The invention relates to a method of
processing the shape of a
polytetrafluoroethylene (PTFE)
printed circuit board. Two times of shape milling operation are adopted. The method comprises the following specific steps: a cover plate is additionally arranged on the PTFE
printed circuit board, a first shape mold is used for carrying out shape milling on the
printed circuit board additionally provided with the cover plate, replacement of a cover plate is carried out, and a second shape mold is used for carrying out shape milling. Compared with the prior art, a common
machine can be directly adopted for carrying out shape milling, a knife mold mode and an
etching mold mode do not need to be adopted for
punching, and therefore a large amount of production cost is saved; and due to the operation of cover plate addition, any deformation and other quality problems do not happen to the plate during the shape milling process, and the method can be applied to
mass production of the printed circuit boards.