The invention relates to the technical field of
chip manufacturing, a detection card is prepared based on a manufacturing method provided by the invention, the detection card comprises a probe, an elastic piece, a non-conductive probe guiding plate, a probe stabilizing plate and a top plate, the probe guiding plate is made of a transparent non-conductive material, so that the probe is conveniently aligned with an
electrode on a
chip, the probe stabilizing plate limits the probe, the probe is prevented from moving to scratch the
chip, and the detection efficiency is improved. The elastic piece compensates for the distance difference between the probe and the
electrode caused by the probe length error and the
electrode thickness error, and stable contact between the probe and the electrode is guaranteed. The prepared
probe card is applied to the chip manufacturing process, defective chips are detected, before the substrates are
cut, the large whole substrates are electrified for aging detection, the defective chips are sorted out and are correspondingly removed during
cutting, and the shipment defective product rate is reduced. A plurality of chips are simultaneously detected at one time, the
workload is reduced, the time is saved, compared with aging detection after packaging, the method is simple, the overall process period is greatly shortened, and the cost is reduced.