RF-coupling tile is used to shield enclosure walls and / or other electrical circuitry from RF fields. The selected reject band non-RF-coupling tile is also used to encapsulate an RF carrying component to block RF fields that emanate from the RF carrying component.

The invention provides a strain and dielectric sensing compatible wide sensing range flexible LC resonant wireless sensor, and belongs to the technical field of flexible wireless sensing, the sensor comprises a flexible substrate, a flexible package and a liquid metal sensing circuit arranged between the flexible substrate and the flexible package, the liquid metal sensing circuit forms an LC resonant loop, and the LC resonant loop is connected with the flexible package. The LC resonant circuit comprises a planar inductor structure made of liquid metal and a planar interdigital capacitor structure made of liquid metal; the resonant frequency of the sensor changes in response to the tensile strain borne by the sensor, and changes in response to the change of the dielectric properties of an object to which the sensor is attached or a medium adjacent to the sensor. According to the invention, the defect that wireless strain sensing under large tensile strain is difficult to realize in the prior art is overcome, and flexible wireless sensing in a wide sensing range is realized.

The invention relates to a component (1) comprising a planar transformer (3) formed on a PCB (2) by the interleaving of a primary winding (33) and a secondary winding (34) in a winding window formed by a first magnetic core (31, 32). It also comprises a planar inductor (4) formed by the extension of at least one of the windings by two connection tracks (340) forming connection terminals (53, 54) and by the arrangement of a second magnetic core (41, 42) around a portion (44) of each of the two connection tracks. Preferably, the planar inductor (4) is formed at the terminals of the low-voltage winding. The connection tracks (340) are formed on the same PCB to obtain a one-piece planar component, or formed on a separate PCB to obtain a rigid-flex component, wherein the flexible portion consists of a portion (60) of the connection tracks (340).

A component (1) comprises a planar transformer (3) formed on a PCB (2) by interlacing a primary winding (33) and a secondary winding (34) in a winding window formed by a first magnetic core (31, 32). It also comprises a planar inductor (4) formed by extending at least one of the windings by two connection tracks (340) forming connection terminals (53, 54) and by arranging a second magnetic core (41, 42) around a portion (44) of each of the two connection tracks. Preferably, the planar inductor (4) is formed at the terminals of the low voltage winding. The connection tracks (340) are formed on the same PCB to obtain a single-piece planar component, or formed on a separate PCB to obtain a rigid-flex component where the flexible part is made up of a part (60) of the connection tracks (340). Figure for abstract: [Fig 5c]