Apparatus and method for manufacturing semiconductor device

Abstract

The manufacturing apparatus of a semiconductor device includes a jig having a plurality of holders arranged in a row, a controller for controlling the pitch of the plurality of holders arranged in a row, a support means provided with a plurality of semiconductor integrated circuits, and a support means provided with a substrate having a plurality of elements. By mounting the semiconductor integrated circuits on the respective elements by using the jig having the plurality of holders arranged in a row, semiconductor devices are manufactured.

Description

BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]The present invention relates to a manufacturing apparatus of a semiconductor device. In addition, the invention relates to a manufacturing method of a semiconductor device by which a semiconductor integrated circuit is electrically connected to a circuit (or an element) provided over a substrate (or a flexible substrate). In particular, the invention relates to a manufacturing method of a semiconductor device which performs data input / output by wireless communication via an antenna.[0003]2. Description of the Related Art[0004]A semiconductor device which includes an antenna and a semiconductor integrated circuit electrically connected to the antenna has been drawing attention as an RFID tag. An RFID tag is also called an IC tag, an ID tag, a transponder, an IC chip, or an ID chip. A manufacturing method of an RFID tag is proposed, which includes the steps of providing a plurality of antennas over a flexible substrate, ...

AI Technical Summary

Benefits of technology

[0006]In order to reduce cost, it is preferable to form a plurality of semiconductor integrated circuits over an element substrate with high integration density. Meanwhile, an antenna should be formed to have a predetermined shape and size in order to receive electromagnetic waves with a predetermined frequency. Therefore, the pitch of a plurality of semiconductor integrated circuits formed over an element substrate tends to be narrower than that of a plurality of antennas over a flexible substrate. In that case, it has been impossible to electrically connect the plurality of semiconductor integrated circuits formed over the element substrate to the plurality of antennas over the flexible substrate at the same time. Therefore, it has been necessary to repeat the operation of connecting each of the plurality of semiconductor integrated circuits formed over the element substrate to one of the plurality of antennas over the flexible substrate, one by one. Thus, a long tact time is required, which results in high manufacturing cost of the semiconductor device.

[0007]In view of the foregoing, it is an object of the invention to provide a manufacturing method of a low-cost semiconductor device, and a manufacturing apparatus capable of manufacturing a semiconductor device at low cost.

[0029]By the manufacturing method of a semiconductor device of the invention, a semiconductor device can be manufactured through the steps of picking up a plurality of semiconductor integrated circuits by a plurality of holders; controlling the pitch of the plurality of holders so that connection terminals of the semiconductor integrated circuits can be positioned opposite respective connection terminals of elements; and connecting the semiconductor integrated circuits to the respective elements. Therefore, even when the pitch of the connection terminals of the adjacent semiconductor integrated circuits is different from the pitch of the connection terminals of the adjacent elements, it is possible to attach the semiconductor integrated circuits to the respective elements only by controlling the pitch of the plurality of holders while picking up the semiconductor integrated circuits from an element substrate and positioning them to be opposite the respective elements. Furthermore, by picking up a plurality of semiconductor integrated circuits and attaching them to a plurality of elements through a sequence of steps, a plurality of semiconductor devices can be manufactured. Therefore, a tact time can be reduced and mass productivity can be improved. Thus, a manufacturing method of a low-cost semiconductor device can be provided.

[0030]A manufacturing apparatus of a semiconductor device of the invention includes a jig which has a plurality of holders arranged in a row, a controller for controlling the pitch of the plurality of holders arranged in a row, a support means provided with a plurality of semiconductor integrated circuits, and a support means provided with a flexible substrate having a plurality of elements. The jig includes a plurality of holders arranged in a row and a controller for controlling the pitch of the holders. Therefore, even when the pitch of the connection terminals of the adjacent semiconductor integrated circuits is different from the pitch of the connection terminals of the adjacent elements, the semiconductor integrated circuits can be attached to the elements only by controlling the pitch of the plurality of holders while picking up the semiconductor integrated circuits from an element substrate and positioning them to be opposite the respective elements. Furthermore, by picking up a plurality of semiconductor integrated circuits and attaching them to a plurality of elements through a sequence of steps, a plurality of semiconductor devices can be manufactured. Therefore, a tact time can be reduced and mass productivity can be improved. Thus, a manufacturing apparatus capable of manufacturing a semiconductor device at low cost can be provided.

Problems solved by technology

In that case, it has been impossible to electrically connect the plurality of semiconductor integrated circuits formed over the element substrate to the plurality of antennas over the flexible substrate at the same time.

Thus, a long tact time is required, which results in high manufacturing cost of the semiconductor device.

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