Apparatus and method for manufacturing semiconductor device

Inactive Publication Date: 2007-08-09
SEMICON ENERGY LAB CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0029]By the manufacturing method of a semiconductor device of the invention, a semiconductor device can be manufactured through the steps of picking up a plurality of semiconductor integrated circuits by a plurality of holders; controlling the pitch of the plurality of holders so that connection terminals of the semiconductor integrated circuits can be positioned opposite respective connection terminals of elements; and connecting the semiconductor integrated circuits to the respective elements. Therefore, even when the pitch of the connection terminals of the adjacent semiconductor integrated circuits is different from the pitch of the connection terminals of the adjacent elements, it is possible to attach the semiconductor integrated circuits to the respective elements only by controlling the pitch of the plurality of holders while picking up the semiconductor integrated circuits from an element substrate and positioning them to be opposite the respective elements. Furthermore, by picking up a plurality of semiconductor integrated circuits and attaching them to a plurality of elements through a sequence of steps, a plurality of semiconductor devices can be manufactured. Therefore, a tact time can be reduced and mass productivity can be improved. Thus, a manufacturing method of a low-cost semiconductor device can be provided.
[0030]A m

Problems solved by technology

In that case, it has been impossible to electrically connect the plurality of semiconductor integrated circuits formed over the element substrate to the plurality

Method used

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  • Apparatus and method for manufacturing semiconductor device
  • Apparatus and method for manufacturing semiconductor device
  • Apparatus and method for manufacturing semiconductor device

Examples

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Example

Embodiment 1

[0052]An apparatus and a method for manufacturing a semiconductor device in this embodiment mode will be described, with reference to FIGS. 1A to 1D, 16A and 16B, 17A and 17B, and 18.

[0053]A manufacturing apparatus of a semiconductor device in this embodiment mode includes, as shown in the example in FIG. 18, a plurality of holders 104 arranged in a row, which pick up semiconductor integrated circuits 102 from a support means 101, a jig 103 having the plurality of holders 104, a controller 100 for controlling the plurality of holders 104, and a support means 114 mounting a substrate 111 which has a plurality of elements. The semiconductor integrated circuits 102 which are picked up by the holders 104 arranged in a row are mounted on the respective elements formed over the substrate 111. Note that in the following embodiment modes, antennas 112 are illustrated as the elements, and a device in which a semiconductor integrated circuit is mounted on an antenna is illustrated...

Example

Embodiment 2

[0215]In this embodiment, the structure of a semiconductor device capable of wireless data transmission is described with reference to FIG. 14.

[0216]The semiconductor device in this embodiment includes an antenna portion 2001, a power supply portion 2002, and a logic portion 2003 as its main components.

[0217]The antenna portion 2001 includes an antenna 2011 which receives external signals and transmits data. The signal transmission method of the semiconductor device can be any of an electromagnetic coupling method, an electromagnetic induction method, and a microwave method.

[0218]The power supply portion 2002 includes a rectifier circuit 2021 which produces power from a signal received from outside through the antenna 2011, a storage capacitor 2022 which holds the produced power, and a constant voltage circuit 2023 which produces a constant voltage to be supplied to each circuit.

[0219]The logic circuit portion 2003 includes a demodulation circuit 2031 for demodulating re...

Example

Embodiment 3

[0222]A semiconductor device capable of wireless data transmission as illustrated in the above embodiments can be applied to various uses, such as bills, coins, securities, bearer securities, documents (e.g., driver's licenses or resident's cards, see FIG. 15A), packaging containers (e.g., wrapping paper or bottles, see FIG. 15C), storage media (e.g., DVD software or video tapes, see FIG. 15B), means of transportation (e.g., bicycles, see FIG. 15D), personal ornaments and accessories (e.g., shoes or glasses), foods, clothing, everyday articles, or tags on goods such as electronic devices or on bags (see FIGS. 15E and 15F). Note that electronic devices include a liquid crystal display device, an EL display device, a television set (also simply called as a TV set, a TV receiver, or a television receiver), a mobile phone, and the like. Furthermore, the semiconductor device can also be applied to plants, animals, human bodies, and the like.

[0223]The semiconductor devices 921...

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Abstract

The manufacturing apparatus of a semiconductor device includes a jig having a plurality of holders arranged in a row, a controller for controlling the pitch of the plurality of holders arranged in a row, a support means provided with a plurality of semiconductor integrated circuits, and a support means provided with a substrate having a plurality of elements. By mounting the semiconductor integrated circuits on the respective elements by using the jig having the plurality of holders arranged in a row, semiconductor devices are manufactured.

Description

BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]The present invention relates to a manufacturing apparatus of a semiconductor device. In addition, the invention relates to a manufacturing method of a semiconductor device by which a semiconductor integrated circuit is electrically connected to a circuit (or an element) provided over a substrate (or a flexible substrate). In particular, the invention relates to a manufacturing method of a semiconductor device which performs data input / output by wireless communication via an antenna.[0003]2. Description of the Related Art[0004]A semiconductor device which includes an antenna and a semiconductor integrated circuit electrically connected to the antenna has been drawing attention as an RFID tag. An RFID tag is also called an IC tag, an ID tag, a transponder, an IC chip, or an ID chip. A manufacturing method of an RFID tag is proposed, which includes the steps of providing a plurality of antennas over a flexible substrate, ...

Claims

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Application Information

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IPC IPC(8): G11C11/24
CPCH01L2924/14Y10T29/41H01L24/75H01L24/81H01L2224/16225H01L2924/01029H01L2924/10253H05K13/0478Y10T29/4913Y10T29/49169Y10T29/49018H01L2924/13091H01L2924/07811H01L2224/97H01L2224/81815H01L2224/81192H01L2924/00H01L2924/00014H01L2224/81H01L2924/15788H01L2224/05008H01L2224/05548H01L2224/05001H01L2224/05572H01L24/05H01L2224/05599
Inventor NAKAMURA, OSAMUITO, KYOSUKE
Owner SEMICON ENERGY LAB CO LTD
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