Heat conducting adhesive and preparation method and application thereof

A technology of thermally conductive adhesives and thermally conductive fillers, applied in the direction of adhesive types, natural rubber adhesives, polymer adhesive additives, etc. and other problems, to achieve the effects of excellent processing performance and thermal conductivity, cost reduction, and high adhesion

Active Publication Date: 2015-08-05
国科广化(南雄)新材料研究院有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the above two adhesives cannot conduct heat, so they cannot be used in the field of heat dissipation of electronic appliances, and the application range is limited.
[0006] Although acrylic and silicone thermally conductive adhesives have good adhesion, aging resistance, acid and alkali resistance, etc., they are expensive, and are more suitable for microelectronics and some high-end product devices with a small amount.

Method used

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  • Heat conducting adhesive and preparation method and application thereof
  • Heat conducting adhesive and preparation method and application thereof
  • Heat conducting adhesive and preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0041] The thermally conductive adhesive contains the following components in parts by weight:

[0042]

[0043]

[0044] (1) After compounding graphite and carbon black, dry it at 150℃ for 2h to remove water and volatile solvent impurities to obtain a graphite / carbon black compound thermally conductive filler; then graphite / carbon black compound thermally conductive filler and oxidation Aluminium and ceramic powder are compounded to obtain a mixed thermal conductive filler containing graphite and carbon black;

[0045] (2) Roll the natural rubber on an open mill with a roller spacing of 3mm and a roll time of 10min; add part of the mixed thermally conductive filler prepared in step (1) to the polyisobutylene, stir evenly, and then apply to the open mill Above the gap between the two rollers of the machine, and keep an appropriate amount of accumulated glue;

[0046] (3) Coat antioxidant 168, tackifier rosin glyceride, and antioxidant RD on the top of the roller; then start heating,...

Embodiment 2

[0048] The thermally conductive adhesive contains the following components in parts by weight:

[0049]

[0050] (1) After the graphite / carbon black is compounded, dried at 200℃ for 1 hour to remove water and volatile solvent impurities to obtain a graphite / carbon black compound thermally conductive filler; then graphite / carbon black compound thermally conductive filler and oxidation Aluminium and ceramic powder are compounded to obtain a mixed thermal conductive filler containing graphite and carbon black;

[0051] (2) Roll the natural rubber on an open mill with a roller spacing of 7mm and a roll time of 20min; add part of the mixed thermally conductive filler prepared in step (1) to the polyisobutylene, stir evenly, and then apply to the open mill Above the gap between the two rollers of the machine, and keep an appropriate amount of accumulated glue;

[0052] (3) Coat antioxidant 264, tackifier C5 tackifying resin, and antioxidant DFC-34 on the top of the roller; then start heat...

Embodiment 3

[0054] The thermally conductive adhesive contains the following components in parts by weight:

[0055]

[0056] (1) After the graphite / carbon black is compounded, it is dried at 170℃ for 1.5 hours to remove water and volatile solvent impurities to obtain a graphite / carbon black compound thermally conductive filler; then graphite / carbon black compound thermally conductive filler and Zinc oxide and ceramic powder are compounded to obtain a mixed thermal conductive filler containing graphite and carbon black;

[0057] (2) The EPDM rubber is wrapped and rolled on an open mill with a roller spacing of 3mm and a wrapping time of 15min; part of the mixed thermally conductive filler prepared in step (1) is added to the polyisobutylene, stirred evenly, and then coated Go to the top of the gap between the two rollers of the mill, and keep a proper amount of accumulated glue;

[0058] (3) Coat antioxidant 1010, C5 tackifying resin, rosin glyceride, and antioxidant RD on the top of the roller;...

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Abstract

The invention relates to a macromolecular heat conducting composite material, in particular to a heat conducting adhesive and a preparation method and application thereof. The heat conducting adhesive is made of, by weight, 60-100 parts of softener, 20-60 parts of rubber flexibilizer, 50-150 parts of heat conducting filler, 2-10 parts of tackifier, 0.2-5 parts of antioxidant and 0.2-5 parts of antiager. The preparation method includes the steps: rolling the rubber flexibilizer, sequentially adding the softener, the heat conducting adhesive, the tackifier, the antioxidant and the antiager, and mixing for 1-2h at the temperature of 80-150 DEG C to obtain the heat conducting adhesive. The heat conducting adhesive has the advantages of freeness of curing, convenience in processing, excellent adhesion performance, high heat conductivity and the like. Close adhesion of devices can be realized only by application of a proper pressure at the normal temperature, and the heat conducting adhesive is cheap and environment friendly.

Description

Technical field [0001] The invention relates to a polymer thermally conductive composite material, in particular to a thermally conductive adhesive and a preparation method and application thereof. Background technique [0002] With the increasing popularity of electronics and electrical appliances, people have higher and higher requirements for their performance and lifespan. The biggest impact on the performance and life of electronic appliances is the heat dissipation of electronic and electrical components. The current research direction is mainly to use thermal conductive adhesive technology to solve it. As a thermal conductive adhesive for bonding and packaging materials for electronic appliances, it has played an inestimable role in heat dissipation. It can make the heat sink and the surface of the heat source come into close contact, quickly dissipate the heat, and greatly improve the gap between the component and the heat sink. The heat transfer efficiency. The current...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J123/20C09J107/00C09J123/16C09J123/22C09J11/04C09J11/06C09J11/08C09J9/00
Inventor 胡继文李登峰林树东涂园园廖乾勇
Owner 国科广化(南雄)新材料研究院有限公司
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