240results about How to "Decrease pitch" patented technology

The invention has an object to provide an insulation gate type semiconductor device and a method for producing the same in which high breakdown voltage and compactness are achieved. The semiconductor device has a gate trench and a P floating region formed in the cell area and has a terminal trench and a P floating region formed in the terminal area. In addition, a terminal trench of three terminal trenches has a structure similar to that of the gate trench, and the other terminal trenches have a structure in which an insulation substance such as oxide silicon is filled. Also, the P floating region 51 is an area formed by implanting impurities from the bottom surface of the gate trench, and the P floating region is an area formed by implanting impurities from the bottom surface of the terminal trench.

A connector includes contacts each having a contact portion, an elastic portion and a fulcrum portion between the contact portion and a connection portion, and a pressure receiving portion; a housing fixing the contacts; and a slider having urging portions pivotally moved between the connection and pressure receiving portions of the contacts to urging the contact portions against the circuit board, thereby achieving reliable connection and miniaturization of the connector. In an aspect, the housing is formed on the side of a board insertion opening with a recessed portion for conducting the board. In another aspect, the contact includes upper and lower contact portions one above the other arranged alternately staggered so as to be connected to a circuit board having contact portions alternately staggered, so that no defective connection occurs, even if the circuit board is inserted erroneously upside down. In a further aspect, the connector further includes locking members having an engaging portion which engages an anchoring portion of the circuit board to prevent the circuit board from being removed. In one aspect, contacts of two kinds are inserted into the housing from opposite sides, respectively so that these contacts of the two kinds are into contact with the contact portions on respective surfaces of the circuit board. In a further aspect, moreover, a plate-shaped piece is provided in opposition to the contact portions of the contacts to prevent the housing from being deformed.

An optical interconnection assembled circuit capable of reducing the number of parts and components, as well as the number of manufacturing processes and capable of mounting those parts and components at a high density in an optical module, thereby realizing a low price. The optical interconnection assembled circuit includes a substrate including plural optical waveguides having partial tapered surfaces respectively, as well as an optical element array facing each of the tapered surfaces. In the optical interconnection assembled circuit, the tapered surfaces and the optical element array are fastened so that they face each other and the optical elements of the optical element array are staggered in disposition.

A connector mounting structure on a circuit board is presented. A connector has a plurality of terminals comprising a first terminal separated with a predetermined pitch and a second terminal separated with a pitch larger than the predetermined pitch. The first and second terminals have respectively a first tail part facing toward the circuit board and a second tail part bent on the circuit board side after extended in the lateral direction of the connector housing. The first tail part is reflow-soldered to a land part formed on the surface of the circuit board, and the bent top end of the second tail part is inserted into a mounting hole penetrating the other land part formed on the circuit board and reflow-soldered. In this mounting structure of the connector, it is simultaneously possible to narrow a pitch between terminals and to increase the peeling strength.

The manufacturing apparatus of a semiconductor device includes a jig having a plurality of holders arranged in a row, a controller for controlling the pitch of the plurality of holders arranged in a row, a support means provided with a plurality of semiconductor integrated circuits, and a support means provided with a substrate having a plurality of elements. By mounting the semiconductor integrated circuits on the respective elements by using the jig having the plurality of holders arranged in a row, semiconductor devices are manufactured.

A semiconductor device is disclosed that includes a semiconductor element, a circuit board electrically connected to the semiconductor element, a heat dissipation member fixed to the first surface of the circuit board and thermally coupled to the semiconductor element, and an interposer provided to the second surface of the circuit board facing away from the heat dissipation member. The interposer is electrically connected to the circuit board. An opening is formed in the circuit board and the interposer so that the semiconductor element is thermally coupled directly to the heat dissipation member through the opening.

In a semiconductor device of the present invention, semiconductor chips are stacked in multi-layers. Each of the semiconductor chip includes: through vias extending through a top main surface thereof to a bottom surface opposite to the top main surface; a circuit element surface formed on the top main surface; pads arranged on the circuit element surface; bumps formed on the pads; and via pads, formed on the bottom surface thereof, to which the bumps of its upper semiconductor chip are joined, and positions at which the bumps of each of the semiconductor chips are respectively arranged are different from those at which the bumps of its upper semiconductor chip are arranged.

There is provided a tape recording system and head device. A tape recording system and head device include a plurality of recording sections for recording data signals on a recording medium wherein one recording section of the plurality of recording sections and another recording section arranged so as to adjoin the one recording section are disposed such that the one recording section and the another recording section are shifted from each other in a running direction and a width direction of the recording medium, and wherein the one recording section and another recording section simultaneously record a data signal on adjacent recording tracks on the recording medium.

Apply heat to thermoplastic resin film, which is eventually to become an insulating resin layer, and press the film against a mold for forming grooves on a surface of the film. Next, press-fit an electronic component into the resin film from a back-face of the film, thereby exposing electrodes of the component from a bottom of the grooves. Then cool the film for curing. Peel the film off the mold, then fill the grooves with conductive paste, and cure the paste for forming circuit patterns. The foregoing procedure allows bringing the electrodes positively into conduction with the circuit patterns of a circuit board incorporating the electronic component, and achieving a narrower pitch between routings of the circuit patterns.

A probe card including rectilinear probes; a guide base plate having an insulating property, in which a plurality of guide holes are formed through which the probes are inserted in a freely movable manner and a length of a guide hole is shorter than a length of a probe; and a plurality of sheet members having an insulating property, disposed above the guide base plate facing the plate, and laminated one on another with a spacing therebetween so as not to be in contact with one another. The tail ends of some of the probes can be brought into contact with the electrode pads on a lowest sheet member, and the tail ends of the other probes penetrate through the lowest sheet member so as to be enabled to be in contact with electrode pads on other sheet members.

An active suspension system suitable for use with a vehicle, includes a passive suspension element with a first end adapted for rigid engagement to a sprung mass of the vehicle and a second end adapted for rigid engagement to an unsprung mass of the vehicle. Also included is an active suspension element with a linear switched reluctance actuator which has a first end adapted for rigid engagement to the sprung mass of the vehicle and a second end adapted for rigid engagement to the unsprung mass of the vehicle.

A joint board is arranged between an upper package and a lower package. The arrangement of the joint board makes it possible to reduce the size of solder balls and to arrange them with narrower pitch. The joint board has slightly greater dimensions those of the upper package and the lower package. This makes it possible to prevent underfill from leaking and spreading.

Disclosed herein is an IC embedded substrate that includes a core substrate having an opening, an IC chip provided in the opening, a lower insulating layer, and upper insulating layer. The IC chip and the core substrate is sandwiched between the lower insulating layer and the upper insulating layer. The upper insulating layer is formed in such a way as to fill a gap between a side surface of the IC chip and an inner peripheral surface of the opening of the core substrate. A first distance from the upper surface of the IC chip to an upper surface of the upper insulating layer is shorter than a second distance from the upper surface of the core substrate to the upper surface of the upper insulating layer.

A conductive bump formed on an electrode of an electronic component. The conductive bump is composed of a first bump having one or more layers formed on the electrode and including resin containing at least a spherical-shaped conductive filler, and a second bump formed on an upper surface of the first bump and including photosensitive resin containing a scale-shaped conductive filler.

The invention relates to the technical field of fuel of pressurized water reactor nuclear power plants, and in particular discloses a spent fuel storage grillage. Compared with the conventional loosened grillage, the spent fuel storage grillage is a compact spent fuel storage grillage, and channels are formed on enclosing plates and baffles directly so as to form square storage cavities; neutron absorbing plates made of boron stainless steel plates are fixed in the square storage cavities, so that the grid distance of the storage grillage is reduced greatly, the number of fuel assemblies stored in a pond of unit area is increased obviously, and the economic benefit of the power plants is improved.

A multilayered structure array has narrow pitches by making thinner coatings for insulating internal electrode layers from side electrodes and the productivity of the multilayered structure array is improved. The multilayered structure includes: a first internal electrode layer; a piezoelectric layer formed on the first internal electrode layer; a second internal electrode layer formed on the piezoelectric layer; a first coating formed on an end surface of the first internal electrode layer in a first side surface region of the multilayered structure and containing one of metal oxide, metal nitride, metal fluoride and metal sulfide in at least one part thereof; and a second coating formed on an end surface of the second internal electrode layer in a second side surface region of the multilayered structure and containing one of metal oxide, metal nitride, metal fluoride and metal sulfide in at least one part thereof.

A self-installing offshore column stabilized semi-submersible platform has at least one vertical buoyant ballastable column, a telescoping keel tank or stiffened damper plate movably connected with the vertical column that extends and retracts relative to a lower end thereof, and a non-collapsible turbine tower or a tilt and telescoping tower coupled to an upper end of the vertical column that telescopes and reciprocates relative thereto between a horizontal retracted position and an axially extended vertical position. A wind turbine with blades is coupled to a top portion of the tower assembly. The relative position and weight of the keel tank or damper plate is selectively adjustable to raise or lower the center of gravity of the entire mass of the semi-submersible platform including the wind turbine and tower assembly with respect to the center of buoyancy of the platform.