Epoxy resin fullerene composite material and preparation method thereof

A technology of epoxy resin and composite materials, applied in plastic/resin/wax insulators, organic insulators and other directions, can solve the problems affecting the preparation process of composite materials, reduce the insulation performance of epoxy resin, reduce the volume resistivity of the system, etc., to achieve improvement Mechanical and electrical insulation properties, inhibition of crack propagation, and effects of improving insulation aging properties

Active Publication Date: 2016-01-20
THE NAT CENT FOR NANOSCI & TECH NCNST OF CHINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Among them, micron particles can improve the mechanical and thermal stability properties of epoxy resin, but will reduce the insulating properties of epoxy resin
The introduction of inorganic oxide nanoparticles can improve the breakdown strength of epoxy resin and reduce the dielectric constant and loss. However, due to the large specific surface area of ​​nanoparticles, nanoparticles will cause a sharp increase in the viscosity of the system and affect the preparation of composite materials. process, and the impurity ions and hydroxyl groups contained on the surface of nanoparticles promote the conduction of carriers in the system and reduce the volume resistivity of the system

Method used

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  • Epoxy resin fullerene composite material and preparation method thereof
  • Epoxy resin fullerene composite material and preparation method thereof
  • Epoxy resin fullerene composite material and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0046] A kind of epoxy resin fullerene composite material, its raw material comprises fullerene, epoxy resin and curing agent; Described fullerene is C 60 , the epoxy resin is bisphenol A epoxy resin, and the curing agent is an anhydride curing agent HY905. In the epoxy resin fullerene composite material, the mass percentages of fullerene, epoxy resin and curing agent are respectively: 1ppm, 65.8%, and 34.2%.

[0047] In this embodiment, the bisphenol A epoxy resin is purchased from Huntsman Company, and the model is Araldite F; the anhydride curing agent HY905 is purchased from Huntsman Company.

[0048] This embodiment also provides a preparation method of the epoxy resin fullerene composite material, comprising the following steps:

[0049]First, 1 mg of C 60 Add 35mL of toluene for ultrasonic dispersion, the ultrasonic power is 200W, and the time is 30min, to obtain a uniformly dispersed mixed solution. Then take 10mL of the mixed solution and add it to 200g of epoxy re...

Embodiment 2

[0052] A kind of epoxy resin fullerene composite material, its raw material comprises fullerene, epoxy resin and curing agent; Described fullerene is C 60 PC 61 BM, the epoxy resin is novolac epoxy resin, and the curing agent is acid anhydride curing agent T31. In the epoxy resin fullerene composite material, the mass percentages of fullerene, epoxy resin and curing agent are respectively: 10ppm, 71.4%, and 28.6%.

[0053] In this example, the novolac epoxy resin was purchased from Wuxi Bluestar Resin Company, model number F44 (644); the anhydride curing agent T31 was purchased from Wuxi Bluestar Company.

[0054] This embodiment also provides a preparation method of the epoxy resin fullerene composite material, comprising the following steps:

[0055] First, 6.6 mg of PC 61 BM was added into 30mL of xylene for ultrasonic dispersion, the ultrasonic power was 200W, and the time was 30min to obtain a uniformly dispersed mixed solution. Then take 15mL of the mixed solution an...

Embodiment 3

[0058] A kind of epoxy resin fullerene composite material, its raw material comprises fullerene, epoxy resin and curing agent; Described fullerene is C 70 , the epoxy resin is a mixture of bisphenol A epoxy resin and aliphatic epoxy resin, and the curing agent is an anhydride curing agent ER314. In the epoxy resin fullerene composite material, the mass percentages of fullerene, epoxy resin and curing agent are respectively: 100ppm, 64.9%, and 35.1%.

[0059] In this embodiment, the epoxy resin (mixture of bisphenol A epoxy resin and aliphatic epoxy resin) was purchased from Dow Chemical Company of the United States, and the model was ER113; the anhydride curing agent ER314 was purchased from Dow Company of the United States.

[0060] This embodiment also provides a preparation method of the epoxy resin fullerene composite material, comprising the following steps:

[0061] First, 108 mg of C 70 Add 35mL of chloroform for ultrasonic dispersion, the ultrasonic power is 200W, an...

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Abstract

The invention relates to an epoxy resin fullerene composite material and a preparation method thereof. The materials of the epoxy resin fullerene composite material include fullerene, epoxy resin and a curing agent. The epoxy resin fullerene composite material has the advantages of remarkably increasing the volume resistivity and breakdown voltage of a polymer matrix, inhibiting the injection of space charges, decreasing dielectric constant and loss, and improving the electrical aging property of the epoxy resin, and moreover, the mechanical strength and toughness of the epoxy resin are also increased to a certain degree.

Description

technical field [0001] The invention relates to an epoxy resin fullerene composite material and a preparation method thereof, belonging to the field of insulating materials. Background technique [0002] Due to its excellent insulation and mechanical properties, epoxy resin is widely used as an electrical insulation material for isolating objects with different potentials, and simultaneously plays the dual role of force bearing and electrical insulation. Epoxy resin and its composite materials are widely used in electronic devices and power equipment, such as electronic packaging materials, transformers, transformers, etc. In recent years, the application of high-power power equipment and increasingly miniaturized microelectronic devices have put forward higher insulation requirements for epoxy resins: high resistivity and breakdown field strength, low dielectric constant and loss, excellent insulation aging resistance, Easy processing and good mechanical properties. [00...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08K3/04C08K3/36C08K3/22H01B3/40
Inventor 褚鹏飞张晖张忠高锋赵军
Owner THE NAT CENT FOR NANOSCI & TECH NCNST OF CHINA
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