62results about How to "Improved thermal connection" patented technology

A rectifier for rectifying alternating current into direct current is described, in which a three-phase generator includes a three-phase stator winding. The phases of the stator winding are triggered via switching elements of a power circuit. The power circuit is controlled via a control part, which includes a controller component. The rectifier includes a control part (control module) having control terminals and a power circuit (power module) controlled by the control module and optionally provided with a cooling device, in which all the power-conducting components are designed as power MOS components and integrated in a stacked construction.

A semiconductor assembly comprises a package, which in turn comprises at least one substrate, a first die stacked onto the substrate, at least one further die stacked onto the first die, at least one heat spreader in the package, and TSV:s extending through the stacked dies. The ends of the TSV:s are exposed at the further die.

A semiconductor chip assembly includes a semiconductor device, a heat spreader, a substrate and an adhesive. The semiconductor device is electrically connected to the substrate and thermally connected to the heat spreader. The heat spreader includes a post and a base. The post extends upwardly through an opening in the adhesive into an aperture in the substrate, and the base extends laterally and supports the substrate. The adhesive extends between the post and the substrate and between the base and the substrate. The substrate includes first and second conductive layers and a dielectric layer therebetween, and the assembly provides vertical signal routing between a pad at the first conductive layer and a terminal below the adhesive.

Bonding of substrates including metal-dielectric patterns on a surface with the metal raised above the dielectric is disclosed. One method includes providing a first substrate having a metal-dielectric pattern on a surface thereof; providing a second substrate having a metal-dielectric pattern on a surface thereof; performing a process resulting in the metal being raised above the dielectric; cleaning the metal; and bonding the first substrate to the second substrate. A related structure is also disclosed. The bonding of raised metal provides a strong bonding medium, and good electrical and thermal connections enabling creation of three dimensional integrated structures with enhanced functionality.

A laser light source for emitting coherent electromagnetic radiation has a vertical far-field radiation profile, having a series of semiconductor layers for generating the coherent electromagnetic radiation. An active region is located on a substrate. The coherent electromagnetic radiation is emitted during operation in an emission direction at least from a main emission region of a radiation output surface and the radiation output surface is formed by a side surface of the sequence of semiconductor layers. A filter element suppresses coherent electromagnetic radiation in the vertical far-field radiation profile. The radiation was generated during operation and emitted by an auxiliary emission region of the radiation output surface. The auxiliary emission region is vertically offset from and spatially separated from the main emission region.

A method of making a semiconductor chip assembly includes providing a post and a base, mounting a second adhesive on the base, mounting a substrate with a conductive pattern on the second adhesive, mounting a first adhesive on the substrate and mounting a conductive layer on the first adhesive, then flowing the first adhesive upward between the post and the conductive layer and flowing the second adhesive upward between the post and the substrate, solidifying the adhesives, then providing a conductive trace that includes a pad, a terminal, the conductive pattern, first and second vias and a selected portion of the conductive layer, mounting a semiconductor device on the post, wherein a heat spreader includes the post and the base, electrically connecting the semiconductor device to the conductive trace and thermally connecting the semiconductor device to the heat spreader.

An apparatus is presented in which a sample can be accurately repositioned in a spectroscopic and / or imaging apparatus upon multiple insertions, and where the apparatus can be worn by living subjects for extended periods of time. The apparatus additionally reduces the temperature increase and stabilizes the temperature of the sample upon irradiation with an optical source of excitation. Additionally, the apparatus stabilizes the pressure and critical optical properties of the sample and its interface with the apparatus. Alternatively or additionally, the apparatus can be used to alter and / or substantially reduce fluorescence from targeted fluorophores in the sample.

An LED light fixture includes a heat sink structure, at least one LED board in thermal engagement with the heat sink structure, the at least one LED board having at least one LED emitter thereon, and an on-board connector on the LED board for connecting electrical wiring to the LED emitter(s). At least one enclosing member forms with the heat sink an interior space enclosing a corresponding LED board, the rigid enclosing member defining a wiring aperture therethrough in alignment with the on-board connector. The LED light fixture also has an exterior wireway structure including a one-piece duct which has an end portion engaged with the wiring aperture and forms a channel for wires to the on-board connector. The wireway structure further includes a single-piece rigid cover secured with respect to the enclosing member and enclosing the duct.

The present invention provides a method of making a semiconductor chip assembly that includes providing a post and a base, mounting an adhesive on the base including inserting the post through an opening in the adhesive, mounting a substrate on the adhesive including inserting the post into an aperture in the substrate to form a gap in the aperture between the post and the substrate, then flowing the adhesive into and upward in the gap, solidifying the adhesive, then mounting a semiconductor device on a heat spreader that includes the post and the base, electrically connecting the semiconductor device to the substrate and thermally connecting the semiconductor device to the heat spreader. The substrate includes first and second conductive layers and a dielectric layer therebetween and provides horizontal signal routing between a pad and a terminal at the first conductive layer.

A method for manufacturing lithium-ion battery modules, including the following: positioning an elastic plastic device between at least two cells of a battery module; path-controlled compression of the at least two cells of the battery module and of the elastic plastic device situated between the at least two cells. Also described is a corresponding lithium-ion battery module.

The invention provides an LED (Light-emitting Diode) automobile light and a preparation method thereof. The automobile light comprises a metal heat pipe with a light source installation section and a heat conduction section, LED light sources arranged on the light source installation section, and a heat radiator comprising a metal radiator and a thermal conductive plastic isolator, wherein the metal radiator and the heat conduction section form thermal connection; and the thermal conductive plastic isolator covers the heat conduction section so as to separate the heat conduction section from outside air. The LED automobile light provided by the invention has the advantages of excellent heat radiation performance and long service life.

The invention relates to a rapid heat dissipation method based on a semiconductor refrigeration technology. A rapid heat dissipation device based on the semiconductor refrigeration technology includesa heat conduction element,a heat insulation mat and a heat dissipation outer wall; power chips and the heat dissipation outer wall are arranged oppositely,and the heat insulation mat is arranged between the power chips and the heat dissipation outer wall; the heat conduction element is arranged on the heat insulation mat,the heat absorption end of the heat conduction element fits the power chipsthrough a first heat conduction mat,and the heat dissipation end of the heat conduction element fits the heat dissipation outer wall through a second heat conduction mat; when the heat conduction element works,the heat absorption end transmits heat to the heat dissipation end in a single direction. By the adoption of the rapid heat dissipation method based on the semiconductor refrigeration technology,the heat dissipation speed can be controlled; when the power chips suddenly generate a large amount of heat,the heat can be effectively dissipated,the temperature of the power chips is lowered,the heat insulation met prevents the heat from returning to ensure running of equipment,and therefore the service life of the equipment is prolonged. When the equipment is a sealed space with poor heatdissipation capability,it can be ensured that the temperature of areas of the power chips is low. The rapid heat dissipation device based on the semiconductor refrigeration technology is more compactin structure and convenient to design and transform.

A portable device for generating electrical power comprises a vessel and a thermoelectric generator module. A gasket having an opening is included, along with a bottom plate that comprises a material having a higher a higher thermal conductivity than a material comprising the gasket. A thermal interface enhancer is adjacent one of the top side of the module and the bottom side of the module. A thermal interface inhibitor is also included. The bottom plate is secured to the bottom portion of the vessel with a fastener such that an area is formed between them. The gasket is secured to the bottom plate within the area, and the spacer is configured around the fastener. The thermal interface inhibitor is configured to aid in the maintenance of a temperature differential between the vessel and the bottom plate when the bottom plate is heated.

The present invention provides a device for conditioning semiconductor chips and a corresponding test method. The device comprises a chip temperature control means for receiving a semiconductor chip or a plurality of semiconductor chips and comprises a base body which can be flushed with a fluid for temperature control and which comprises a corresponding number of recesses which extend from a front face to a rear face of the base body; a corresponding number of chip bonding pedestals which are inserted, in thermal contact with the base body, into the recesses which comprise a chip receiving region on the front face and a wiring means on the inside which is constructed for supplying electrical signals from and / or to the semiconductor chip inserted in the respective chip receiving region; and a motherboard attached to the rear face in such a way that the wiring means of the chip bonding pedestals is electrically connected to a wiring means of the motherboard.

The invention concerns an assembly (10; 10a ; 10b) for an electric machine (1), comprising a rotor (12; 12a; 12b) which is rotatable in a rotational shaft (11) and magnet elements (15; 15a) which are disposed on the periphery of the rotor (12; 12a; 12b) and are connected thereto. According to the invention, the connection between the rotor (12; 12a; 12b) and the magnet elements (15; 15a) takes the form of a solder connection (25).

A stereo camera module, which includes a first image sensor and a second image sensor, a support having mounting surfaces aligned substantially in the same plane and for arrangement of the first and second image sensors on these mounting surfaces, a first lens housing arranged on the support and having an optical system for the first image sensor, a second lens housing arranged on the support and having an optical system for the second image sensor, and a printed circuit board arrangement for electrically contacting the first and the second image sensors through the support. The first and second image sensors are each in the form of an image sensor chip having wire bond connections and the printed circuit board arrangement has wire bond surfaces for contacting the wire bond connections of the first and second image sensor chips.

Bonding of substrates including metal-dielectric patterns on a surface with the metal raised above the dielectric is disclosed. One method includes providing a first substrate having a metal-dielectric pattern on a surface thereof; providing a second substrate having a metal-dielectric pattern on a surface thereof; performing a process resulting in the metal being raised above the dielectric; cleaning the metal; and bonding the first substrate to the second substrate. A related structure is also disclosed. The bonding of raised metal provides a strong bonding medium, and good electrical and thermal connections enabling creation of three dimensional integrated structures with enhanced functionality.

A laser light source for emitting coherent electromagnetic radiation has a vertical far-field radiation profile, having a series of semiconductor layers for generating the coherent electromagnetic radiation. An active region is located on a substrate. The coherent electromagnetic radiation is emitted during operation in an emission direction at least from a main emission region of a radiation output surface, and the radiation output surface is formed by a side surface of the sequence of semiconductor layers. A filter element suppresses coherent electromagnetic radiation in the vertical far-field radiation profile. The radiation was generated during operation and emitted by an auxiliary emission region of the radiation output surface. The auxiliary emission region is vertically offset from and spatially separated from the main emission region.

A temperature control device is provided for the temperature control of a battery. The temperature control device has an upper part with an upper side and an underside, which has on the upper side a thermal interface to the battery. Furthermore, the temperature control device has at least one lower part, which has an embossed structure in order to embody a sealing edge and to embody a cavity for guiding temperature control fluid. The sealing edge is arranged on an upper side of the lower part, and is connectable to the underside of the upper part in a fluid-tight manner.

An apparatus is presented in which a sample can be accurately repositioned in a spectroscopic and / or imaging apparatus upon multiple insertions, and where the apparatus can be worn by living subjects for extended periods of time. The apparatus additionally reduces the temperature increase and stabilizes the temperature of the sample upon irradiation with an optical source of excitation. Additionally, the apparatus stabilizes the pressure and critical optical properties of the sample and its interface with the apparatus. Alternatively or additionally, the apparatus can be used to alter and / or substantially reduce fluorescence from targeted fluorophores in the sample.

In a stator (150) for an electric motor comprising a stator core (153) which has at least one stator tooth (214) which is provided with a first winding section (257) of an associated stator winding (157), wherein insulating paper (230) is arranged at least in sections in the region between the first winding section (257) and the first stator tooth (214) to electrically insulate the stator core (153) from the stator winding (157), a thermally conducting intermediate layer is arranged at least in sections in the region between the insulating paper (230) and a winding layer of the first winding segment (257) facing the insulating paper (230) for a planar heat-conducting connection of the first winding section (257) to the first stator tooth (214).

A temperature control device is provided for the temperature control of a battery. The temperature control device has an upper part with an upper side and an underside, which has on the upper side a thermal interface to the battery. Furthermore, the temperature control device has at least one lower part, which has an embossed structure in order to embody a sealing edge and to embody a cavity for guiding temperature control fluid. The sealing edge is arranged on an upper side of the lower part, and is connectable to the underside of the upper part in a fluid-tight manner.

The invention relates to an electric machine, comprising a stator (2), a rotor (3), a split cage (4), which separates a wet region (5) from a dry region (6), control electronics (9) and an interconnection element (7, 8), which produces an electrical contact between the stator (2) and the control electronics (9), wherein the rotor (3) is arranged in the wet region (5), wherein the interconnection element (7, 8) is surrounded at least partially by an insulating element (10), and wherein the insulating element (10) divides the dry region (6) into a first subregion (60), in which the stator (2) is arranged, and a second subregion (61), in which the control electronics (9) are arranged.

The invention relates to an inductor (1) having a coil (2) and a core (3), wherein the core (3) is made of a Soft Magnetic Composite (SMC), the coil (2) is composed of a annularly wound electrical conductor, the coil (2) is substantially integrated into said core (3) so that the core (3) material acts as a thermal conductor having thermal conductivity above 1.5 W / m*K more preferably 2 W / m*K most preferably 3 W / m*K, conducting heat from said coil (2), wherein the inductor (1) is in thermal connection with at least one thermal connecting fixture (10-25), wherein said at least one thermal connecting fixture (10-25) is adapted to be connected to a first external heat receiver (4) so as to conduct heat from the inductor to said first external heat receiver (4).

A portable device for generating electrical power comprises a vessel and a thermoelectric generator module. A gasket having an opening is included, along with a bottom plate that comprises a material having a higher a higher thermal conductivity than a material comprising the gasket. A thermal interface enhancer is adjacent one of the top side of the module and the bottom side of the module. A thermal interface inhibitor is also included. The bottom plate is secured to the bottom portion of the vessel with a fastener such that an area is formed between them. The gasket is secured to the bottom plate within the area, and the spacer is configured around the fastener. The thermal interface inhibitor is configured to aid in the maintenance of a temperature differential between the vessel and the bottom plate when the bottom plate is heated.

A carrier device for an electrical component includes a carrier, which includes an electrically insulating layer, and an electrical contact layer on the electrically insulating layer The electrical contact layer includes at least one bridge-shaped contact region At least one recess in the electrically insulating layer is arranged at least on one side surface of the bridge-shaped contact region and / or the bridge-shaped contact region includes a bridge width reducing toward the insulating layer.

A power tool having a housing, a motor, especially an electric motor, a drive shaft that can be driven by the motor, a belt drive for transmitting the driving force of the motor to a tool, and a first fan that serves to generate a first air path in the housing as well as to cool at least the motor. The first fan and the belt drive can be driven by the drive shaft. The power tool has a second fan that serves to generate a second air path in the housing as well as to cool at least the belt drive.

A carrier device for an electrical component includes a carrier, which includes an electrically insulating layer, and an electrical contact layer on the electrically insulating layer The electrical contact layer includes at least one bridge-shaped contact region At least one recess in the electrically insulating layer is arranged at least on one side surface of the bridge-shaped contact region and / or the bridge-shaped contact region includes a bridge width reducing toward the insulating layer.