Rapid heat dissipation method and device based on semiconductor refrigeration technology

Abstract

The invention relates to a rapid heat dissipation method based on a semiconductor refrigeration technology. A rapid heat dissipation device based on the semiconductor refrigeration technology includesa heat conduction element,a heat insulation mat and a heat dissipation outer wall; power chips and the heat dissipation outer wall are arranged oppositely,and the heat insulation mat is arranged between the power chips and the heat dissipation outer wall; the heat conduction element is arranged on the heat insulation mat,the heat absorption end of the heat conduction element fits the power chipsthrough a first heat conduction mat,and the heat dissipation end of the heat conduction element fits the heat dissipation outer wall through a second heat conduction mat; when the heat conduction element works,the heat absorption end transmits heat to the heat dissipation end in a single direction. By the adoption of the rapid heat dissipation method based on the semiconductor refrigeration technology,the heat dissipation speed can be controlled; when the power chips suddenly generate a large amount of heat,the heat can be effectively dissipated,the temperature of the power chips is lowered,the heat insulation met prevents the heat from returning to ensure running of equipment,and therefore the service life of the equipment is prolonged. When the equipment is a sealed space with poor heatdissipation capability,it can be ensured that the temperature of areas of the power chips is low. The rapid heat dissipation device based on the semiconductor refrigeration technology is more compactin structure and convenient to design and transform.

Description

technical field [0001] The invention relates to the field of heat dissipation of electrical components, in particular to a rapid heat dissipation device based on semiconductor refrigeration technology. [0002] The invention also provides a rapid heat dissipation method based on semiconductor refrigeration technology. Background technique [0003] During the working process of the motor driver, especially in the case of fast start and heavy load, the motor driver needs to output a large current instantaneously or continuously, and its power chip and power chip and other devices will continue to generate a lot of heat, which must be dissipated in a timely and effective manner. If the heat accumulation will affect the stability of the motor driver and burn out the internal electronic components, the heat dissipation structure and method are one of the key technologies that affect the performance of the motor driver. The traditional heat dissipation measures for motor drivers ...

AI Technical Summary

Problems solved by technology

The cooling sheet has a feature that it can cool quickly in the first 3 minutes of starting up. If the cooling surface cannot dissipate the heat quickly, the cooling effect will be compromised

[0007] Since semiconductor cooling is forced cooling, the temperature at the heat-absorbing end may drop to a very low level, so water vapor and condensation will be generated at the heat-absorbing end, causing short circuit and corrosion of the circuit board.

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