153results about How to "Short circuit" patented technology

A recessed light fixture includes a thermally protected light emitting diode (“LED”) module. The thermally protected LED module includes a thermal protector positioned in series between a source of electrical power and an LED driver and is configured to open a circuit to prevent power from being supplied by the power source to the LED driver for an LED package when a thermal rating or activation temperature of the thermal protector is exceeded. For example, the maximum operating temperature of the LED driver may be 90 degrees Celsius, and the thermal rating of the thermal protector may be 80 degrees Celsius, and when the temperature of the driver or a mounting bracket upon which the driver is mounted reaches 80 degrees Celsius, the thermal protector opens a circuit and removes current flow from the power source to the driver, thereby removing power to the LED package.

The invention is related to an electronic cigarette charging dock, an electronic cigarette case and a method for use thereof, the charging dock comprising a positive electrode elastic pin and a negative electrode elastic pin which are cylindrical and used for being connected to a positive electrode and a negative electrode of the battery to form a charging circuit. The elastic pins need only be arranged around the base of the charging dock, and the manner of assembly is simple; while the elastic pins are being used, the inelastic parts of the elastic pins do not deform elastically to affect a normal use. A plurality of elastic pins are arranged parallel to each other and retract only in the axial direction when in use, thus preventing short circuits.

Disclosed are a separator for lithium ion secondary batteries, having an inorganic layer formed from inorganic particles, characterized in that the inorganic particles have a particle diameter distribution in which the 50% cumulative particle diameter D₅₀ is in the range of 100 nm to 500 nm, the 10% cumulative particle diameter D₁₀ is 0.5D₅₀ or more, and the 90% cumulative particle diameter D₉₀ is 2D₅₀ or less; a method for manufacturing the separator; and a lithium ion secondary battery using the separator. When the separator is used, there can be produced a lithium ion secondary battery in which a short circuit caused by contraction or melting can be definitely prevented, as well as the current density applied to the electrodes during charging and discharging is uniform so that charging and discharging can be efficiently achieved.

An electronic cigarette comprises an atomization core comprising a connector, a heating wire assembly, an internal electrode, an elastic sleeve, an atomization cap, and a first electronic wire and second electronic wire; a receiving recess is arranged on the internal electrode; the first electronic wire is accommodated in the receiving recess and is electrically connected to the internal electrode; the elastic sleeve is retained on the inside wall of the atomization cap to hold the second electronic wire between the inside wall of the atomization cap and the outside wall of the flexible sleeve; the atomization cap is electrically connected to the other end of the battery assembly through the connector; one end of a vent pipe elastically abuts against one end of the elastic sleeve. The electronic cigarette has the advantages of easy replacement of the heating wire assembly, easy addition of smoke oil, and stable electrical connections.

A process for simultaneously coating and forming a body. The process includes moving two mold halves into contact with one another; introducing an injection-molding material into the mold halves so that a molding is formed; evacuating the molding; admitting a gas into the molding; igniting a plasma in the molding so that a coating is deposited on the inner side of the molding; and moving the mold halves apart so that the molding drops out.

A multi-chip stack package mainly comprises a substrate, a first chip, a redistribution structure and at least one second chip. The first chip is disposed on the substrate by an active surface facing upwards. The redistribution structure comprises a plurality of first intermediate pads, a plurality of second intermediate pads and a plurality of external pads. The first intermediate pads, the second intermediate pads, and the external pads are formed on the first active surface of the first chip, wherein the first intermediate pads and the second intermediate pads are electrically connected with each other. The second chip is disposed on the redistribution structure, and electrically connected to the first intermediate pads. The second intermediate pads are electrically connected to the substrate through a plurality of bonding wires, so that the second chip and the substrate are electrically conducted, and the connection length of the bonding wires is reduced.

Apply heat to thermoplastic resin film, which is eventually to become an insulating resin layer, and press the film against a mold for forming grooves on a surface of the film. Next, press-fit an electronic component into the resin film from a back-face of the film, thereby exposing electrodes of the component from a bottom of the grooves. Then cool the film for curing. Peel the film off the mold, then fill the grooves with conductive paste, and cure the paste for forming circuit patterns. The foregoing procedure allows bringing the electrodes positively into conduction with the circuit patterns of a circuit board incorporating the electronic component, and achieving a narrower pitch between routings of the circuit patterns.

The present invention relates to an organic semiconductor thin film suitably employed in electronics, photonics, bioelectronics, or the like, and a method for forming the same. The present invention further relates to a solution for an organic semiconductor used to form the organic semiconductor thin film and an organic semiconductor device using the organic semiconductor thin film.

The transistor of the present invention is manufactured by forming sequentially a gate electrode (2), an insulator layer (3), a source electrode and drain electrode (4, 4) on a glass substrate (5), applying thereto a 0.05% (by mass) solution of pentacene in o-dichlorobenzene and drying the solution to form an organic semiconductor thin film (1).

The present invention provides a transistor with superior electronic characteristics because the organic semiconductor thin film (1), which can be formed easily at low cost, is almost free of defects.

Method for varying the power consumption of capacitive loads, in particular compact fluorescent lamps which are operated using a phase-gating dimmer by a converter (step-up converter). According to the invention, in the case of a nonconducting dimmer (i.e. no system power supply to the load), the switch (T1) in the converter (step-up converter) is closed. In the case of a conducting dimmer (i.e. when a system voltage is applied to the load), the step-up converter operation takes place until a predetermined maximum voltage is reached across the smoothing capacitor of the load.

A main object is to provide a manufacturing method of an organic EL element having excellent light emission characteristics, and capable of facilitating the organic EL layer patterning operation and obtaining preferable wettability change. To attain the object, the present invention provides a manufacturing method of an organic EL element comprising: a charge injecting and transporting layer forming step of forming a charge injecting and transporting layer containing a material having a liquid repellent functional group so as to have the wettability change by the action of the photocatalyst accompanied by the energy irradiation on a substrate with an electrode layer formed; a wettability changed pattern forming step of forming a wettability changed pattern with the wettability of the charge injecting and transporting layer surface changed by the energy irradiation in pattern after disposing the photocatalyst processing layer substrate, in which the photocatalyst processing layer containing at least a photocatalyst is formed on a base member, with a gap capable of providing the action of the photocatalyst accompanied by the energy irradiation to the charge injecting and transporting layer; and an organic EL layer forming step of forming an organic EL layer, which includes at least a light emitting layer, on the wettability changed pattern.

A liquid crystal display (LCD) including: a display panel; a backlight unit to radiate light to the display panel; a mold frame surrounding the backlight unit and supporting the display panel; a housing to receive the display panel, backlight unit, and mold frame; and a resin unit provided between the display panel and the housing. A receiving groove is formed below the resin unit, by sloped surfaces of the mold frame and side walls of the housing.

A short circuit with an adjacent hole is prevented. By enlarging a hole diameter in the lower part of the hole, a stable storage node is formed without causing a decrease in capacitance. Provided is a method for production of a semiconductor device, comprising the steps of: forming the second hole in the second insulating film to a depth at which a bowing shape does not occur by carrying out anisotropic etching; forming the fourth film on the side surfaces of the first and the second holes; forming the second hole of an aspect ratio greater than 12 by extending the second hole until the first insulating film is exposed by carrying out anisotropic etching; and extending by isotropic etching a side surface portion of the second hole on which the fourth film is not formed.

The present invention provides a light-emitting element and a light-emitting device which have high contrast, and specifically, provides a light-emitting device whose contrast is enhanced, not by using a polarizing plate but using a conventional electrode material. Reflection of external light is suppressed by provision of a light-absorbing layer included between a non-light-transmitting electrode and a light-emitting layer. As the light-absorbing layer, a layer is used, which is obtained by adding a halogen atom into a layer including an organic compound and a metal oxide. Further, the light-absorbing layer is formed also over a region in which a thin film transistor for driving a light-emitting element is formed, a region in which a wiring is formed, and the like, and thus light is extracted from the side opposite to the region in which the TFT is formed, thereby reducing reflection of external light.

The present invention provides a color filter substrate for preventing an electrical short circuit between an electrode and other members at a place upper than the colored transparent layers disposed in a stack, and further preventing electrical disconnection on colored transparent layers other than the colored transparent layers in a stack, in the case where colored transparent layers are disposed in a stack and an electrode is stacked over the entire surface. The color filter substrate of the present invention comprises:

• • colored transparent layers disposed side by side; and
  • colored transparent layers disposed in a stack,
  • wherein an electrode is disposed at a place upper than the colored transparent layers disposed side by side and an electrode is disposed at a place upper than the colored transparent layers disposed in a stack,
  • the colored transparent layers disposed in a stack include a colored transparent layer having a reverse tapered shape, and
  • the uppermost layer of the colored transparent layers disposed in a stack has a forward tapered shape.

An electronic device includes an electronic part and a wiring substrate. The electronic part includes a rewiring substrate, a semiconductor chip, and solder bumps arranged in a matrix form. The wiring substrate includes a wire and lands arranged in a matrix form corresponding to the solder bumps. Each of the lands is coupled with corresponding one of the solder bumps so as to form connection portions. The connection portions include nonfunctional connection portions that do not provide an electric connection between the semiconductor chip and the wire. The lands forming the nonfunctional connection portions include a power source land and a ground land arranged next to each other in a row direction or a column direction. The lands that are arranged next to the lands forming the nonfunctional connection portions in the row direction or the column direction are set to signal lands.

An all-solid-state secondary battery includes a positive electrode active substance layer; a negative electrode active substance layer; and an inorganic solid electrolyte layer, in which at least one of the positive electrode active substance layer, the negative electrode active substance layer, or the inorganic solid electrolyte layer contains an inorganic solid electrolyte having conductivity of ions of metal belonging to Group 1 or 2 of the periodic table and a cellulose polymer.

A guide track (3A) includes a guide rail (31) having a guide groove (31a) opened upward in which the pair of guide wheels (23) inserted, and is formed with a pair of guide surfaces (31b) for causing each of the pair of guide wheels (23) to roll at both sides of the traveling course in a width direction; conductor rails (32) that are placed at both sides of the outside of the traveling course in the width direction with respect to the guide groove (31a) to perform contact electricity supply by pressing a power collection shoe (43) of a power collector (4) of the track-based vehicle; a first insulator (33) that is formed of an insulation material and supports the conductor rails (32) with respect to the guide rail; and insulation plates (34) serving as insulation materials that are provided at both sides of the conductor rail (32) in the width direction, and are provided in parallel to the conductor rail (32) and in parallel to a pressing direction of the power collection shoe (43) so as to prevent a short circuit due to contact with the conductor rail (32) in a vertical direction.