Passive wireless pressure sensor preparation method based on flexible substrate

A pressure sensor, flexible substrate technology, applied in the direction of instruments, measuring force, measuring devices, etc., can solve the problems that the mechanical properties are inferior to the flexible substrate, limit the overall characteristics of the device, and it is difficult to obtain the quality factor, so as to achieve wiring interconnection and low loss. , high consistency effect

Inactive Publication Date: 2013-05-08
SOUTHEAST UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The inductance can be an on-chip inductance integrated with a capacitive sensor, but it is generally difficult to obtain a high quality factor Q for this inductance, thereby limiting the overall characteristics of the device; in addition, an externally wound metal wire inductance coil can also be used. But this will increase the size of the device, and it is difficult to process in batches
In addition, polysilicon is commonly used as a deformable plate at present, and its mechanical properties are not as good as flexible substrates, and the thickness of flexible substrates can be flexibly changed.

Method used

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  • Passive wireless pressure sensor preparation method based on flexible substrate
  • Passive wireless pressure sensor preparation method based on flexible substrate
  • Passive wireless pressure sensor preparation method based on flexible substrate

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Embodiment Construction

[0024] The technical solution of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0025] The preparation method of the passive wireless pressure sensor based on the flexible substrate of the present invention comprises the following steps:

[0026] Step 10) Prepare upper flexible substrate 2: as figure 1 As shown, a flexible substrate is selected, and then an upper metal layer 1 is electroplated on the upper surface of the flexible substrate, and an etching process is used to photolithographically form a capacitor upper plate 8 on the upper metal layer 1, and an internal connection Line 10 and the planar inductive coil 9 of external connection line 11. The inner connection wire 10 of the planar inductance coil 9 is connected to the upper plate 8 of the capacitor. Then drill holes in the flexible substrate to form upper through holes 14 . The upper through hole 14 and the end of the external connecting wire 11 of the p...

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Abstract

The invention discloses a passive wireless pressure sensor preparation method based on a flexible substrate. The preparation method comprises the following steps: 10) preparing an upper flexible substrate: electroplating an upper metal layer on the upper surface of the flexible substrate, forming a capacitance upper plate and a planar inductor coil on the upper metal layer in a photoetching mode, and drilling a hole to form an upper through hole, 20) preparing a middle flexible substrate: drilling holes in the flexible substrate to form a hollow cavity and a middle through hole, 30) preparing a lower flexible substrate: electroplating a lower metal layer on the lower surface of the flexible substrate, and drilling a hole to form a lower through hole, 40) manufacturing a capacitor: using a laminating technique to enable the upper flexible substrate, the middle flexible substrate and the lower flexible substrate to be connected fixedly to manufacture the capacitor of a pressure sensor and 50) manufacturing the pressure sensor: electroplating the upper through hole, the middle through hole and the lower through hole to form a guide line to manufacture the passive wireless pressure sensor. The passive wireless pressure sensor preparation method based on the flexible substrate can be used for the mass production of capacitive pressure sensors, and is simple in technology and high in consistency and reliability.

Description

technical field [0001] The invention relates to a method for preparing a pressure sensor, in particular to a method for preparing a passive wireless pressure sensor based on a flexible substrate. technical background [0002] Pressure sensors are widely used in many occasions. In some special applications, such as: inside the human body, food packaging and other sealed environments, pressure sensors are required to have wireless telemetry capabilities. There are currently two types of wireless telemetry pressure sensors: active telemetry and passive telemetry. Active telemetry means that the sensing system has a power source. This type of telemetry can transmit sensor signals in both directions over long distances, but the system is complex, large in size, and the battery needs to be replaced. Passive telemetry means that there is no power source in the sensing system, and signals are acquired by using inductive coupling or radio frequency (RF) reflection modulation. This t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01L1/14
Inventor 陈洁张聪王立峰黄庆安
Owner SOUTHEAST UNIV
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