High temperature resistant organosilicone pouring sealant for PCB (Printed Circuit Board)

Abstract

The invention discloses a high temperature resistant organosilicone pouring sealant for a PCB (Printed Circuit Board). The high temperature resistant organosilicone pouring sealant for the PCB is prepared from the following raw materials in parts by weight: 40 to 50 parts of vinyl-terminated silicone oil-1, 50 to 60 parts of vinyl-terminated silicone oil-2, 0.38 to 0.5 part of 12 percent platinum catalyst, 0.02 to 0.04 part of ethynylcyclohexanol, 25 to 30 parts of vinyl silicone resin, 14.8 to 16.8 parts of 1-allyloxy-2,3-propylene oxide, 23 to 25 parts of 1,3,5,7-tetramethylcyclotetrasiloxane, 2.7 to 3.6 parts of silane coupling agent A171, a suitable amount of hydrogen-containing silicone oil, 3 to 3.8 parts of sepiolite fibres, 1.7 to 3 parts of aluminium nitride, 2 to 2.5 parts of sodium stearate, 1.5 to 2 parts of dodecylamine and a suitable amount of deionized water. The pouring sealant prepared by the preparation method is simple in preparation process, low in cost and wide in raw material source, has good performance in the aspects of radiating, high temperature resistance, stability, insulating and the like, is wide in application field, and is worth being popularized.

Description

technical field [0001] The invention relates to the technical field of potting glue for printed circuit boards, in particular to a silicone potting glue for high-temperature-resistant PCB circuit boards. Background technique [0002] With the rapid development of electronic science and technology, electronic components, devices, instruments and meters have been widely used in the electronic industry. Since the working environment of many electronic devices is complex and changeable, and sometimes even encounters extremely harsh natural conditions, in order to protect electronic components and integrated circuits from the working environment and improve the electrical performance and stability of electronic devices, it is necessary to The equipment is potted for protection. Potting is one of the important processes in the assembly of electronic devices. It is to fill the gaps of electronic devices with potting materials by mechanical or manual methods, and process them under...

AI Technical Summary

Problems solved by technology

However, the potting compound synthesized in this article can not meet the requirements of the potting compound on the market for PCB circuit boards, and its performance is not high in all aspects, so it must be further improved to expand the scope of use.