The invention discloses an organosilicon electronic pouring sealant good in impact resistance and used for a PCB (printed circuit board). The organosilicon electronic pouring sealant is prepared by vinyl-terminated silicone oil-1, vinyl-terminated silicone oil-2, 12% platinum catalyst, acetenyl cyclohexanol, vinyl silicone resin, 1-allyloxy radicals-2,3-epoxy propane, 1,3,5,7-tetramethyl cyclotetrasiloxane, a silane coupling agent A171, an appropriate amount of hydrogen-containing silicone oil, alkali magnesium sulfate whiskers, (Heptadecafluoro-1,1,2,2-tetradecyl)trimethoxysilane, sodium dodecyl sulfate, ammonium persulfate, maleic anhydride, fluorine silicone resin emulsion, methyl ethyl ketone peroxide, an appropriate amount of deionized water and an appropriate amount of ethanol. The prepared organosilicon electronic pouring sealant is excellent in comprehensive performance, fast in curing, good in adhesion, high in flowability, simple in preparation process, low in production cost, wide in application range and worthy of popularization.