100results about How to "High tensile shear strength" patented technology

The invention discloses a hybrid welding method and hybrid welding equipment for laser electromagnetic pulse. The method can be used for laser seam welding and laser spot welding technology, a pulsed high magnetic field is applied to a welding region during the process of laser welding on a workpiece with the effect of laser beams so as to mutually react with an induced plasma, a welding pool and a stress strain field through welding and complete welding task. The equipment comprises a laser device, an electromagnetic pulse generator, a numerical control system, an optical transmission system and a laser electromagnetic pulse combined machining head. The combined machining head is used for integrating the laser beams with the pulsed high magnetic field and adjusting the distance between an electromagnetic conversion device and the workpiece; the combined machining head is arranged on a machine tool. The structural deformation can be reduced, the welding quality and machining efficiency are improved, and insurmountable technical problems when a metallic material structure is manufactured through existing single welding technology are solved.

Moisture curable adhesives of high tensile shear strength contain an alkoxysilyl-terminated polymer and an alkoxy-functional silicone resin.

The invention relates to high-temperature resistant copper foil glue containing the following components: 5-15wt percent of trifluoromethyl-contained maleimide resin, 10-30wt percent of polyfunctional ethoxyline resin, 10-40wt percent of bisphenol A epoxy resin, 5-15wt percent of ethylene-contained polyetherimide, 5-10wt percent of curing agent and 25-45wt percent of organic solvent; the preparation comprises the following steps of: adding the trifluoromethyl-contained maleimide resin and the ethylene-contained polyetherimide to the mixture of the polyfunctional ethoxyline resin and the bisphenol A epoxy resin, stirring while heating for reacting, and then cooling to 30-50 DEG C; adding the organic solvent and the curing agent; evenly stirring to obtain the high-temperature resistant copper foil glue the homogeneous phase of which is transparent and clear. The high-temperature resistant copper foil glue has Tonset temperature reaching up to 415 DEG C and excellent comprehensive performance, can be applied to the high-tech fields of electronics and microelectronics, automobiles, electrical machines, aerospace and the like; moreover, the invention has simple preparation process, low cost, convenient operation and available reaction raw materials, thereby being beneficial to realizing industrial production.

The invention discloses a novel acrylate structure adhesive and a preparation method thereof. The two-component acrylate structure adhesive comprises components A and B, wherein the volume ratio of the component A to the component B is (10-2):1; the component A comprises 55 to 75 parts of acrylate monomer, 0 to 25 parts of toughening agent, 10 to 35 parts of oligomer, 0.1 to 5 parts of reducing agent, 0.1 to 2 parts of stabilizer, and 0.1 to 10 parts of aids; and the component B comprises 15 to 50 parts of oxidant, 15 to 25 parts of toughening agent, 15 to 50 parts of plasticizer, and 0.1 to 10 parts of aids. Compared with the conventional acrylate adhesive (SGA), the novel acrylate structure adhesive prepared by the method has the advantages that under the condition of guaranteeing the same tensile shear strength, the elongation at break is over 30%, which is much higher than the 5% of elongation at break of common acrylate adhesives available in the market.

The invention relates to a polyimide-epoxy resin adhesive and a preparation method and an application thereof; the adhesive comprises the following components: maleimidopolyimide, polyfunctional epoxy resin, curing agent, promoter and organic solvent; the preparation method comprises the following steps: adding maleimidopolyimide powder and polyfunctional epoxy resin in a reaction rank to react for 1-2h, cooling, adding organic solvent, stirring the solution for dissolving, obtaining component A; mixing curing agent, promoter and organic solvent, stirring the solution for dissolving, obtaining component B; mixing the component A and component B, stirring evenly and obtaining the finished product. The adhesive has good adhesive property, the tensile shear strength is up to 30MPa; the preparation process is simple, the cost is low, the operation is simple, the reaction raw materials are accessible so that the method is applicable to industrialized production; and the adhesive can be used in high-tech fields such as electronics and microelectronics, flexible clad-copper laminates, flexible printed wiring boards, hard clad-copper laminates, automobiles, motors, aviation and aerospace and the like, and has broad application prospect.

Disclosed is a cold metal transition melting-brazing welding connection method for dissimilar magnesium metal and aluminum metal. Cold metal transition welding is adopted, argon is adopted as protecting gas, transition metal is a galvanized steel sheet, two types of welding wires are adopted, an aluminum-silicon welding wire is adopted on the aluminum side, and a magnalium zinc welding wire is adopted on the magnesium side. A welding gun is utilized to align to an aluminum edge and a magnesium edge, high-melting-point transition metal is clamped between magnesium and aluminum to stop mutual contact of liquid magnesium and liquid aluminum, so that melting-brazing welding connections between a magnesium melting welding joint and the transition metal (the galvanized steel sheet) as well as between an aluminum melting welding joint and the transition metal (the galvanized steel sheet) are realized, and connection of dissimilar metal between an aluminum alloy sheet and a magnesium alloy sheet is realized finally.

The invention discloses an ultraviolet light curing transfer printing glue composition for a transfer printing film. The ultraviolet light curing transfer printing glue composition comprises the following components in parts by weight: 20-40 parts of modified acrylate, 20-40 parts of epoxy resin, 10-30 parts of reactive diluent, 3-8 parts of photoinitiator, 5-15 parts of adhesion promoter, 2-5 parts of silane coupling agent and 0-1 part of auxiliary, and the modified acrylate is prepared by modifying pentapolymer prepared from methyl methacrylate (MMA), n-butyl acrylate ((i)n(/i)-BA), hydroxypropyl methacrylate (HMPA), acrylic acid (AA) and 2-ethylhexyl acrylate (EHA) through free radical copolymerization by using polyurethane containing isocyanato. The prepared ultraviolet light curing transfer printing glue has good adhesion to a glass base material, and is good in water resistance, high in tensile strength and excellent in transfer printing effect.

The invention relates to an epoxy modified polyurethane double-component grouting material for road engineering maintenance and a preparation method thereof, wherein the grouting material comprises a component A and a component B; the component A comprises following components in part by weight: 700-800 parts of polyether glycol, 100-300 parts of epoxy resin addition product, 20-40 parts of foaming agent, 40-80 parts of foam stabilizer and 10-40 parts of catalyst; and the component B is polyphenyl polymethylene polyisocyanate. The preparation method comprises the step of mixing and stirring the component A and the component B according to the mass ratio of (0.8-1.5): 1 uniformly. The grouting material has the advantages that: when the material participates in foaming reaction and is cured, the compression strength and bonding force of the formed liquid cement are improved, and the maximum tensile shear strength can reach 4.3Mpa, so that the grouting material is better than the grounding material mixed by polyurethane and epoxy resin; and the grouting material reduces builder body damage and has a certain economic benefit.

Multicomponent crosslinkable compositions based on organyloxysilane-terminated polymers free of toxicologically objectionable catalysts and isocyanates exhibiting good tensile shear strength are useful for adhesive bonding and sealing of substrates.

The invention relates to a polyimide-epoxy type electrical insulating paint and a preparation method thereof. The polyimide-epoxy type electrical insulating paint comprises the components: a maleimide polyimide resin solution, N, N, N', N', O-5-penta-glycidyl-4,4'-diamido-4''-hydroxyl triphenylmethane, N, N, N', N'-4-tetra-glycidyl-4,4'-diamido-diphenyl methane and 2-ethyl-4- methylimidazole which have the weight ratio of 100: (80-100): (80-100):(10-30). The preparation method comprises the steps of: evenly stirring and mixing all the components at the room temperature to obtain the paint. The polyimide-epoxy type electrical insulating paint is moderate in viscosity, good in using technological efficiency, excellent in adhesive property for metal base materials (such as iron, copper, aluminium alloy, glass and ceramics), simple in preparation technology and convenient in operation and reaction raw material source; and the preparation process can be completed in general equipment and is beneficial to realization of industrial production.

The invention relates to an epoxy-polyurethane blending grouting material used for road engineering maintenance, which is formed by blending a component A and a component B, wherein the component A comprises polyurethane white material and modified polyamine at a mass ratio of 100:1-20:1; the component B comprises phenyl methylene polyisocyanate and bisphenol-A epoxy resin at a mass ratio of 20:1-1:1 in the; and the use amount of the modified polyamine is 0.5%-10% the mass of the bisphenol-A epoxy resin. According to the invention, the epoxy-polyurethane blending grouting material can foam and expand and has excellent bonding performance, so that the using durability of a road is expected to be improved. Compared with a waterborne epoxy resin grouting material, the epoxy-polyurethane blending grouting material has foam expansion performance, can extrude a flabby substrate densely and has a better strengthening effect; and the using amount of the grouting material is saved, and the cost is greatly reduced.

Adhesives having high tensile strength are prepared from moisture-curable alkoxysilyl-terminated polyurethanes.

The invention belongs to the field of resin adhesion, and in particular relates to a tackiness agent for an automobile tank. The tackiness agent is characterized by comprising components A and B, wherein the proportion of the components A and B is 1:1; the component A comprises the following compositions by weight percent: 2-5% of MAA (methyl acrylic acid), 35-45% of MMA (methyl methacrylate), 10-15% of hydroxyethyl methacrylate, 5-10% of ethylene glycol dimethacrylate, 15-22% of toughening resin, 0-30% of elastomer and 2-5% of initiator; and the component B comprises the following compositions by weight percent: 2-5% of MAA, 15-20% of hydroxyethyl methacrylate, 6-10% of organosilicon polymer, 35-45% of MMA, 15-22% of toughening resin, 0-30% of elastomer and 0.8-1.5% of accelerator. The tackiness agent provided by the invention has good mechanical property, storage stability, weather resistance, water tolerance and the like, can be quickly solidified at room temperature, has good fuel oil soaking resisting property, and is especially suitable for manufacturing of automobile tanks and products with similar applications.

The invention discloses an epoxy-graphenemetal bonding agent and a preparation method thereof and relates to the technical field of polymer based nanocomposites. The method comprises specific steps as follows: graphene and a silane coupling agent are dispersed in polyether amine with mechanical stirring and ultrasonic dispersing methods, then a mixture is added to an epoxy resin matrix to be stirred and mixed ultrasonically, and the epoxy-graphenemetal bonding agentis obtained finally. Compared with a pure epoxy resinmetal bonding agent, the epoxy-graphenemetal bonding agentprepared with the method has better performance, a tensile shear strengthperformance test indicates that bonding performance of the epoxy-graphenemetal bonding agent to an aluminum plate base material reaches 15.4 MPa, the bonding performance of the epoxy-graphenemetal bonding agent to a steel plate base material reaches 15.0 MPa, the bonding performance of the epoxy-graphenemetal bonding agent to a copper plate base material reaches 26.3 MPa, and the bonding performance of epoxy resin to a metal base material can be effectively improved.

The invention discloses an acrylate adhesive which is a two-component adhesive and comprises a reducing agent and an oxidizing agent, wherein the reducing agent comprises the following components in%age by weight: 30-70% of an acrylate monomer containing at least one vinyl group, 1-10% of methacrylic acid, 5-15% of an elastomer, 0-0.1% of a stabilizer, 5-20% of toughening resin, 0.1-2% of an accelerator, 0.1 to 2% of an activating accelerator, 0 to 10% of a filler, 0.5 to 3% of an adhesion promoter, 1 to 5% of tackifying resin, 0 to 2% of a surface drying promoter, 0.5 to 1.5% of a coupling agent and 0 to 2% of a thixotropic agent. The oxidizing agent comprises the following components in%age by weight: 20-40% of epoxy resin, 15-25% of a plasticizer, 10-15% of polyether polyol, 20-40% of a peroxide, 4%-6% of a thixotropic agent and 0.1%-0.3% of ferric ferrocyanide. The volume ratio of the reduce agent to the oxidizing agent is 10: 1. The acrylate adhesive has weak corrosion to copper, good bonding effect and good storage stability..

The invention relates to a macromolecular heat conducting composite material, in particular to a heat conducting adhesive and a preparation method and application thereof. The heat conducting adhesive is made of, by weight, 60-100 parts of softener, 20-60 parts of rubber flexibilizer, 50-150 parts of heat conducting filler, 2-10 parts of tackifier, 0.2-5 parts of antioxidant and 0.2-5 parts of antiager. The preparation method includes the steps: rolling the rubber flexibilizer, sequentially adding the softener, the heat conducting adhesive, the tackifier, the antioxidant and the antiager, and mixing for 1-2h at the temperature of 80-150 DEG C to obtain the heat conducting adhesive. The heat conducting adhesive has the advantages of freeness of curing, convenience in processing, excellent adhesion performance, high heat conductivity and the like. Close adhesion of devices can be realized only by application of a proper pressure at the normal temperature, and the heat conducting adhesive is cheap and environment friendly.

Disclosed is a flux-cored wire (1) for use in the laser welding or MIG welding of different materials that are aluminum or an aluminum alloy material (2) and a galvanized steel material (3). The flux-cored wire (1) comprises a cylindrical sheath constituted of an aluminum alloy containing 0.8-1.9 mass% Si, with the remainder being aluminum and incidental impurities, and a flux filled in the space within the sheath and containing 20-60 mass% cesium fluoride. The incidental impurities in the sheath include Mn, Mg, or Fe, and the contents of these impurities are at most 0.1 mass% each with respect to the total mass of the sheath. The percentage filling of the flux is 5-20 mass% with respect to the total mass of the wire.

The invention provides an epoxy resin adhesive. The epoxy resin adhesive is prepared from the following components in parts by weight: 1-15 parts of an amine curing agent, 30-60 parts of mercaptan, and 35-55 parts of epoxy resin; and the mercaptan has a structure shown in a formula (I) or a formula (II) (please see the specification for the formula (I) or the formula (II)), wherein R1 is trivalenthydrocarbyl of C1 to C6, and R2 is selected from a formula (please see the specification for the formula), and n is an integer from 1 to 5. Compared with the prior art, according to the epoxy resin adhesive, the components of the specific content are adopted, and good interaction is achieved, so that the epoxy resin adhesive has good room-temperature rapid curing performance, and is high in tensile and shear strength and good in oil and water resistance. Experimental results show that the gelation time of the epoxy resin adhesive at the room temperature is 6-13 min, the curing time is 10-19 min, the tensile and shear strength is 9.7-15.4 MPa, and the tensile and shear strength after oil soaking for half a year is 7.6-13.7 MPa.

The invention relates to a nano-modified salute bomb location glue and method for preparing same. The glue uses SBS elastomer as the major material, addes with adhesion resin and nano-materials to reinforce the surface adhesive force and adhesion strength between the location glue and ignition pipe and the ball shells.

The invention discloses an organic silicon electronic pouring sealant for a flame retardant heat conduction PCB (printed circuit board). The organic silicon electronic pouring sealant is prepared from the following raw materials in parts by weight: 40 to 50 parts of vinyl-terminated silicone oil-1, 50 to 60 parts of vinyl-terminated silicone oil-2, 0.38 to 0.5 part of 12-percent platinum catalysts, 0.02 to 0.04 part of ethynyl cyclohexanol, 25 to 30 parts of vinyl silicone resin, 14.8 to 16.8 parts of 1-allyloxy-2,3-epoxy propane, 23 to 25 parts of 1,3,5,7-tetramethyl cyclotetrasiloxane, 2.7 to 3.6 parts of silane coupling agents A171, a proper amount of hydrogen-containing silicone oil, 4 to 5 parts of quartz powder, 2 to 3 parts of aluminum hydroxide, 0.3 to 0.5 part of titanate coupling agents TC114 and 0.3 to 0.4 part of silane coupling agents KH560. The prepared pouring sealant has the advantages that the curing time is short; the viscosity is stable; the intensity is high; the anti-corrosion performance and the flame retardant performance are good; the production process is stable; the operability is high; the pouring sealant is suitable for large-scale production.