Flexible-substrate-based passive wireless pressure sensor with self-packaging function
A pressure sensor, passive wireless technology, applied in the field of sensors, can solve the problems of limiting the overall characteristics of the device, difficult to obtain quality factor, increase in device size, etc., and achieve the effect of simple structure, low packaging cost, and protection of the internal structure
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Publication Date
- 2013-06-12
- Estimated Expiration
- Not applicable · inactive patent
Smart Images
Figure 1 Figure 2 Figure 3
Abstract
Description
technical field
[0001] The invention belongs to the technical field of sensors, and in particular relates to a passive wireless pressure sensor based on a flexible substrate and having a self-packaging function. Background technique
[0002] Pressure sensors are widely used in many occasions. In some special applications, such as: inside the human body, food packaging and other sealed environments, pressure sensors are required to have wireless telemetry capabilities. There are currently two types of wireless telemetry pressure sensors: active telemetry and passive telemetry. Active telemetry means that the sensing system has a power source. This type of telemetry can transmit sensor signals in both directions over long distances, but the system is complex, large in size, and the battery needs to be replaced. Passive telemetry means that there is no power source in the sensing system, and signals are acquired by using inductive coupling or radio frequency (RF) reflection mo...
Examples
Embodiment Construction
[0019] The technical solution of the present invention will be described in further detail below in conjunction with the accompanying drawings and embodiments.
[0020] Such as figure 1 with figure 2 As shown, a passive wireless pressure sensor with self-packaging function based on a flexible substrate of the present invention includes an upper flexible substrate 1, an upper metal layer 2, a middle flexible substrate 3, a lower Metal layer 4 and lower flexible substrate 5 . The upper flexible substrate 1, the middle flexible substrate 3 and the lower flexible substrate 5 are all made of flexible materials, such as polyimide (PI), liquid crystal polymer (LCP), or polyethylene terephthalate. Alcohol esters (PET). Electrical vias 14 and cavities 10 are provided on the middle flexible substrate 3 . Preferably, the cavity 10 is located in the middle of the middle flexible substrate 3 . The cavity 10 is located in the middle of the middle flexible substrate 3, which can reduc...