923 results about "Contact failure" patented technology

The present invention efficiently decides line failure and contact failure in a semiconductor device. The semiconductor device has a plurality of bit line groups in which connection with local I/O lines is controlled by the same column selection signal line. A failure detecting circuit compares a first data group read from a first bit line group and a second data group read from a second bit line group to detect whether or not connection failure (contact failure) with the column selection signal line occurs in one of the first and second bit line groups.

By wafer holder including a chuck top for mounting a wafer and a supporter supporting the chuck top and having flatness of at most 0.1 mm, a heater unit for a wafer prober and the wafer prober using the wafer holder, a wafer holder and a wafer prober apparatus hardly deformable even under high load and capable of effectively preventing contact failure, and capable of preventing temperature increase in a driving system when a semiconductor wafer having semiconductor chips with minute circuitry that requires high accuracy is heated can be provided. In the wafer holder of the present invention, the flatness of the supporter is preferably at most 0.05 mm, and more preferably at most 0.01 mm.

The invention discloses an on-line monitoring device of transformer winding state and a monitoring method thereof. The device is used for the on-line monitoring of transformer winding deformation and bad winding contact and comprises an information acquisition unit, a parameter identification unit, a parameter processing unit and a diagnosis monitoring strategy adjusting unit, wherein the information acquisition unit collects voltage and current information on the original side and the secondary side of the transformer in real time by a data channel; the parameter identification unit identifies the winding resistance and leakage inductance parameter of the winding state of a representation transformer by the real-time voltage and current information provided by the signal acquisition unit; the parameter identification unit calculates the deviation value of a parameter value obtained by analysis and identification and a parameter reference value and takes the deviation value as the characteristic quantity which is used for measuring the quality degree of the transformer winding state; the parameter processing unit and the identification unit ensure the real-time monitoring of the transformer winding state; the diagnosis monitoring strategy adjusting unit judges whether the winding has the defect of deformation or bad contact according to the deviation value of the parameter, and takes corresponding monitoring strategy adjusting scheme according to defect types and severity thereof; and the transformer directly stops operating when the defect is serious.

This invention provides a multilayer printed wiring board in which electric connectivity and functionality are obtained by improving reliability and particularly, reliability to the drop test can be improved. No corrosion resistant layer is formed on a solder pad 60B on which a component is to be mounted so as to obtain flexibility. Thus, if an impact is received from outside when a related product is dropped, the impact can be buffered so as to protect any mounted component from being removed. On the other hand, land 60A in which the corrosion resistant layer is formed is unlikely to occur contact failure even if a carbon pillar constituting an operation key makes repeated contacts.

A wafer holder hardly deformable under high load and capable of effectively preventing a contact failure with a wafer and further capable of preventing temperature increase of a driving system of a wafer prober is provided. In a wafer holder having a chuck top and a supporter, variation in thickness of the chuck top from a wafer-mounting surface to a contact surface with the supporter, and variation in thickness of the supporter from a bottom surface to a contact surface with the chuck top are both set to at most 50 μm. When the supporter is of a structure having a circular tube portion and a base portion separate from each other, variation in thickness of the circular tube portion from a contact surface with the chuck top to a contact surface with the base portion, and variation in thickness of the base portion from a bottom surface to a contact surface with the circular tube portion are preferably both set to at most 25 μm.

The on-vehicle electronic control device includes a main power supply circuit fed with power from an on-vehicle battery through an output contact of a power supply relay and a main power supply terminal of a connector to supply a stabilized control voltage to a microprocessor. When contact failure occurs in the main power supply terminal, the main power supply circuit is fed with bypass power from the output contact through a first electrical load and a commutation diode to perform the one of the report of the abnormality and the storage of the abnormality occurrence history information. A bypass power fed state is detected when an input voltage to the main power supply circuit is lower than a power supply voltage of the on-vehicle battery.

The invention discloses a metal oxide/MXene two-dimensional nanocomposite, its preparation method and application. The metal oxide/MXene two-dimensional nanocomposite includes a layered structure composed of uniformly distributed and tightly connected metal oxide nanosheets and MXene two-dimensional nanosheets. The preparation method includes: directly mixing the metal oxide and MXene two-dimensional nanosheet solution to obtain a mixed solution, vacuum filtering the mixed solution to obtain a metal oxide/MXene two-dimensional nanocomposite, and preparing a composite Electrode, the obtained composite electrode is used as a flexible electrode of a flexible capacitor to improve the shortcoming of poor contact between active materials, and the obtained flexible capacitor has excellent mechanical and electrical properties.

An electrically conductive metallic clip used for lead-out electrodes of an EC mirror has all-shaped section. One of an opposed side pieces of the clip is disposed at the side of an electrically conductive film and is formed in a planar shape. The other side piece disposed at the side of a glass substrate is configured in a curved shape and has a terminal that is outwardly round-opened. A central portion of the other side piece is formed in a convex shape so that an opening thereof is narrowed. When a sealing resin expands, an occurrence of poor contact between a lead-out electrode portion and the clip is prevented. Moreover, good workability for attaching the clip to the substrate is realized. Furthermore, the lead-out electrode is prevented from being damaged. Additionally, the clip is prevented from being deformed when the clip is fitted onto the substrate.

An electric connector using a probe-type contact(s) is provided to prevent it from having contact failure and is characterized in that it comprises a housing having at least one through hole, a probe-type contact(s) inserted into the through hole(s), and a terminal portion(s) connected to the probe-type contact(s). In the probe-type contact, a pin-shaped contact(s) is housed in a conductive tubular body in such manner that the contact is energized to move freely by a spring. The tip of the pin-shaped contact is tilted upward at a predetermined angle in a horizontal direction, and is installed into the through hole so as to protrude from the front wall surface of the housing.

Contact elements of sophisticated semiconductor devices may be formed by lithographical patterning, providing a spacer element for defining the final critical width in combination with increasing a width of the contact opening prior to depositing the spacer material. The width may be increased, for instance by ion sputtering, thereby resulting in superior process conditions during the deposition of a contact metal. As a result, the probability of generating contact failures for contact elements having critical dimensions of approximately 50 nm and less may be significantly reduced.

By providing a silicon cap layer on a compressive silicon nitride layer, the diffusion of nitrogen into sensitive resist material may be efficiently reduced, while the silicon may be converted into a highly compressive silicon dioxide in a later manufacturing stage. Consequently, yield loss due to contact failures during the formation of semiconductor devices requiring differently stressed silicon nitride layers may be reduced.

The present invention discloses a safety socket capable of automatic popup in a short circuit, which comprises a plug and a socket. The plug comprises a connector and two pins embedded at ends; the socket comprises a square shell embedded in a wall; two sets of clamping reeds are arranged on the inner wall of the rear end of the shell; and a jack is provided in the front end of the shell at a position corresponding to the middle of each group of clamping reeds. The advantage is as follows: once the problem raised by the background technology occurs, a large amount of heat is generated by the clamping reeds due to poor contact between the plug and the socket; the temperature thereof is increased; the heat is transferred by an insulated heat conducting rod into evaporation liquid in an evaporation chamber; the evaporation liquid is heated until the boiling point reaches and then is evaporated; the evaporated gas rises to the top of the evaporation chamber and is transmitted to a telescopic airbag through an air duct; the telescopic airbag is stretched as a whole and then a sealing plate is raised and lifts up the connector, so the pins are separated from the clamping reeds; and the circuit is disconnected to avoid the potential safety hazard caused by continuous short circuit and excessive heat.

The invention provides a network-type intelligent training examination system, which comprises a training station, a student machine and a central control desk connected through a network, and also comprises intelligent examination software, an intelligent fault setting module, a question answering module and a finished automobile wireless measurement and control module. Compared with the prior art, the network-type intelligent training examination system has the advantages that: three types of faults, namely open circuit, poor contact and short circuit are set at different simulation positions, so that simulated faults are close to actually occurred faults of an automobile and better teaching effect is achieved; the training equipment is remotely controlled by the central control desk so as to fulfill the aim of separating question setting from question answering; multiple kinds of dynamic data of running vehicles are detected, and the authenticity of studied contents is improved; and multiple persons study simultaneously and the teaching efficiency is improved.

The invention discloses a mower which comprises a casing, wheels, cutting blades, a cutting motor and a power supplying module. A charging slot dented towards the inside of the casing is arranged on the casing, the power supplying module is provided with a charging terminal used for transmitting energy or signals, the charging terminal is arranged in the charging slot instead of exposed outside the casing, therefore the terminal cannot be corroded due to wetting out by rain, poor contact of the charging terminal is avoided, and deformation of the charging terminal caused by collision is prevented. The invention further provides a butt-joint charging system.

The invention relates to a safe and reliable intelligent socket with good using effects. The safe and reliable intelligent socket with good using effects comprises a main body, and a processing mechanism and a dislocation mechanism are also included; the dislocation mechanism comprises a rotating shaft, a first gear, a first rack, a moving plate and two compression components; and the processing mechanism comprises a fastening component and a dust removal component. In the safe and reliable intelligent socket with good using effects, through the dislocation mechanism, because of the staggeredarrangement of the socket holes and the conductive contacts, the conductive contacts can not contact the children even if the children touch the socket with hands, and the conductive contacts can notcontact with the children, therefore, the children can be effectively prevented from electric shock, which is more safe and intimate; and through the processing mechanism, not only can the electricalplug be fastened, but also the dust and water stains on the plug can be removed, therefore, the poor contact caused by loose plug and conductive contact can be avoided, and the plug can be prevented from falling from the socket and affecting the use of electrical appliances; therefore, the use is more reliable, and the practicability and reliability of the intelligent socket is greatly improved.

The invention discloses an anti-loose socket. The anti-loose socket comprises a socket and a plug; the socket is a square box structure; the inside of the socket is provided with a cavity; the cavityis symmetrically opened with two jacks at a side wall near the plug; the cavity is fixedly connected with two sets of symmetric electric connecting devices at the side wall away from the jacks, and each electric connecting device includes two symmetric reeds; the cavity is fixedly connected with an electromagnetic coil at the side wall away from the jacks; each electric connecting device is fixedly connected with a permanent magnet; and the permanent magnets are connected to the reeds close to the electromagnetic coil. The invention uses the principle of inserting an iron core in the powered electromagnetic coil to generate a magnetic force to repel the magnet, so as to realize the function that the reeds clamp a conductive sheet, therefore, the clamping of the reeds is more powerful, andthe connection between the plug and the reeds is more stable; therefore, dangerous situations such as a short circuit and the like caused by the increase of resistance caused by the direct contact failure between the conductive sheets and the reeds is effectively prevented.

The invention discloses a method for detecting poor contact of battery voltage testing terminals, in particular to a technology for detecting the poor contact of voltage testing terminals, which is suitable for a rechargeable battery. Two ends of a voltage sampling circuit are connected with a test circuit capable of controlling on-off, and micro current is injected into the battery through a voltage test line of the battery; and then the voltage values of both ends of the anode and cathode of a voltage test line are respectively measured under the states of current switching on-off, no change of the voltage value shows good contact of voltage terminals, and the change of the voltage value shows that the voltage test terminals and the battery have contact resistance, i.e. the voltage test terminals have poor contact. The invention has good test effect, can easily detect the contact situation of the voltage test terminals, and can calculate the value of the contact resistance; and in addition, the method has small test current and short test time, and has no influence on the normal detection of the battery; and the test circuit for the method has simple principles and is easily realized.

A wiring structure in a semiconductor device may include a first insulation layer formed on a substrate, a first contact plug, a capping layer pattern, a second insulation layer and a second contact plug. The first insulation layer has a first opening that exposes a contact region of the substrate. The first contact plug is formed on the contact region to partially fill up the first opening. The capping layer pattern is formed on the first contact plug to fill up the first opening. The second insulation layer is formed on the capping layer pattern and the first insulation layer. The second insulation layer has a second opening passing through the capping layer pattern to expose the first contact plug. The second contact plug is formed on the first contact plug in the second opening. Since the wiring structure includes the capping layer pattern, the wiring structure may prevent a contact failure by preventing chemicals from permeating into the first contact plug.