Heat conducting adhesive and preparation method and application thereof

A technology of thermally conductive adhesives and thermally conductive fillers, applied in the direction of adhesive types, natural rubber adhesives, polymer adhesive additives, etc. and other problems, to achieve the effects of excellent processing performance and thermal conductivity, cost reduction, and high adhesion
CN104817985AActive Publication Date: 2015-08-05国科广化(南雄)新材料研究院有限公司 +1
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
国科广化(南雄)新材料研究院有限公司
Publication Date
2015-08-05

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Abstract

The invention relates to a macromolecular heat conducting composite material, in particular to a heat conducting adhesive and a preparation method and application thereof. The heat conducting adhesive is made of, by weight, 60-100 parts of softener, 20-60 parts of rubber flexibilizer, 50-150 parts of heat conducting filler, 2-10 parts of tackifier, 0.2-5 parts of antioxidant and 0.2-5 parts of antiager. The preparation method includes the steps: rolling the rubber flexibilizer, sequentially adding the softener, the heat conducting adhesive, the tackifier, the antioxidant and the antiager, and mixing for 1-2h at the temperature of 80-150 DEG C to obtain the heat conducting adhesive. The heat conducting adhesive has the advantages of freeness of curing, convenience in processing, excellent adhesion performance, high heat conductivity and the like. Close adhesion of devices can be realized only by application of a proper pressure at the normal temperature, and the heat conducting adhesive is cheap and environment friendly.
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Description

Technical field

[0001] The invention relates to a polymer thermally conductive composite material, in particular to a thermally conductive adhesive and a preparation method and application thereof. Background technique

[0002] With the increasing popularity of electronics and electrical appliances, people have higher and higher requirements for their performance and lifespan. The biggest impact on the performance and life of electronic appliances is the heat dissipation of electronic and electrical components. The current research direction is mainly to use thermal conductive adhesive technology to solve it. As a thermal conductive adhesive for bonding and packaging materials for electronic appliances, it has played an inestimable role in heat dissipation. It can make the heat sink and the surface of the heat source come into close contact, quickly dissipate the heat, and greatly improve the gap between the component and the heat sink. The heat transfer efficiency. The current...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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